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 Freescale Semiconductor, Inc.
Technical Data
DSP56362/D Rev. 3, 02/2004 24-Bit Audio Digital Signal Processor
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Motorola designed the DSP56362 to support digital audio applications requiring digital audio compression and decompression, sound field processing, acoustic equalization, and other digital audio algorithms. The DSP56362 uses the high performance, single-clock-per-cycle DSP56300 core family of programmable CMOS digital signal processors (DSPs) combined with the audio signal processing capability of the Motorola SymphonyTM DSP family, as shown in Figure 1. This design provides a two-fold performance increase over Motorola's popular Symphony family of DSPs while retaining code compatibility. Significant architectural enhancements include a barrel shifter, 24-bit addressing, instruction cache, and direct memory access (DMA). The DSP56362 offers 100 million instructions per second (MIPS) using an internal 100 MHz clock at 3.3 V.
2 16 12 5
Program RAM/ X Data Instruction RAM Y Data Cache 5632 x 24 RAM 3072 x 24 ROM 5632 x 24 Program ROM 6144 x 24 ROM 30K x 24 6144 x 24 Bootstrap ROM 192 x 24
Triple Timer
DAX (SPDIF)
Host Interface
ESAI
SHI
Memory Expansion Area
PIO_EB
PM_EB
XM_EB
Address Generation Unit Six Channel DMA Unit
YAB XAB PAB DAB
YM_EB
Peripheral Expansion Area
External Address Bus Switch
18 Address
24-Bit DSP56300 Core
DDB YDB XDB PDB GDB
DRAM/SRAM Bus 11 Interface & I - Cache Control Control
Internal Data Bus Switch
EXTAL
External Data Bus Switch
24 Data
Clock Generator PLL
Program Interrupt Controller
Program Decode Controller MODA/IRQA MODB/IRQB MODC/IRQC MODD/IRQD
Program Address Generator
CLKOUT
Data ALU 24 x 24 + 56 56-bit MAC Two 56-bit Accumulators 56-bit Barrel Shifter
Power Mngmnt.
6
JTAG OnCE
RESET PINIT/NMI
AA0456G
Figure 1 DSP56362 Block Diagram
This document contains information on a new product. Specifications and information herein are subject to change without notice.
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SIGNAL/CONNECTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 PACKAGING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 DESIGN CONSIDERATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 ORDERING INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 POWER CONSUMPTION BENCHMARK . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1 IBIS MODEL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1 INDEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . INDEX-I
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FOR TECHNICAL ASSISTANCE:
Telephone: Email: Internet:
1-800-521-6274 dsphelp@dsp.sps.mot.com http://www.motorola-dsp.com
Data Sheet Conventions
This data sheet uses the following conventions:
OVERBAR "asserted" "deasserted" Examples: Used to indicate a signal that is active when pulled low (For example, the RESET pin is active when low.) Means that a high true (active high) signal is high or that a low true (active low) signal is low Means that a high true (active high) signal is low or that a low true (active low) signal is high Signal/Symbol PIN PIN PIN PIN
Note:
Logic State True False True False
Signal State Asserted Deasserted Asserted Deasserted
Voltage* VIL/VOL VIH/VOH VIH/VOH VIL/VOL
*Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.
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OVERVIEW
FEATURES
* Multimode, multichannel decoder software functionality - - - Dolby Digital and Pro Logic MPEG2 5.1 DTS Bass management
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- *
Digital audio post-processing capabilities - - - - 3D Virtual surround sound Lucasfilm THX5.1 Soundfield processing Equalization
*
Digital Signal Processing Core - - - - 100 MIPS with a 100 MHz clock at 3.3 V +/- 5% Object code compatible with the DSP56000 core Highly parallel instruction set Data arithmetic logic unit (ALU) * * * * - * * * * * * - * * Fully pipelined 24 x 24-bit parallel multiplier-accumulator (MAC) 56-bit parallel barrel shifter (fast shift and normalization; bit stream generation and parsing) Conditional ALU instructions 24-bit or 16-bit arithmetic support under software control Position independent code (PIC) support Addressing modes optimized for DSP applications (including immediate offsets) On-chip instruction cache controller On-chip memory-expandable hardware stack Nested hardware DO loops Fast auto-return interrupts Six DMA channels supporting internal and external accesses One-, two-, and three- dimensional transfers (including circular buffering)
Program control unit (PCU)
Direct memory access (DMA)
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Overview Features
* * - * * * - * * * * - - - - - End-of-block-transfer interrupts Triggering from interrupt lines and all peripherals Software programmable PLL-based frequency synthesizer for the core clock Allows change of low-power divide factor (DF) without loss of lock Output clock with skew elimination On-Chip Emulation (OnCE`) module Joint Action Test Group (JTAG) test access port (TAP) Address trace mode reflects internal program RAM accesses at the external port
Phase-locked loop (PLL)
Hardware debugging support
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On-Chip Memories Modified Harvard architecture allows simultaneous access to program and data memories 30720 x 24-bit on-chip program ROM1 (disabled in 16-bit compatibility mode) 6144 x 24-bit on-chip X-data ROM1 6144 x 24-bit on-chip Y-data ROM1 Program RAM, instruction cache, X data RAM, and Y data RAM sizes are programmable
.
Instruction Cache Disabled Enabled Disabled Enabled - * - - - - - * -
Switch Mode Disabled Disabled Enabled Enabled
Program RAM Size 3072 x 24-bit 2048 x 24-bit 5120 x 24-bit 4096 x 24-bit
Instruction Cache Size 0 1024 x 24-bit 0 1024 x 24-bit
X Data RAM Size 5632 x 24-bit 5632 x 24-bit 5632 x 24-bit 5632 x 24-bit
Y Data RAM Size 5632 x 24-bit 5632 x 24-bit 3584 x 24-bit 3584 x 24-bit
192 x 24-bit bootstrap ROM (disabled in sixteen-bit compatibility mode) Data memory expansion to 256K x 24-bit word memory for P, X, and Y memory using SRAM. Data memory expansion to 16M x 24-bit word memory for P, X, and Y memory using DRAM. External memory expansion port( twenty-four data pins for high speed external memory access allowing for a large number of external accesses per sample) Chip select logic for glueless interface to SRAMs On-chip DRAM controller for glueless interface to DRAMs Enhanced serial audio interface (ESAI) includes: * * * Six serial data lines, 4 selectable as receive or transmit and 2 transmit only. Master or slave capability I2S, Sony, AC97, and other audio protocol implementations
Off-Chip Memory Expansion
Peripheral and Support Circuits
1.These ROMs may be factory programmed with data or programs provided by the application developer.
2
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Overview Documentation
- Serial host interface (SHI) features: * * * * - - - - SPI protocol with multi-master capability I2C protocol with single-master capability Ten-word receive FIFO Support for 8-, 16-, and 24-bit words.
Byte-wide parallel host interface (HDI08) with DMA support DAX features one serial transmitter capable of supporting S/PDIF, IEC958, IEC1937, CP-340, and AES/EBU digital audio formats; alternate configuration supports up to two GPIO lines Triple timer module with single external interface or GPIO line On-chip peripheral registers are memory mapped in data memory space Very low-power (3.3 V) CMOS design Wait and stop low-power standby modes Fully-static logic, operation frequency down to 0 Hz (dc) Optimized power management circuitry (instruction-dependent, peripheral-dependent, and mode-dependent)
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*
Reduced Power Dissipation - - - -
Package
* 144-pin plastic thin quad flat pack (LQFP) surface-mount package
DOCUMENTATION
Table 1 lists the documents that provide a complete description of the DSP56362 and are required to design properly with the part. Documentation is available from a local Motorola distributor, a Motorola semiconductor sales office, a Motorola Literature Distribution Center, or through the Motorola DSP home page on the Internet (the source for the latest information).
Table 1
Document Name DSP56300 Family Manual
DSP56362 Documentation
Description Order Number DSP56300FM/AD
Detailed description of the 56000-family architecture and the 24-bit core processor and instruction set Detailed description of memory, peripherals, and interfaces
DSP56362 User's Manual
DSP56362UM/AD DSP56362/D
DSP56362 Advance Information Electrical and timing specifications; pin and package descriptions There is also a product brief for this chip. DSP56362 Product Brief Brief description of the chip
DSP56362P/D
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SECTION 1 SIGNAL/CONNECTION DESCRIPTIONS
SIGNAL GROUPINGS
The input and output signals of the DSP56362 are organized into functional groups, which are listed in Table 1-1 and illustrated in Figure 1-1.
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The DSP56362 is operated from a 3.3 V supply; however, some of the inputs can tolerate 5 V. A special notice for this feature is added to the signal descriptions of those inputs.
Table 1-1 DSP56362 Functional Signal Groupings
Functional Group Power (VCC) Ground (GND) Clock and PLL Address bus Data bus Bus control Interrupt and mode control HDI08 SHI ESAI Digital audio transmitter (DAX) Timer JTAG/OnCE Port Port C3 Port D4 Port B2 Port A1 Number of Signals 20 19 4 18 24 11 5 16 5 12 2 1 6 Detailed Description Table 1-2 Table 1-3 Table 1-4 Table 1-5 Table 1-6 Table 1-7 Table 1-8 Table 1-9 Table 1-10 Table 1-11 Table 1-12 Table 1-13 Table 1-14
Port A is the external memory interface port, including the external address bus, data bus, and control signals. Port B signals are the GPIO port signals which are multiplexed with the HDI08 signals. Port C signals are the GPIO port signals which are multiplexed with the ESAI signals. Port D signals are the GPIO port signals which are multiplexed with the DAX signals.
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Signal/Connection Descriptions Signal Groupings
DSP56362
VCCP VCCQH VCCQL VCCA VCCD VCCC VCCH VCCS
GNDP
3 4 3 4 2 2
Power Inputs: PLL External I/O Internal Logic Address Bus Data Bus Bus Control HDI08 SHI/ESAI/DAX/Timer Grounds: PLL PLL Internal Logic Address Bus Data Bus Bus Control HDI08 SHI/ESAI/DAX/Timer
8 Host Interface (HDI08) Port1
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GNDQ GNDA GNDD GNDC GNDH GNDS EXTAL CLKOUT PCAP PINIT/NMI
GNDP1
4 4 4 2 2
NonMultiplexed Bus H0-H7 HA0 HA1 HA2 HCS/HCS Single DS HRW HDS/HDS Single HR HOREQ/HOREQ HACK/HACK SPI Mode MOSI SS MISO SCK HREQ
Multiplexed Bus HAD0-HAD7 HAS/HAS HA8 HA9 HA10 Double DS HRD/HRD HWR/HWR Double HR HTRQ/HTRQ HRRQ/HRRQ
Port B GPIO PB0-PB7 PB8 PB9 PB10 PB13 PB11 PB12 PB14 PB15
Serial Host Interface (SHI)
I2C Mode HA0 HA2 SDA SCL HREQ Port C GPIO PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PC8 PC9 PC10 PC11 Port D GPIO PD0 PD1 Timer GPIO TIO0
Clock and PLL
Port A
A0-A17 D0-D23 AA0-AA3/ RAS0-RAS3 CAS RD WR TA BR BG BB MODA/IRQA MODB/IRQB MODC/IRQC MODD/IRQD RESET Notes: 1. 18 24 External Address Bus External Data Bus External Bus Control Digital Audio Transmitter (DAX)2 Timer 02 Interrupt/ Mode Control Enhanced Serial Audio Interface (ESAI)2
4
SCKR FSR HCKR SCKT FST HCKT SDO5/SDI0 SDO4/SDI1 SDO3/SDI2 SDO2/SDI3 SDO1 SDO0
ACI ADO TIO0
2.
TCK TDI TDO TMS TRST AA0601 DE The HDI08 port supports a nonmultiplexed or a multiplexed bus, single or double data strobe (DS), and single or double host request (HR) configurations. Since each of these modes is configured independently, any combination of these modes is possible. These HDI08 signals can also be configured alternately as GPIO signals (PB0-PB15). Signals with dual designations (e.g., HAS/HAS) have configurable polarity. The ESAI signals are multiplexed with the port C GPIO signals (PC0-PC11). The DAX signals are multiplexed with the Port D GPIO signals (PD0-PD1). The timer 0 signal can be configured alternately as the timer GPIO signal (TIO0). JTAG/ OnCE Port
Figure 1-1 Signals Identified by Functional Group
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Signal/Connection Descriptions Power
POWER
Table 1-2 Power Inputs
Power Name VCCP Description PLL Power--VCCP is VCC dedicated for PLL use. The voltage should be wellregulated and the input should be provided with an extremely low impedance path to the VCC power rail. There is one VCCP input. Quiet Core (Low) Power--VCCQL is an isolated power for the core processing logic. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There are four VCCQ inputs. Quiet External (High) Power--VCCQH is a quiet power source for I/O lines. This input must be tied externally to all other chip power inputs. The user must provide adequate decoupling capacitors. There are three VCCQH inputs. Address Bus Power--VCCA is an isolated power for sections of the address bus I/ O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There are three VCCA inputs. Data Bus Power--VCCD is an isolated power for sections of the data bus I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There are four VCCD inputs. Bus Control Power--VCCC is an isolated power for the bus control I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There are two VCCC inputs. Host Power--VCCH is an isolated power for the HDI08 I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There is one VCCH input. SHI, ESAI, DAX, and Timer Power--VCCS is an isolated power for the SHI, ESAI, DAX, and Timer I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. There are two VCCS inputs.
VCCQL (4)
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VCCQH (3)
VCCA (3)
VCCD (4)
VCCC (2)
VCCH
VCCS (2)
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Signal/Connection Descriptions Ground
GROUND
Table 1-3 Grounds
Ground Name Description PLL Ground--GNDP is a ground dedicated for PLL use. The connection should be provided with an extremely low-impedance path to ground. VCCP should be bypassed to GNDP by a 0.47 F capacitor located as close as possible to the chip package. There is one GNDP connection. PLL Ground 1--GNDP1 is a ground dedicated for PLL use. The connection should be provided with an extremely low-impedance path to ground. There is one GNDP1 connection. Quiet Ground--GNDQ is an isolated ground for the internal processing logic. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There are four GNDQ connections. Address Bus Ground--GNDA is an isolated ground for sections of the address bus I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There are four GNDA connections. Data Bus Ground--GNDD is an isolated ground for sections of the data bus I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There are four GNDD connections. Bus Control Ground--GNDC is an isolated ground for the bus control I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There are two GNDC connections. Host Ground--GNDH is an isolated ground for the HDI08 I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There is one GNDH connection. SHI, ESAI, DAX, and Timer Ground--GNDS is an isolated ground for the SHI, ESAI, DAX, and Timer I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. There are two GNDS connections.
GNDP
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GNDP1
GNDQ (4)
GNDA (4)
GNDD (4)
GNDC (2)
GNDH
GNDS (2)
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Signal/Connection Descriptions Clock and PLL
CLOCK AND PLL
Table 1-4 Clock and PLL Signals
Signal Name Type State during Reset Signal Description External Clock Input--An external clock source must be connected to EXTAL in order to supply the clock to the internal clock generator and PLL. This input cannot tolerate 5V. Clock Output--CLKOUT provides an output clock synchronized to the internal core clock phase. If the PLL is enabled and both the multiplication and division factors equal one, then CLKOUT is also synchronized to EXTAL. If the PLL is disabled, the CLKOUT frequency is half the frequency of EXTAL. CLKOUT is not functional at frequencies of 100 MHz and above. PLL Capacitor--PCAP is an input connecting an off-chip capacitor to the PLL filter. Connect one capacitor terminal to PCAP and the other terminal to VCCP. If the PLL is not used, PCAP may be tied to VCC, GND, or left floating. PLL Initial/Non maskable Interrupt--During assertion of RESET, the value of PINIT/NMI is written into the PLL Enable (PEN) bit of the PLL control register, determining whether the PLL is enabled or disabled. After RESET deassertion and during normal instruction processing, the PINIT/NMI Schmitttrigger input is a negative-edge-triggered non maskable interrupt (NMI) request internally synchronized to CLKOUT. PINIT/NMI cannot tolerate 5 V.
EXTAL
Input
Input
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CLKOUT
Output
Chip-driven
PCAP
Input
Input
PINIT/ NMI
Input
Input
EXTERNAL MEMORY EXPANSION PORT (PORT A)
When the DSP56362 enters a low-power standby mode (stop or wait), it releases bus mastership and tristates the relevant port A signals: A0-A17, D0-D23, AA0/RAS0-AA3/RAS3, RD, WR, BB, CAS.
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Signal/Connection Descriptions External Memory Expansion Port (Port A)
External Address Bus
Table 1-5 External Address Bus Signals
Signal Name Type State during Reset Signal Description Address Bus--When the DSP is the bus master, A0-A17 are active-high outputs that specify the address for external program and data memory accesses. Otherwise, the signals are tri-stated. To minimize power dissipation, A0-A17 do not change state when external memory spaces are not being accessed.
A0-A17
Output
Tri-stated
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External Data Bus
Table 1-6 External Data Bus Signals
Signal Name Type State during Reset Signal Description Data Bus--When the DSP is the bus master, D0-D23 are active-high, bidirectional input/ outputs that provide the bidirectional data bus for external program and data memory accesses. Otherwise, D0-D23 are tri-stated.
D0-D23
Input/Output
Tri-stated
External Bus Control
Table 1-7 External Bus Control Signals
Signal Name Type State during Reset Signal Description Address Attribute or Row Address Strobe--When defined as AA, these signals can be used as chip selects or additional address lines. When defined as RAS, these signals can be used as RAS for DRAM interface. These signals are can be tri-stated outputs with programmable polarity.
AA0-AA3/ RAS0- RAS3
Output
Tri-stated
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Signal/Connection Descriptions External Memory Expansion Port (Port A) Table 1-7 External Bus Control Signals (Continued)
Signal Name Type State during Reset Signal Description Column Address Strobe--When the DSP is the bus master, CAS is an active-low output used by DRAM to strobe the column address. Otherwise, if the bus mastership enable (BME) bit in the DRAM control register is cleared, the signal is tri-stated. Read Enable--When the DSP is the bus master, RD is an active-low output that is asserted to read external memory on the data bus (D0-D23). Otherwise, RD is tristated. Write Enable--When the DSP is the bus master, WR is an active-low output that is asserted to write external memory on the data bus (D0-D23). Otherwise, the signals are tri-stated. Transfer Acknowledge--If the DSP56362 is the bus master and there is no external bus activity, or the DSP56362 is not the bus master, the TA input is ignored. The TA input is a data transfer acknowledge (DTACK) function that can extend an external bus cycle indefinitely. Any number of wait states (1, 2. . .infinity) may be added to the wait states inserted by the BCR by keeping TA deasserted. In typical operation, TA is deasserted at the start of a bus cycle, is asserted to enable completion of the bus cycle, and is deasserted before the next bus cycle. The current bus cycle completes one clock period after TA is asserted synchronous to CLKOUT. The number of wait states is determined by the TA input or by the bus control register (BCR), whichever is longer. The BCR can be used to set the minimum number of wait states in external bus cycles. In order to use the TA functionality, the BCR must be programmed to at least one wait state. A zero wait state access cannot be extended by TA deassertion, otherwise improper operation may result. TA can operate synchronously or asynchronously, depending on the setting of the TAS bit in the operating mode register (OMR). TA functionality may not be used while performing DRAM type accesses, otherwise improper operation may result.
CAS
Output
Tri-stated
RD
Output
Tri-stated
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WR
Output
Tri-stated
TA
Input
Ignored Input
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Signal/Connection Descriptions External Memory Expansion Port (Port A) Table 1-7 External Bus Control Signals (Continued)
Signal Name Type State during Reset Signal Description Bus Request--BR is an active-low output, never tristated. BR is asserted when the DSP requests bus mastership. BR is deasserted when the DSP no longer needs the bus. BR may be asserted or deasserted independent of whether the DSP56362 is a bus master or a bus slave. Bus "parking" allows BR to be deasserted even though the DSP56362 is the bus master. (See the description of bus "parking" in the BB signal description.) The bus request hold (BRH) bit in the BCR allows BR to be asserted under software control even though the DSP does not need the bus. BR is typically sent to an external bus arbitrator that controls the priority, parking, and tenure of each master on the same external bus. BR is only affected by DSP requests for the external bus, never for the internal bus. During hardware reset, BR is deasserted and the arbitration is reset to the bus slave state. Bus Grant--BG is an active-low input. BG is asserted by an external bus arbitration circuit when the DSP56362 becomes the next bus master. When BG is asserted, the DSP56362 must wait until BB is deasserted before taking bus mastership. When BG is deasserted, bus mastership is typically given up at the end of the current bus cycle. This may occur in the middle of an instruction that requires more than one external bus cycle for execution. The default mode of operation of this signal requires a setup and hold time referred to CLKOUT. But CLKOUT operation is not guaranteed from 100MHz and up, so the asynchronous bus arbitration must be used for clock frequencies 100MHz and above. The asynchronous bus arbitration is enabled by setting the ABE bit in the OMR register.
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BR
Output
Output (deasserted)
BG
Input
Ignored Input
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Signal/Connection Descriptions External Memory Expansion Port (Port A) Table 1-7 External Bus Control Signals (Continued)
Signal Name Type State during Reset Signal Description Bus Busy--BB is a bidirectional active-low input/output. BB indicates that the bus is active. Only after BB is deasserted can the pending bus master become the bus master (and then assert the signal again). The bus master may keep BB asserted after ceasing bus activity regardless of whether BR is asserted or deasserted. This is called "bus parking" and allows the current bus master to reuse the bus without rearbitration until another device requires the bus. The deassertion of BB is done by an "active pull-up" method (i.e., BB is driven high and then released and held high by an external pull-up resistor). The default mode of operation of this signal requires a setup and hold time referred to CLKOUT. But CLKOUT operation is not guaranteed from 100MHz and up, so the asynchronous bus arbitration must be used for clock frequencies 100MHz and above. The asynchronous bus arbitration is enabled by setting the ABE bit in the OMR register. BB requires an external pull-up resistor.
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BB
Input/ Output
Input
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Signal/Connection Descriptions Interrupt and Mode Control
INTERRUPT AND MODE CONTROL
The interrupt and mode control signals select the chip's operating mode as it comes out of hardware reset. After RESET is deasserted, these inputs are hardware interrupt request lines.
Table 1-8 Interrupt and Mode Control
Signal Name Type State during Reset Signal Description Mode Select A/External Interrupt Request A-- MODA/IRQA is an active-low Schmitt-trigger input, internally synchronized to the DSP clock. MODA/IRQA selects the initial chip operating mode during hardware reset and becomes a level-sensitive or negative-edgetriggered, maskable interrupt request input during normal instruction processing. MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into the OMR when the RESET signal is deasserted. If IRQA is asserted synchronous to CLKOUT, multiple processors can be resynchronized using the WAIT instruction and asserting IRQA to exit the wait state. If the processor is in the stop standby state and the MODA/IRQA pin is pulled to GND, the processor will exit the stop state. This input is 5 V tolerant. Mode Select B/External Interrupt Request B-- MODB/IRQB is an active-low Schmitt-trigger input, internally synchronized to the DSP clock. MODB/IRQB selects the initial chip operating mode during hardware reset and becomes a level-sensitive or negative-edgetriggered, maskable interrupt request input during normal instruction processing. MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into OMR when the RESET signal is deasserted. If IRQB is asserted synchronous to CLKOUT, multiple processors can be re-synchronized using the WAIT instruction and asserting IRQB to exit the wait state. This input is 5 V tolerant.
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MODA/IRQA
Input
Input
MODB/IRQB
Input
Input
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Signal/Connection Descriptions Interrupt and Mode Control Table 1-8 Interrupt and Mode Control (Continued)
Signal Name Type State during Reset Signal Description Mode Select C/External Interrupt Request C-- MODC/IRQC is an active-low Schmitt-trigger input, internally synchronized to the DSP clock. MODC/IRQC selects the initial chip operating mode during hardware reset and becomes a level-sensitive or negative-edgetriggered, maskable interrupt request input during normal instruction processing. MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into OMR when the RESET signal is deasserted. If IRQC is asserted synchronous to CLKOUT, multiple processors can be resynchronized using the WAIT instruction and asserting IRQC to exit the wait state. This input is 5 V tolerant. Mode Select D/External Interrupt Request D-- MODD/IRQD is an active-low Schmitt-trigger input, internally synchronized to the DSP clock. MODD/IRQD selects the initial chip operating mode during hardware reset and becomes a level-sensitive or negative-edgetriggered, maskable interrupt request input during normal instruction processing. MODA, MODB, MODC, and MODD select one of 16 initial chip operating modes, latched into OMR when the RESET signal is deasserted. If IRQD is asserted synchronous to CLKOUT, multiple processors can be resynchronized using the WAIT instruction and asserting IRQD to exit the wait state. This input is 5 V tolerant.
MODC/IRQC
Input
Input
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MODD/IRQD
Input
Input
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-8 Interrupt and Mode Control (Continued)
Signal Name Type State during Reset Signal Description Reset--RESET is an active-low, Schmitt-trigger input. When asserted, the chip is placed in the reset state and the internal phase generator is reset. The Schmitttrigger input allows a slowly rising input (such as a capacitor charging) to reset the chip reliably. If RESET is deasserted synchronous to CLKOUT, exact start-up timing is guaranteed, allowing multiple processors to start synchronously and operate together in "lockstep." When the RESET signal is deasserted, the initial chip operating mode is latched from the MODA, MODB, MODC, and MODD inputs. The RESET signal must be asserted during power up. A stable EXTAL signal must be supplied while RESET is being asserted. This input is 5 V tolerant.
RESET
Input
Input
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HOST INTERFACE (HDI08)
The HDI08 provides a fast, 8-bit, parallel data port that may be connected directly to the host bus. The HDI08 supports a variety of standard buses and can be directly connected to a number of industry standard microcomputers, microprocessors, DSPs, and DMA hardware.
Host Port Configuration
Signal functions associated with the HDI08 vary according to the interface operating mode as determined by the HDI08 port control register (HPCR). See 6.5.6 Host Port Control Register (HPCR) on page Section 6-13 for detailed descriptions of this register and (See Host Interface (HDI08) on page Section 6-1.) for descriptions of the other HDI08 configuration registers.
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-9 Host Interface
Signal Name Type State during Reset Signal Description Host Data--When the HDI08 is programmed to interface a nonmultiplexed host bus and the HI function is selected, these signals are lines 0-7 of the bidirectional, tri-state data bus. Host Address--When HDI08 is programmed to interface a multiplexed host bus and the HI function is selected, these signals are lines 0-7 of the address/data bidirectional, multiplexed, tristate bus. Port B 0-7--When the HDI08 is configured as GPIO, these signals are individually programmable as input, output, or internally disconnected. The default state after reset for these signals is GPIO disconnected. This input is 5 V tolerant. Host Address Input 0--When the HDI08 is programmed to interface a nonmultiplexed host bus and the HI function is selected, this signal is line 0 of the host address input bus. Host Address Strobe--When HDI08 is programmed to interface a multiplexed host bus and the HI function is selected, this signal is the host address strobe (HAS) Schmitt-trigger input. The polarity of the address strobe is programmable, but is configured active-low (HAS) following reset. Port B 8--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant.
H0-H7
Input/ output
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HAD0- HAD7
Input/ output
GPIO disconnected
PB0-PB7
Input, output, or disconnected
Input HA0
Input HAS/ HAS GPIO disconnected
PB8
Input, output, or disconnected
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-9 Host Interface (Continued)
Signal Name Type State during Reset Signal Description Host Address Input 1--When the HDI08 is programmed to interface a nonmultiplexed host bus and the HI function is selected, this signal is line 1 of the host address (HA1) input bus. Host Address 8--When HDI08 is programmed to interface a multiplexed host bus and the HI function is selected, this signal is line 8 of the host address (HA8) input bus. Port B 9--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant. Host Address Input 2--When the HDI08 is programmed to interface a non-multiplexed host bus and the HI function is selected, this signal is line 2 of the host address (HA2) input bus. Host Address 9--When HDI08 is programmed to interface a multiplexed host bus and the HI function is selected, this signal is line 9 of the host address (HA9) input bus. Port B 10--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. PB10 Input, Output, or Disconnected The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant.
Input HA1
Input
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HA8
GPIO disconnected
PB9
Input, output, or disconnected
Input HA2
Input HA9
GPIO disconnected
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-9 Host Interface (Continued)
Signal Name Type State during Reset Signal Description Host Read/Write--When HDI08 is programmed to interface a single-data-strobe host bus and the HI function is selected, this signal is the Host Read/Write (HRW) input. Host Read Data--When HDI08 is programmed to interface a double-data-strobe host bus and the HI function is selected, this signal is the host read data strobe (HRD) Schmitt-trigger input. The polarity of the data strobe is programmable, but is configured as active-low (HRD) after reset. Port B 11--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. PB11 Input, Output, or Disconnected The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant. Host Data Strobe--When HDI08 is programmed to interface a single-data-strobe host bus and the HI function is selected, this signal is the host data strobe (HDS) Schmitt-trigger input. The polarity of the data strobe is programmable, but is configured as active-low (HDS) following reset. Host Write Data--When HDI08 is programmed to interface a double-data-strobe host bus and the HI function is selected, this signal is the host write data strobe (HWR) Schmitt-trigger input. The polarity of the data strobe is programmable, but is configured as active-low (HWR) following reset. Port B 12--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. PB12 Input, output, or disconnected The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant.
Input HRW
Input
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HRD/ HRD
GPIO disconnected
Input HDS/ HDS
Input HWR/ HWR
GPIO disconnected
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-9 Host Interface (Continued)
Signal Name Type State during Reset Signal Description Host Chip Select--When HDI08 is programmed to interface a nonmultiplexed host bus and the HI function is selected, this signal is the host chip select (HCS) input. The polarity of the chip select is programmable, but is configured active-low (HCS) after reset. Host Address 10--When HDI08 is programmed to interface a multiplexed host bus and the HI function is selected, this signal is line 10 of the host address (HA10) input bus. Port B 13--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant. Host Request--When HDI08 is programmed to interface a single host request host bus and the HI function is selected, this signal is the host request (HOREQ) output. The polarity of the host request is programmable, but is configured as active-low (HOREQ) following reset. The host request may be programmed as a driven or open-drain output. Transmit Host Request--When HDI08 is programmed to interface a double host request host bus and the HI function is selected, this signal is the transmit host request (HTRQ) output. The polarity of the host request is programmable, but is configured as active-low (HTRQ) following reset. The host request may be programmed as a driven or open-drain output. Port B 14--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. PB14 Input, output, or disconnected The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant.
Input HCS
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Input HA10
GPIO disconnected
PB13
Input, output, or disconnected
Output HOREQ/ HOREQ
Output HTRQ/ HTRQ GPIO disconnected
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Signal/Connection Descriptions Host Interface (HDI08) Table 1-9 Host Interface (Continued)
Signal Name Type State during Reset Signal Description Host Acknowledge--When HDI08 is programmed to interface a single host request host bus and the HI function is selected, this signal is the host acknowledge (HACK) Schmitttrigger input. The polarity of the host acknowledge is programmable, but is configured as active-low (HACK) after reset. Receive Host Request--When HDI08 is programmed to interface a double host request host bus and the HI function is selected, this signal is the receive host request (HRRQ) output. The polarity of the host request is programmable, but is configured as active-low (HRRQ) after reset. The host request may be programmed as a driven or open-drain output. Port B 15--When the HDI08 is configured as GPIO, this signal is individually programmed as input, output, or internally disconnected. The default state after reset for this signal is GPIO disconnected. This input is 5 V tolerant.
Input HACK/ HACK
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Output HRRQ/ HRRQ GPIO disconnected
PB15
Input, output, or disconnected
MOTOROLA
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Signal/Connection Descriptions Serial Host Interface
SERIAL HOST INTERFACE
The SHI has five I/O signals that can be configured to allow the SHI to operate in either SPI or I2C mode.
Table 1-10 Serial Host Interface Signals
Signal Name Signal Type State during Reset Signal Description
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SCK
Input or output
Tri-stated
SPI Serial Clock--The SCK signal is an output when the SPI is configured as a master and a Schmitt-trigger input when the SPI is configured as a slave. When the SPI is configured as a master, the SCK signal is derived from the internal SHI clock generator. When the SPI is configured as a slave, the SCK signal is an input, and the clock signal from the external master synchronizes the data transfer. The SCK signal is ignored by the SPI if it is defined as a slave and the slave select (SS) signal is not asserted. In both the master and slave SPI devices, data is shifted on one edge of the SCK signal and is sampled on the opposite edge where data is stable. Edge polarity is determined by the SPI transfer protocol. I2C Serial Clock--SCL carries the clock for I2C bus transactions in the I2C mode. SCL is a Schmitttrigger input when configured as a slave and an open-drain output when configured as a master. SCL should be connected to VCC through a pull-up resistor. This signal is tri-stated during hardware, software, and individual reset. Thus, there is no need for an external pull-up in this state. This input is 5 V tolerant.
SCL
Input or output
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Signal/Connection Descriptions Serial Host Interface Table 1-10 Serial Host Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description
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MISO
Input or output
SPI Master-In-Slave-Out--When the SPI is configured as a master, MISO is the master data input line. The MISO signal is used in conjunction with the MOSI signal for transmitting and receiving serial data. This signal is a Schmitt-trigger input when configured for the SPI Master mode, an output when configured for the SPI Slave mode, and tri-stated if configured for the SPI Slave mode when SS is deasserted. An external pull-up resistor is not required for SPI operation. I2C Data and Acknowledge--In I2C mode, SDA is a Schmitt-trigger input when receiving and an opendrain output when transmitting. SDA should be connected to VCC through a pull-up resistor. SDA carries the data for I2C transactions. The data in SDA must be stable during the high period of SCL. The data in SDA is only allowed to change when SCL is low. When the bus is free, SDA is high. The SDA line is only allowed to change during the time SCL is high in the case of start and stop events. A high-to-low transition of the SDA line while SCL is high is a unique situation, and is defined as the start event. A low-to-high transition of SDA while SCL is high is a unique situation defined as the stop event. This signal is tri-stated during hardware, software, and individual reset. Thus, there is no need for an external pull-up in this state. This input is 5 V tolerant.
Tri-stated
SDA
Input or open-drain output
MOTOROLA
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Signal/Connection Descriptions Serial Host Interface Table 1-10 Serial Host Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description
MOSI
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Input or output
SPI Master-Out-Slave-In--When the SPI is configured as a master, MOSI is the master data output line. The MOSI signal is used in conjunction with the MISO signal for transmitting and receiving serial data. MOSI is the slave data input line when the SPI is configured as a slave. This signal is a Schmitt-trigger input when configured for the SPI Slave mode. Tri-stated I2C Slave Address 0--This signal uses a Schmitttrigger input when configured for the I2C mode. When configured for I2C slave mode, the HA0 signal is used to form the slave device address. HA0 is ignored when configured for the I2C master mode. This signal is tri-stated during hardware, software, and individual reset. Thus, there is no need for an external pull-up in this state. This input is 5 V tolerant. SPI Slave Select--This signal is an active low Schmitt-trigger input when configured for the SPI mode. When configured for the SPI Slave mode, this signal is used to enable the SPI slave for transfer. When configured for the SPI master mode, this signal should be kept deasserted (pulled high). If it is asserted while configured as SPI master, a bus error condition is flagged. If SS is deasserted, the SHI ignores SCK clocks and keeps the MISO output signal in the high-impedance state. Tri-stated I2C Slave Address 2--This signal uses a Schmitttrigger input when configured for the I2C mode. When configured for the I2C Slave mode, the HA2 signal is used to form the slave device address. HA2 is ignored in the I2C master mode. This signal is tri-stated during hardware, software, and individual reset. Thus, there is no need for an external pull-up in this state. This input is 5 V tolerant.
HA0
Input
SS
Input
HA2
Input
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Signal/Connection Descriptions Serial Host Interface Table 1-10 Serial Host Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description
Host Request--This signal is an active low Schmitt-trigger input when configured for the master mode but an active low output when configured for the slave mode. When configured for the slave mode, HREQ is asserted to indicate that the SHI is ready for the next data word transfer and deasserted at the first clock pulse of the new data word transfer. When configured for the master mode, HREQ is an input. When asserted by the external slave device, it will trigger the start of the data word transfer by the master. After finishing the data word transfer, the master will await the next assertion of HREQ to proceed to the next transfer. This signal is tri-stated during hardware, software, personal reset, or when the HREQ1-HREQ0 bits in the HCSR are cleared. There is no need for external pull-up in this state. This input is 5 V tolerant.
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HREQ
Input or Output
Tri-stated
MOTOROLA
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Signal/Connection Descriptions Enhanced Serial Audio Interface
ENHANCED SERIAL AUDIO INTERFACE
Table 1-11 Enhanced Serial Audio Interface Signals
Signal Name Signal Type State during Reset Signal Description High Frequency Clock for Receiver--When programmed as an input, this signal provides a high frequency clock source for the ESAI receiver as an alternate to the DSP core clock. When programmed as an output, this signal can serve as a highfrequency sample clock (e.g., for external digital to analog converters [DACs]) or as an additional system clock. Port C 2--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. High Frequency Clock for Transmitter--When programmed as an input, this signal provides a high frequency clock source for the ESAI transmitter as an alternate to the DSP core clock. When programmed as an output, this signal can serve as a high frequency sample clock (e.g., for external DACs) or as an additional system clock. Port C 5--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
HCKR
Input or output
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GPIO disconnected Input, output, or disconnected
PC2
HCKT
Input or output
GPIO disconnected Input, output, or disconnected
PC5
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Signal/Connection Descriptions Enhanced Serial Audio Interface Table 1-11 Enhanced Serial Audio Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description Frame Sync for Receiver--This is the receiver frame sync input/output signal. In the asynchronous mode (SYN=0), the FSR pin operates as the frame sync input or output used by all the enabled receivers. In the synchronous mode (SYN=1), it operates as either the serial flag 1 pin (TEBE=0), or as the transmitter external buffer enable control (TEBE=1, RFSD=1). When this pin is configured as serial flag pin, its direction is determined by the RFSD bit in the RCCR register. When configured as the output flag OF1, this pin will reflect the value of the OF1 bit in the SAICR register, and the data in the OF1 bit will show up at the pin synchronized to the frame sync in normal mode or the slot in network mode. When configured as the input flag IF1, the data value at the pin will be stored in the IF1 bit in the SAISR register, synchronized by the frame sync in normal mode or the slot in network mode. Port C 1--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Frame Sync for Transmitter--This is the transmitter frame sync input/output signal. For synchronous mode, this signal is the frame sync for both transmitters and receivers. For asynchronous mode, FST is the frame sync for the transmitters only. The direction is determined by the transmitter frame sync direction (TFSD) bit in the ESAI transmit clock control register (TCCR). Port C 4--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
FSR
Input or output
Freescale Semiconductor, Inc...
GPIO disconnected
PC1
Input, output, or disconnected
FST
Input or output
GPIO disconnected Input, output, or disconnected
PC4
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Signal/Connection Descriptions Enhanced Serial Audio Interface Table 1-11 Enhanced Serial Audio Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description Receiver Serial Clock--SCKR provides the receiver serial bit clock for the ESAI. The SCKR operates as a clock input or output used by all the enabled receivers in the asynchronous mode (SYN=0), or as serial flag 0 pin in the synchronous mode (SYN=1). When this pin is configured as serial flag pin, its direction is determined by the RCKD bit in the RCCR register. When configured as the output flag OF0, this pin will reflect the value of the OF0 bit in the SAICR register, and the data in the OF0 bit will show up at the pin synchronized to the frame sync in normal mode or the slot in network mode. When configured as the input flag IF0, the data value at the pin will be stored in the IF0 bit in the SAISR register, synchronized by the frame sync in normal mode or the slot in network mode. Port C 0--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Transmitter Serial Clock--This signal provides the serial bit rate clock for the ESAI. SCKT is a clock input or output used by all enabled transmitters and receivers in synchronous mode, or by all enabled transmitters in asynchronous mode. GPIO disconnected PC3 Input, output, or disconnected Port C 3--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
SCKR
Input or output
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GPIO disconnected
PC0
Input, output, or disconnected
SCKT
Input or output
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Signal/Connection Descriptions Enhanced Serial Audio Interface Table 1-11 Enhanced Serial Audio Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description Serial Data Output 5--When programmed as a transmitter, SDO5 is used to transmit data from the TX5 serial transmit shift register. Serial Data Input 0--When programmed as a receiver, SDI0 is used to receive serial data into the RX0 serial receive shift register. Port C 6--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Serial Data Output 4--When programmed as a transmitter, SDO4 is used to transmit data from the TX4 serial transmit shift register. Serial Data Input 1--When programmed as a receiver, SDI1 is used to receive serial data into the RX1 serial receive shift register. Port C 7--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
Output SDO5 Input SDI0
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GPIO disconnected
PC6
Input, output, or disconnected
Output SDO4 Input SDI1 Input, output, or disconnected
GPIO disconnected
PC7
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Signal/Connection Descriptions Enhanced Serial Audio Interface Table 1-11 Enhanced Serial Audio Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description Serial Data Output 3--When programmed as a transmitter, SDO3 is used to transmit data from the TX3 serial transmit shift register. Serial Data Input 2--When programmed as a receiver, SDI2 is used to receive serial data into the RX2 serial receive shift register. Port C 8--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Serial Data Output 2--When programmed as a transmitter, SDO2 is used to transmit data from the TX2 serial transmit shift register. Serial Data Input 3--When programmed as a receiver, SDI3 is used to receive serial data into the RX3 serial receive shift register. Port C 9--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Serial Data Output 1--SDO1 is used to transmit data from the TX1 serial transmit shift register. Output SDO1 PC10 Input, output, or disconnected GPIO disconnected Port C 10--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
Output SDO3 Input SDI2
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GPIO disconnected
PC8
Input, output, or disconnected
Output SDO2 Input SDI3 Input, output, or disconnected
GPIO disconnected
PC9
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Signal/Connection Descriptions Enhanced Serial Audio Interface Table 1-11 Enhanced Serial Audio Interface Signals (Continued)
Signal Name Signal Type State during Reset Signal Description Serial Data Output 0--SDO0 is used to transmit data from the TX0 serial transmit shift register. Output SDO0 PC11 Input, output, or disconnected GPIO disconnected Port C 11--When the ESAI is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
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Signal/Connection Descriptions Digital Audio Interface (DAX)
DIGITAL AUDIO INTERFACE (DAX)
Table 1-12 Digital Audio Interface (DAX) Signals
Signal Name Type State During Reset Signal Description Audio Clock Input--This is the DAX clock input. When programmed to use an external clock, this input supplies the DAX clock. The external clock frequency must be 256, 384, or 512 times the audio sampling frequency (256 x Fs, 384 x Fs or 512 x Fs, respectively). Disconnecte d PD0 Input, output, or disconnected Port D 0--When the DAX is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant. Digital Audio Data Output--This signal is an audio and non-audio output in the form of AES/EBU, CP340 and IEC958 data in a biphase mark format. Disconnecte d Port D 1--When the DAX is configured as GPIO, this signal is individually programmable as input, output, or internally disconnected. The default state after reset is GPIO disconnected. This input is 5 V tolerant.
Input ACI
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Output ADO Input, output, or disconnected
PD1
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Signal/Connection Descriptions Timer
TIMER
Table 1-13 Timer Signal
Signal Name Type State during Reset Signal Description Timer 0 Schmitt-Trigger Input/Output--When timer 0 functions as an external event counter or in measurement mode, TIO0 is used as input. When timer 0 functions in watchdog, timer, or pulse modulation mode, TIO0 is used as output.
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TIO0
Input or Output
Input
The default mode after reset is GPIO input. This can be changed to output or configured as a timer input/output through the timer 0 control/ status register (TCSR0). If TIO0 is not being used, it is recommended to either define it as GPIO output immediately at the beginning of operation or leave it defined as GPIO input but connected it to Vcc through a pull-up resistor in order to ensure a stable logic level at the input. This input is 5 V tolerant.
JTAG/OnCE INTERFACE
Table 1-14 JTAG/OnCETM Interface
Signal Name Type State during Reset Signal Description Test Clock--TCK is a test clock input signal used to synchronize the JTAG test logic. It has an internal pull-up resistor. This input is 5 V tolerant. Test Data Input--TDI is a test data serial input signal used for test instructions and data. TDI is sampled on the rising edge of TCK and has an internal pull-up resistor. This input is 5 V tolerant. Tristated Test Data Output--TDO is a test data serial output signal used for test instructions and data. TDO can be tri-stated and is actively driven in the shift-IR and shift-DR controller states. TDO changes on the falling edge of TCK.
TCK
Input
Input
TDI
Input
Input
TDO
Output
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Signal/Connection Descriptions JTAG/OnCE Interface Table 1-14 JTAG/OnCETM Interface (Continued)
Signal Name Type State during Reset Signal Description Test Mode Select--TMS is an input signal used to sequence the test controller's state machine. TMS is sampled on the rising edge of TCK and has an internal pull-up resistor. This input is 5 V tolerant. Test Reset--TRST is an active-low Schmitt-trigger input signal used to asynchronously initialize the test controller. TRST has an internal pull-up resistor. TRST Input Input The use of TRST is not recommended for new designs. It is recommended to leave TRST disconnected. This input is 5 V tolerant. Debug Event--DE is an open-drain, bidirectional, active-low signal providing, as an input, a means of entering the debug mode of operation from an external command controller, and, as an output, a means of acknowledging that the chip has entered the debug mode. This signal, when asserted as an input, causes the DSP56300 core to finish the current instruction being executed, save the instruction pipeline information, enter the debug mode, and wait for commands to be entered from the debug serial input line. This signal is asserted as an output for three clock cycles when the chip enters the debug mode as a result of a debug request or as a result of meeting a breakpoint condition. The DE has an internal pull-up resistor. This is not a standard part of the JTAG TAP controller. The signal connects directly to the OnCE module to initiate debug mode directly or to provide a direct external indication that the chip has entered the debug mode. All other interface with the OnCE module must occur through the JTAG port. The use of DE is not recommended for new designs. It is recommended to leave DE disconnected. This input is not 5 V tolerant.
TMS
Input
Input
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DE
Input/ Output
Input
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SECTION 2 SPECIFICATIONS
INTRODUCTION
The DSP56362 is fabricated in high density CMOS with Transistor-Transistor Logic (TTL) compatible inputs and outputs. The DSP56362 specifications are preliminary and are from design simulations, and may not be fully tested or guaranteed. Finalized specifications will be published after full characterization and device qualifications are complete.
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MAXIMUM RATINGS
CAUTION
This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, normal precautions should be taken to avoid exceeding maximum voltage ratings. Reliability of operation is enhanced if unused inputs are pulled to an appropriate logic voltage level (e.g., either GND or VCC). The suggested value for a pullup or pulldown resistor is 10 k.
Note:
In the calculation of timing requirements, adding a maximum value of one specification to a minimum value of another specification does not yield a reasonable sum. A maximum specification is calculated using a worst case variation of process parameter values in one direction. The minimum specification is calculated using the worst case for the same parameters in the opposite direction. Therefore, a "maximum" value for a specification will never occur in the same device that has a "minimum" value for another specification; adding a maximum to a minimum represents a condition that can never exist.
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Specifications Thermal Characteristics Table 2-1 Maximum Ratings
Rating1 Supply Voltage All input voltages excluding "5 V tolerant" inputs3 All "5 V tolerant" input voltages3 Current drain per pin excluding VCC and GND Symbol VCC VIN VIN5 I TJ TSTG GND Value1, 2 Unit V V V mA C C
-0.3 to +4.0 -0.3 to VCC + 0.3
GND -0.3 to VCC + 3.95 10
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Operating temperature range Storage temperature
Notes: 1. 2.
-40 to +105 -55 to +125
3.
GND = 0 V, VCC = 3.3 V .16V, TJ = 0C to +100C, CL = 50 pF Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent damage to the device. CAUTION: All "5 V Tolerant" input voltages must not be more than 3.95 V greater than the supply voltage; this restriction applies to "power on", as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. "5 V Tolerant" inputs are inputs that tolerate 5 V.
THERMAL CHARACTERISTICS
Table 2-2 Thermal Characteristics
Characteristic Junction-to-ambient thermal resistance1 Junction-to-case thermal resistance2 Thermal characterization parameter
Notes: 1.
Symbol RJA or JA RJC or JC JT
LQFP Value 45.3 10.1 5.5
Unit C/W C/W C/W
2.
Junction-to-ambient thermal resistance is based on measurements on a horizontal singlesided printed circuit board per SEMI G38-87 in natural convection.(SEMI is Semiconductor Equipment and Materials International, 805 East Middlefield Rd., Mountain View, CA 94043, (415) 964-5111.) Measurements were done with parts mounted on thermal test boards conforming to specification EIA/JESD51-3. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that the cold plate temperature is used for the case temperature.
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Specifications DC Electrical Characteristics
DC ELECTRICAL CHARACTERISTICS
Table 2-3 DC Electrical Characteristics6
Characteristics Supply voltage Input high voltage * D(0:23), BG, BB, TA, DE, and PINIT/ NMI VIH VIHP 2.0 -- VCC VCC + 3.95 VCC + 3.95 -- VCC V Symbol VCC Min 3.14 Typ 3.3 Max 3.46 Unit V
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* MOD1/IRQ1, RESET, and TCK/TDI/ TMS/TRST/ESAI/Timer/HDI08/ SHI(SPI mode) pins * SHI(I2C mode) pins * EXTAL8 Input low voltage * D(0:23), BG, BB, TA, MOD1/IRQ1, RESET, PINIT/NMI * All JTAG/ESAI/Timer/HDI08/ SHI(SPI mode) pins * SHI(I2C mode) pins * EXTAL
8
2.0 1.5
--
VIHX
0.8 VCC
VIL VILP
-0.3 -0.3 -0.3
-- -- --
0.8 0.8 0.3 x VCC 0.2 VCC V
VILX IIN ITSI
-0.3 -10 -10 -- --
Input leakage current High impedance (off-state) input current (@ 2.4 V / 0.4 V) Output high voltage * TTL (IOH = -0.4 mA)5,7 * CMOS (IOH = -10 A)5 Output low voltage * TTL (IOL = 3.0 mA, open-drain pins IOL = 6.7 mA)5,7 * CMOS (IOL = 10 A)5 Internal supply current2: (Operating frequency 100MHz for current measurements) * In Normal mode * In Wait mode
10 10
A A
VOH
2.4 VCC - 0.01
-- -- --
V
VOL
--
--
0.4 0.01
V
ICCI ICCW
-- --
127 7. 5
181 11
mA mA
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Specifications AC Electrical Characteristics Table 2-3 DC Electrical Characteristics6 (Continued)
Characteristics * In Stop mode4 PLL supply current Input capacitance5
Notes: 1. 2.
Symbol ICCS
Min -- --
Typ 100 1 --
Max 150 2.5 10
Unit A mA pF
CIN
--
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3. 4. 5. 6. 7. 8.
Refers to MODA/IRQA, MODB/IRQB, MODC/IRQC, and MODD/IRQD pins Power Consumption Considerations on page 4-3 provides a formula to compute the estimated current requirements in Normal mode. In order to obtain these results, all inputs must be terminated (i.e., not allowed to float). Measurements are based on synthetic intensive DSP benchmarks. The power consumption numbers in this specification are 90% of the measured results of this benchmark. This reflects typical DSP applications. Typical internal supply current is measured with VCC = 3.3V at TJ = 100C. Maximum internal supply current is measured with VCC = 3.46 V at TJ = 100C. Deleted. In order to obtain these results, all inputs, which are not disconnected at Stop mode, must be terminated (i.e., not allowed to float). Periodically sampled and not 100% tested VCC = 3.3 V 5% V; TJ = 0C to +100C, CL = 50 pF This characteristic does not apply to PCAP. Driving EXTAL to the low VIHX or the high VILX value may cause additional power consumption (DC current). To minimize power consumption, the minimum VIHX should be no lower than 0.9 VCC and the maximum VILX should be no higher than 0.1 VCC.
AC ELECTRICAL CHARACTERISTICS
The timing waveforms shown in the AC electrical characteristics section are tested with a VIL maximum of 0.3 V and a VIH minimum of 2.4 V for all pins except EXTAL, which is tested using the input levels shown in Note 6 of the previous table. AC timing specifications, which are referenced to a device input signal, are measured in production with respect to the 50% point of the respective input signal's transition. DSP56362 output levels are measured with the production test machine VOL and VOH reference levels set at 0.4 V and 2.4 V, respectively. Note: Although the minimum value for the frequency of EXTAL is 0 MHz, the device AC test conditions are 15 MHz and rated speed.
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Specifications Internal Clocks
INTERNAL CLOCKS
Table 2-4 Internal Clocks, CLKOUT
Characteristics Internal operation frequency and CLKOUT with PLL enabled Internal operation frequency and CLKOUT with PLL disabled Symbol Min f f -- -- Expression1, 2 Typ (Ef x MF)/ (PDF x DF) Ef/2 Max -- --
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Internal clock and CLKOUT high period * With PLL disabled * With PLL enabled and MF 4 * With PLL enabled and MF > 4 Internal clock and CLKOUT low period * With PLL disabled * With PLL enabled and MF 4 * With PLL enabled and MF > 4 Internal clock and CLKOUT cycle time with PLL enabled Internal clock and CLKOUT cycle time with PLL disabled Instruction cycle time
Notes: 1.
-- TH 0.49 x ETC x PDF x DF/MF 0.47 x ETC x PDF x DF/MF
ETC -- --
-- 0.51 x ETC x PDF x DF/MF 0.53 x ETC x PDF x DF/MF
-- TL 0.49 x ETC x PDF x DF/MF 0.47 x ETC x PDF x DF/MF TC TC ICYC -- -- --
ETC -- -- ETC x PDF x DF/MF 2 x ETC TC
-- 0.51 x ETC x PDF x DF/MF 0.53 x ETC x PDF x DF/MF -- -- --
2.
DF = Division Factor Ef = External frequency ETC = External clock cycle MF = Multiplication Factor PDF = Predivision Factor TC = internal clock cycle See the PLL and Clock Generation section in the DSP56300 Family Manual for a detailed discussion of the PLL.
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Specifications EXTERNAL CLOCK OPERATION
EXTERNAL CLOCK OPERATION
The DSP56362 system clock is an externally supplied square wave voltage source connected to EXTAL(Figure 2-1) .
VIHC EXTAL VILC ETH 2 4 5 CLKOUT With PLL Disabled 7 CLKOUT With PLL Enabled 6a 6b 7
AA0459
Midpoint ETL 3 ETC 5
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Note:
The midpoint is 0.5 (VIHC + VILC).
Figure 2-1 External Clock Timing Table 2-5 Clock Operation 100 and 120 MHz Values
No. Characteristics Frequency of EXTAL (EXTAL Pin Frequency) The rise and fall time of this external clock should be 3 ns maximum. EXTAL input high1, 2 * With PLL disabled (46.7%-53.3% duty cycle6) * With PLL enabled (42.5%-57.5% duty cycle6) 3 EXTAL input low1, 2 * With PLL disabled (46.7%-53.3% duty cycle6) ETL 4.67 ns 4.67 ns -- ETH 4.67 ns 0.00 ns Symbol 100 MHz Min Max 120 MHz Min Max
1
Ef
0
100.0
0
120.0
2
4.25 ns 157.0 s 0.00 ns 157.0 s
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Specifications EXTERNAL CLOCK OPERATION Table 2-5 Clock Operation (Continued) 100 and 120 MHz Values
No. Characteristics * With PLL enabled (42.5%-57.5% duty cycle6) EXTAL cycle time2 4 * With PLL disabled * With PLL enabled CLKOUT change from EXTAL fall with PLL disabled CLKOUT rising edge from EXTAL rising edge with PLL enabled (MF = 1, PDF = 1, Ef > 15 MHz)3,5 6 CLKOUT falling edge from EXTAL rising edge with PLL enabled (MF = 2 or 4, PDF = 1, Ef > 15 MHz)3,5 CLKOUT falling edge from EXTAL falling edge with PLL enabled (MF 4, PDF 1, Ef / PDF > 15 MHz)3,5 Instruction cycle time = ICYC = TC4 See Table 2-5 (46.7%-53.3% duty cycle) * With PLL disabled * With PLL enabled
Notes: 1. 2. 3. 4. 5. 6.
Symbol
100 MHz Min Max
120 MHz Min Max
4.25 ns 157.0 s 4.25 ns 1570.00
ETC
10.00 ns
8.33 ns
--
10.00 ns 273.1 s 8.33 ns 273.1 s 4.3 ns 0.0 ns 11.0 ns 1.8 ns
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5
0.0 ns
1.8 ns
0.0 ns
1.8 ns
7
ICYC
0.00 ns 0.00 ns
8.53 s 8.53 s
Measured at 50% of the input transition The maximum value for PLL enabled is given for minimum VCO and maximum MF. Periodically sampled and not 100% tested The maximum value for PLL enabled is given for minimum VCO and maximum DF. The skew is not guaranteed for any other MF value. The indicated duty cycle is for the specified maximum frequency for which a part is rated. The minimum clock high or low time required for correction operation, however, remains the same at lower operating frequencies; therefore, when a lower clock frequency is used, the signal symmetry may vary from the specified duty cycle as long as the minimum high time and low time requirements are met.
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Specifications Phase Lock Loop (PLL) Characteristics
PHASE LOCK LOOP (PLL) CHARACTERISTICS
Table 2-6 PLL Characteristics
Characteristics VCO frequency when PLL enabled (MF x Ef x 2/PDF) PLL external capacitor (PCAP pin to VCCP) (CPCAP1) 100 MHz Min 30 Max 200 Unit MHz
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* @ MF 4 * @ MF > 4
Note:
(MF x 580) - 100 MF x 830
(MF x 780) - 140 MF x 1470
pF pF
CPCAP is the value of the PLL capacitor (connected between the PCAP pin and VCCP). The recommended value in pF for CPCAP can be computed from one of the following equations: (680 x MF) - 120, for MF 4, or 1100 x MF, for MF > 4.
RESET, STOP, MODE SELECT, AND INTERRUPT TIMING
Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. 8 Characteristics Delay from RESET assertion to all pins at reset value3 Expression -- 100 MHz Min -- Max 26.0 120 MHz Min Max 26.0 Unit ns
Required RESET duration4
9
* Power on, external clock generator, PLL disabled * Power on, external clock generator, PLL enabled * Power on, internal oscillator * During STOP, XTAL disabled (PCTL Bit 16 = 0) * During STOP, XTAL enabled (PCTL Bit 16 = 1) * During normal operation
50 x ETC 1000 x ETC 75000 x ETC 75000 x ETC 2.5 x TC 2.5 x TC
500.0 10.0 750 750 25.0 25.0
-- -- -- -- -- --
416.7 8.3 625 625 20.8 20.8
-- -- -- -- -- --
ns s s s ns ns
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Specifications Reset, Stop, Mode Select, and Interrupt Timing Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. Characteristics Expression 100 MHz Min Max 120 MHz Min Max Unit
Delay from asynchronous RESET deassertion to first external address output 10 (internal reset deassertion)5 * Minimum * Maximum Synchronous reset setup time from RESET deassertion to 11 CLKOUT Transition 1 * Minimum * Maximum Synchronous reset deasserted, delay time from the CLKOUT Transition 1 to the first external 12 address output * Minimum * Maximum 13 Mode select setup time 14 Mode select hold time Minimum edge-triggered 15 interrupt request assertion width Minimum edge-triggered 16 interrupt request deassertion width Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to external memory access address out valid * Caused by first interrupt instruction fetch * Caused by first interrupt instruction execution Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to 18 general-purpose transfer output valid caused by first interrupt instruction execution 4.25 x TC + 2.0 7.25 x TC + 2.0 44.5 74.5 -- -- 37.4 62.4 ns ns 3.25 x TC + 2.0 20.25 TC + 7.5 33.5 -- 30.0 0.0 6.6 -- 207.5 -- -- -- 30.0 0.0 5.5 ns ns ns ns ns 3.25 x TC + 2.0 20.25 TC + 7.50 34.5 -- -- 211.5 29.1 176.2 ns ns
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TC
5.9 --
-- 10.0
ns ns
6.6
--
5.5
ns
17
10 x TC + 5.0
105.0
--
88.3
ns
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Specifications Reset, Stop, Mode Select, and Interrupt Timing Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. Characteristics Expression 100 MHz Min Max 120 MHz Min Max Unit
Delay from address output valid caused by first interrupt 19 instruction execute to interrupt (3.75 + WS) x TC - 10.94 request deassertion for level sensitive fast interrupts1 Delay from RD assertion to interrupt request deassertion 20 for level sensitive fast interrupts1 Delay from WR assertion to interrupt request deassertion for level sensitive fast interrupts1 * DRAM for all WS 21 * SRAM WS =1 * SRAM WS=2,3 * SRAM WS (WS + 3.5) x TC - 10.94 (WS + 3.5) x TC - 10.94 1.75 x TC - 4.0 2.75 x TC - 4.0 0.6 x TC - 0.1 (3.25 + WS) x TC - 10.94
--
(Note 9)
--
(Note 9)
ns
--
(Note 9)
--
(Note 9)
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-- -- -- --
(Note 9) (Note 9) (Note 9) (Note 9)
-- -- -- -- 4.9
(Note 9) (Note 9) (Note 9) (Note 9) --
ns ns ns ns ns
4
Synchronous interrupt setup 22 time from IRQA, IRQB, IRQC, IRQD, NMI assertion to the CLKOUT Transition 2 Synchronous interrupt delay time from the CLKOUT Transition 2 to the first external address output valid caused by 23 the first instruction fetch after coming out of Wait Processing state * Minimum * Maximum 24 Duration for IRQA assertion to recover from Stop state
5.9
9.25 x TC + 1.0 24.75 x TC + 5.0 0.6 x TC - 0.1
93.5 -- 5.9
-- 252.5 --
78.1 -- 4.9
-- 211.2 --
ns ns ns
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Specifications Reset, Stop, Mode Select, and Interrupt Timing Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. Characteristics Delay from IRQA assertion to fetch of first instruction (when exiting Stop)2, 3 * PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is enabled (OMR Bit 6 = 0) 25 * PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not enabled (OMR Bit 6 = 1) * PLL is active during Stop (PCTL Bit 17 = 1) (Implies No Stop Delay) PLC x ETC x PDF + (128 K - PLC/2) x TC 1.3 13.6 -- -- ms Expression 100 MHz Min Max 120 MHz Min Max Unit
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PLC x ETC x PDF + (23.75 0.5) x TC
232.5 12.3 ms ns
--
--
(8.25 0.5) x TC
77.5
87.5
64.6
72.9
ns
Duration of level sensitive IRQA assertion to ensure interrupt service (when exiting Stop)2, 3
* PLL is not active during Stop (PCTL Bit 17 = 0) and Stop 26 delay is enabled (OMR Bit 6 = 0) * PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not enabled (OMR Bit 6 = 1) * PLL is active during Stop (PCTL Bit 17 = 1) (implies no Stop delay)
PLC x ETC x PDF + (128K - PLC/2) x TC PLC x ETC x PDF + (20.5 0.5) x TC
13.6
--
ms
12.3
--
ms
5.5 x TC
55.0
--
45.8
--
ns
Interrupt Requests Rate 27 * HI08, ESAI, SHI, Timer * DMA * IRQ, NMI (edge trigger) * IRQ, NMI (level trigger) 12TC 8TC 8TC 12TC -- -- -- -- 120.0 80.0 80.0 120.0 -- -- -- -- 100.0 66.7 66.7 100.0 ns ns ns ns
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Specifications Reset, Stop, Mode Select, and Interrupt Timing Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. Characteristics Expression 100 MHz Min Max 120 MHz Min Max Unit
DMA Requests Rate 28 * Data read from HI08, ESAI, SHI
6TC 7TC 2TC 3TC
-- -- -- --
60.0 70.0 20.0 30.0
-- -- -- --
50.0 58.0 16.7 25.0
ns ns ns ns
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* Data write to HI08, ESAI, SHI * Timer * IRQ, NMI (edge trigger)
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Specifications Reset, Stop, Mode Select, and Interrupt Timing Table 2-7 Reset, Stop, Mode Select, and Interrupt Timing 100 and 120 MHz Values6
No. Characteristics Expression 100 MHz Min Max 120 MHz Min Max Unit
Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion to 29 external memory (DMA source) access address out valid
Notes: 1.
4.25 x TC + 2.0
44.0
--
37.4
--
ns
When using fast interrupts and IRQA, IRQB, IRQC, and IRQD are defined as level-sensitive, timings 19 through 21 apply to prevent multiple interrupt service. To avoid these timing restrictions, the deasserted Edge-triggered mode is recommended when using fast interrupts. Long interrupts are recommended when using Level-sensitive mode. This timing depends on several settings: For PLL disable, using internal oscillator (PLL Control Register (PCTL) Bit 16 = 0) and oscillator disabled during Stop (PCTL Bit 17 = 0), a stabilization delay is required to assure the oscillator is stable before executing programs. In that case, resetting the Stop delay (OMR Bit 6 = 0) will provide the proper delay. While it is possible to set OMR Bit 6 = 1, it is not recommended and these specifications do not guarantee timings for that case. For PLL disable, using internal oscillator (PCTL Bit 16 = 0) and oscillator enabled during Stop (PCTL Bit 17=1), no stabilization delay is required and recovery time will be minimal (OMR Bit 6 setting is ignored). For PLL disable, using external clock (PCTL Bit 16 = 1), no stabilization delay is required and recovery time will be defined by the PCTL Bit 17 and OMR Bit 6 settings. For PLL enable, if PCTL Bit 17 is 0, the PLL is shutdown during Stop. Recovering from Stop requires the PLL to get locked. The PLL lock procedure duration, PLL Lock Cycles (PLC), may be in the range of 0 to 1000 cycles. This procedure occurs in parallel with the stop delay counter, and stop recovery will end when the last of these two events occurs. The stop delay counter completes count or PLL lock procedure completion. PLC value for PLL disable is 0. The maximum value for ETC is 4096 (maximum MF) divided by the desired internal frequency (i.e., for 100 MHz it is 4096/100 MHz = 40.96s). During the stabilization period, TC, TH, and TL will not be constant, and their width may vary, so timing may vary as well. Periodically sampled and not 100% tested For an external clock generator, RESET duration is measured during the time in which RESET is asserted, VCC is valid, and the EXTAL input is active and valid. For internal oscillator, RESET duration is measured during the time in which RESET is asserted and VCC is valid. The specified timing reflects the crystal oscillator stabilization time after power-up. This number is affected both by the specifications of the crystal and other components connected to the oscillator and reflects worst case conditions. When the VCC is valid, but the other "required RESET duration" conditions (as specified above) have not been yet met, the device circuitry will be in an uninitialized state that can result in significant power consumption and heat-up. Designs should minimize this state to the shortest possible duration. If PLL does not lose lock VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF WS = number of wait states (measured in clock cycles, number of TC) Use expression to compute maximum value. These values depend on the number of wait states (WS) selected
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2.
3. 4.
5. 6. 7. 8. 9.
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Specifications Reset, Stop, Mode Select, and Interrupt Timing
VIH RESET
9 8 All Pins Reset Value
10
A0-A17
First Fetch
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Figure 2-2 Reset Timing
AA0460
CLKOUT 11 RESET 12
A0-A17
AA0461
Figure 2-3 Synchronous Reset Timing
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Specifications Reset, Stop, Mode Select, and Interrupt Timing
First Interrupt Instruction Execution/Fetch
A0-A17
RD 20
WR
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21 17 19
IRQA, IRQB, IRQC, IRQD, NMI
a) First Interrupt Instruction Execution
General Purpose I/O
IRQA, IRQB, IRQC, IRQD, NMI
18
b) General Purpose I/O
Figure 2-4 External Fast Interrupt Timing
AA0462
IRQA, IRQB, IRQC, IRQD, NMI 15 IRQA, IRQB, IRQC, IRQD, NMI
16
AA0463
Figure 2-5 External Interrupt Timing (Negative Edge-Triggered)
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Specifications Reset, Stop, Mode Select, and Interrupt Timing
CLKOUT 22
IRQA, IRQB, IRQC, IRQD, NMI
23 A0-A17
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AA0464
Figure 2-6 Synchronous Interrupt from Wait State Timing
RESET 13 14 MODA, MODB, MODC, MODD, PINIT VIH VIL VIH VIL
VIH
IRQA, IRQB, IRQC, IRQD, NMI
AA0465
Figure 2-7 Operating Mode Select Timing
24 IRQA
25 A0-A17 First Instruction Fetch
Figure 2-8 Recovery from Stop State Using IRQA
AA0466
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Specifications Reset, Stop, Mode Select, and Interrupt Timing
26 IRQA
25 A0-A17
First IRQA Interrupt Instruction Fetch
AA0467
Figure 2-9 Recovery from Stop State Using IRQA Interrupt Service
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A0-A17
DMA Source Address
RD
WR
29
IRQA, IRQB, IRQC, IRQD, NMI
First Interrupt Instruction Execution
AA1104
Figure 2-10 External Memory Access (DMA Source) Timing
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Specifications External Memory Expansion Port (Port A)
EXTERNAL MEMORY EXPANSION PORT (PORT A)
SRAM Timing
Table 2-8 SRAM Read and Write Accesses 100 and 120 MHz3
No. Characteristics Symbol Expression1 (WS + 1) x TC - 4.0 [1 WS 3] tRC, tWC (WS + 2) x TC - 4.0 [4 WS 7] (WS + 3) x TC - 4.0 [WS 8] 100 MHz: 0.25 x TC - 2.0 [WS = 1] 1.25 x TC - 2.0 [WS 4] 100 MHz: 1.5 x TC - 4.0 [WS = 1] 102 WR assertion pulse width tWP All frequencies: WS x TC - 4.0 [2 WS 3] (WS - 0.5) x TC - 4.0 [WS 4] 100 MHz: 0.25 x TC - 2.0 [1 WS 3] 1.25 x TC - 2.0 [4 WS 7] 103 WR deassertion to address not valid tWR 2.25 x TC - 2.0 [WS 8] All frequencies: 1.25 x TC - 4.0 [4 WS 7] 2.25 x TC - 4.0 [WS 8] Address and AA 104 valid to input data valid 100 MHz: tAA, tAC (WS + 0.75) x TC - 7.0 [WS 1]
100 MHz 120 MHz
Min 16.0 56.0 106.0 0.5 10.5 11.0 16.0 31.0 0.5 10.5 20.5 8.5
Max -- -- -- -- -- -- -- ---- -- -- --
Min 12.0 46.0 87.0 0.1 8.4 8.5 12.7 25.2 0.1 8.4 16.7 6.4
Max -- -- -- -- -- -- -- -- -- -- -- --
Unit ns ns ns ns ns ns ns
Freescale Semiconductor, Inc...
Address valid and 100 AA assertion pulse width
Address and AA 101 valid to WR assertion
tAS
ns
18.5
-- 10.5
14.7
-- 7.6 ns
--
2-18
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-8 SRAM Read and Write Accesses 100 and 120 MHz3 (Continued)
No. Characteristics Symbol Expression1 100 MHz: (WS + 0.25) x TC - 7.0 [WS 1]
100 MHz 120 MHz
Min --
Max 5.5
Min --
Max 3.4
Unit
105 RD assertion to input data valid RD deassertion to 106 data not valid (data hold time) 107 Address valid to2 WR deassertion Data valid to WR 108 deassertion (data setup time)
tOE
ns
tOHZ tAW (WS + 0.75) x TC - 4.0 [WS 1]
0.0 13.5 4.5
-- -- --
0.0 10.6 3.2
-- -- --
ns ns ns
Freescale Semiconductor, Inc...
100 MHz: tDS (tDW) (WS - 0.25) x TC - 3.0 [WS 1] 100 MHz: 0.25 x TC - 2.0 [1 WS 3] tDH 1.25 x TC - 2.0 [4 WS 7] 2.25 x TC - 2.0 [WS 8] 0.75 x TC - 3.7 [WS = 1]
0.5 10.5 20.5
-- -- --
0.1 8.4 16.7
-- ns -- --
109
Data hold time from WR deassertion
--
--
2.5
-- ns
110 WR assertion to data active
0.25 x TC - 3.7 [2 WS 3] -0.25 x TC - 3.7 [WS 4] 0.25 x TC + 0.2 [1 WS 3] 1.25 x TC + 0.2 [4 WS 7] 2.25 x TC + 0.2 [WS 8] 1.25 x TC - 4.0 [1 WS 3] 2.25 x TC - 4.0 [4 WS 7] 3.25 x TC - 4.0 [WS 8]
-- --
-- --
0.0 0.0
-- --
--
--
--
2.3 ns
111
WR deassertion to data high impedance
-- --
-- --
-- --
10.6 18.9
--
--
6.4
-- ns
Previous RD 112 deassertion to data active (write)
-- --
-- --
14.7 23.1
-- --
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2-19
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-8 SRAM Read and Write Accesses 100 and 120 MHz3 (Continued)
No. Characteristics Symbol Expression1 100 MHz 0.75 x TC - 4.0 [1 WS 3] 1.75 x TC - 4.0 [4 WS 7] 2.75 x TC - 4.0 [WS 8]
100 MHz 120 MHz
Min 3.5 13.5 23.5 1.0 6.0 21.0 31.0 1.0 8.5 0.5 10.5 20.5 4.5 0
Max -- -- -- -- -- -- -- -- -- -- -- -- -- --
Min 2.2 10.6 18.9 0.2 6.3 16.8 25.2 0.2 6.4 0.1 8.4 16.7 4.1 0.0
Max -- -- -- -- -- -- -- -- -- -- -- -- -- --
Unit
113 RD deassertion time
ns
Freescale Semiconductor, Inc...
100 MHz 0.5 x TC - 4.0 [WS = 1] 114 WR deassertion time TC - 2.0 [2 WS 3] 2.5 x TC - 4.0 [4 WS 7] 3.5 x TC - 4.0 [WS 8] 115 Address valid to RD assertion 116 RD assertion pulse width 100 MHz 0.5 x TC - 4.0 100 MHz (WS + 0.25) x TC -4.0 100 MHz 0.25 x TC - 2.0 [1 WS 3] 1.25 x TC - 2.0 [4 WS 7] 2.25 x TC - 2.0 [WS 8] TA setup before 118 RD or WR deassertion4 119 TA hold after RD or WR deassertion
Notes: 1. 2. 3. 4. 5.
ns
ns ns
117 RD deassertion to address not valid
ns
0.25 x TC + 2.0
ns ns
WS is the number of wait states specified in the BCR. Timings 100, 107 are guaranteed by design, not tested. All timings for 100 MHz are measured from 0.5 * Vcc to .05 * Vcc In the case of TA negation: timing 118 is relative to the deassertion edge of RD or WR were TA to remain active Timing 110, 111, and 112, are not specified for 100 MHz.
2-20
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
100 A0-A17 AA0-AA3
113
116
117
RD 115 WR 105 106
Freescale Semiconductor, Inc...
104 119 TA D0-D23 Data In
AA0468
118
Figure 2-11 SRAM Read Access
100 A0-A17 AA0-AA3 107 101 WR 114 RD 119 TA 108 110 112 D0-D23 Data Out
AA0469
102
103
118
111 109
Figure 2-12 SRAM Write Access
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2-21
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
DRAM Timing
The selection guides provided in Figure 2-13 and Figure 2-16 should be used for primary selection only. Final selection should be based on the timing provided in the following tables. As an example, the selection guide suggests that 4 wait states must be used for 100 MHz operation when using Page Mode DRAM. However, by using the information in the appropriate table, a designer may choose to evaluate whether fewer wait states might be used by determining which timing prevents operation at 100 MHz, running the chip at a slightly lower frequency (e.g., 95 MHz), using faster DRAM (if it becomes available), and control factors such as capacitive and resistive load to improve overall system performance. Note: This figure should be used for primary selection. For exact and detailed timings see the following tables.
Freescale Semiconductor, Inc...
DRAM Type (tRAC ns)
100
80
70
60
50 40 66 80 100 120
Chip Frequency (MHz)
1 Wait States 2 Wait States
3 Wait States 4 Wait States
AA0472
Figure 2-13 DRAM Page Mode Wait States Selection Guide
2-22
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-9 DRAM Page Mode Timings, One Wait State (Low-Power Applications)1, 2, 3
No. Characteristics Page mode cycle time for two consecutive accesses of the same direction Page mode cycle time for mixed (read and write) accesses. Symbol Expression 20 MHz6 Min 2 x TC tPC 1.25 x Tc tCAC tAA tOFF tRSH tRHCP tCAS 0.75 x TC - 4.0 2 x TC - 4.0 0.75 x TC - 4.0 TC - 7.5 1.5 x TC - 7.5 62.5 -- -- 0.0 33.5 96.0 33.5 -- 42.5 67.5 -- -- -- -- 41.7 -- -- 0.0 21.0 62.7 21.0 -- 25.8 42.5 -- -- -- -- ns ns ns ns ns ns 100.0 Max -- 30 MHz6 Min 66.7 Max -- ns Unit
131
Freescale Semiconductor, Inc...
132 CAS assertion to data valid (read) 133 Column address valid to data valid (read) 134 CAS deassertion to data not valid (read hold time) 135 Last CAS assertion to RAS deassertion 136 Previous CAS deassertion to RAS deassertion 137 CAS assertion pulse width Last CAS deassertion to RAS deassertion4 138 * BRW[1:0] = 00 * BRW[1:0] = 01 * BRW[1:0] = 10 * BRW[1:0] = 11 139 CAS deassertion pulse width 140 Column address valid to CAS assertion 141 CAS assertion to column address not valid 142 Last column address valid to RAS deassertion 143 WR deassertion to CAS assertion 144 CAS deassertion to WR assertion 145 CAS assertion to WR deassertion
tCRP
1.75 x TC - 6.0
81.5
-- -- -- -- -- -- -- -- -- -- --
52.3 102.2 135.5 202.1 12.7 12.7 21.0 62.7 21.2 4.6 12.5
-- -- -- -- -- -- -- -- -- -- --
3.25 x TC - 6.0 156.5 4.25 x TC - 6.0 206.5 6.25 x TC - 6.0 306.5
ns
tCP tASC tCAH tRAL tRCS tRCH tWCH
0.5 x TC - 4.0 0.5 x TC - 4.0 0.75 x TC - 4.0 2 x TC - 4.0 0.75 x TC - 3.8 0.25 x TC - 3.7 0.5 x TC - 4.2
21.0 21.0 33.5 96.0 33.7 8.8 20.8
ns ns ns ns ns ns ns
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2-23
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-9 DRAM Page Mode Timings, One Wait State (Low-Power Applications)1, 2, 3 (Continued)
No. Characteristics Symbol tWP tRWL tCWL tDS tDH tWCS tROH tGA tGZ 0.75 x TC - 0.3 0.25 x TC Expression 1.5 x TC - 4.5 1.75 x TC - 4.3 1.75 x TC - 4.3 0.25 x TC - 4.0 0.75 x TC - 4.0 TC - 4.3 1.5 x TC - 4.0 TC - 7.5 20 MHz6 Min 146 WR assertion pulse width 147 Last WR assertion to RAS deassertion 148 WR assertion to CAS deassertion 70.5 83.2 83.2 8.5 33.5 45.7 71.0 -- 0.0 37.2 -- Max -- -- -- -- -- -- -- 42.5 -- -- 12.5 30 MHz6 Min 45.5 54.0 54.0 4.3 21.0 29.0 46.0 -- 0.0 24.7 -- Max -- -- -- -- -- -- -- 25.8 -- -- 8.3 ns ns ns ns ns ns ns ns ns ns ns Unit
Freescale Semiconductor, Inc...
149 Data valid to CAS assertion (Write) 150 CAS assertion to data not valid (write) 151 WR assertion to CAS assertion 152 Last RD assertion to RAS deassertion 153 RD assertion to data valid 154 RD deassertion to data not valid 5 155 WR assertion to data active 156 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5. 6.
The number of wait states for Page mode access is specified in the DCR. The refresh period is specified in the DCR. All the timings are calculated for the worst case. Some of the timings are better for specific cases (e.g., tPC equals 2 x TC for read-after-read or write-after-write sequences). BRW[1:0] (DRAM control register bits) defines the number of wait states that should be inserted in each DRAM out-of-page access. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. Reduced DSP clock speed allows use of Page Mode DRAM with one Wait state. See Figure 2-13.
Table 2-10 DRAM Page Mode Timings, Two Wait States1, 2, 3, 7
No. Characteristics Symbol Expression 80 MHz Min 37.5 34.4 Max -- ns 2.75 x Tc -- Unit
Page mode cycle time for two consecutive accesses of the same 131 direction Page mode cycle time for mixed (read and write) accesses.
3 x TC tPC
2-24
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-10 DRAM Page Mode Timings, Two Wait States1, 2, 3, 7 (Continued)
No. Characteristics Symbol tCAC tAA tOFF tRSH tRHCP tCAS 1.75 x TC - 4.0 3.25 x TC - 4.0 1.5 x TC - 4.0 Expression 1.5 x TC - 6.5 2.5 x TC - 6.5 80 MHz Min -- -- 0.0 17.9 36.6 14.8 Max 12.3 24.8 -- -- -- -- Unit ns ns ns ns ns ns
132 CAS assertion to data valid (read) 133 Column address valid to data valid (read) 134 CAS deassertion to data not valid (read hold time) 135 Last CAS assertion to RAS deassertion 136 Previous CAS deassertion to RAS deassertion 137 CAS assertion pulse width Last CAS deassertion to RAS deassertion5 138 * BRW[1:0] = 00 * BRW[1:0] = 01 * BRW[1:0] = 10 * BRW[1:0] = 11 139 CAS deassertion pulse width 140 Column address valid to CAS assertion 141 CAS assertion to column address not valid 142 Last column address valid to RAS deassertion 143 WR deassertion to CAS assertion 144 CAS deassertion to WR assertion 145 CAS assertion to WR deassertion 146 WR assertion pulse width 147 Last WR assertion to RAS deassertion 148 WR assertion to CAS deassertion 149 Data valid to CAS assertion (write) 150 CAS assertion to data not valid (write) 151 WR assertion to CAS assertion 152 Last RD assertion to RAS deassertion 153 RD assertion to data valid 154 RD deassertion to data not valid 155 WR assertion to data active
6
Freescale Semiconductor, Inc...
tCRP
2.0 x TC - 6.0 3.5 x TC - 6.0 4.5 x TC - 6.0 6.5 x TC - 6.0
19.0 37.8 50.3 75.3 11.6 8.5 17.9 33.5 11.8 2.6 14.6 26.8 30.1 27.0 0.1 17.9 8.2 27.3 -- 0.0 9.1
-- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 15.4 -- --
ns
tCP tASC tCAH tRAL tRCS tRCH tWCH tWP tRWL tCWL tDS tDH tWCS tROH tGA tGZ
1.25 x TC - 4.0 TC - 4.0 1.75 x TC - 4.0 3 x TC - 4.0 1.25 x TC - 3.8 0.5 x TC - 3.7 1.5 x TC - 4.2 2.5 x TC - 4.5 2.75 x TC - 4.3 2.5 x TC - 4.3 0.25 x TC - 3.0 1.75 x TC - 4.0 TC - 4.3 2.5 x TC - 4.0 1.75 x TC - 6.5 0.75 x TC - 0.3
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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2-25
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-10 DRAM Page Mode Timings, Two Wait States1, 2, 3, 7 (Continued)
No. Characteristics Symbol Expression 0.25 x TC 80 MHz Min -- Max 3.1 Unit ns
156 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5.
Freescale Semiconductor, Inc...
6. 7.
The number of wait states for Page mode access is specified in the DCR. The refresh period is specified in the DCR. The asynchronous delays specified in the expressions are valid for DSP56362. All the timings are calculated for the worst case. Some of the timings are better for specific cases (e.g., tPC equals 3 x TC for read-after-read or write-after-write sequences). BRW[1:0] (DRAM Control Register bits) defines the number of wait states that should be inserted in each DRAM out-of-page access. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. There are not any fast enough DRAMs to fit to two wait states Page mode @ 100MHz. See
Figure 2-13.
Table 2-11 DRAM Page Mode Timings, Three Wait States1, 2, 3
No. Characteristics Symbol Expression 100 MHz Min 40.0 35.0 -- -- 0.0 2.5 x TC - 4.0 4.5 x TC - 4.0 2 x TC - 4.0 21.0 41.0 16.0 Max -- ns 3.5 x Tc tCAC tAA tOFF tRSH tRHCP tCAS 100 MHz: 2 x TC - 7.0 100 MHz: 3 x TC - 7.0 -- 13.0 23.0 -- -- -- -- ns ns ns ns ns ns Unit
Page mode cycle time for two consecutive accesses of the same 131 direction Page mode cycle time for mixed (read and write) accesses. 132 CAS assertion to data valid (read) 133 Column address valid to data valid (read) 134 CAS deassertion to data not valid (read hold time) 135 Last CAS assertion to RAS deassertion 136 Previous CAS deassertion to RAS deassertion 137 CAS assertion pulse width Last CAS deassertion to RAS assertion5 138 * BRW[1:0] = 00 * BRW[1:0] = 01 * BRW[1:0] = 10 * BRW[1:0] = 11
4 x TC tPC
tCRP
2.25 x TC - 6.0 3.75 x TC - 6.0 4.75 x TC - 6.0 6.75 x TC - 6.0
-- -- 41.5 61.5
-- -- -- --
ns
2-26
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-11 DRAM Page Mode Timings, Three Wait States1, 2, 3 (Continued)
No. Characteristics Symbol tCP tASC tCAH tRAL tRCS tRCH tWCH tWP tRWL tCWL tDS tDH tWCS tROH tGA tGZ 0.75 x TC - 0.3 0.25 x TC Expression 1.5 x TC - 4.0 TC - 4.0 2.5 x TC - 4.0 4 x TC - 4.0 100 MHz: 1.25 x TC - 4.0 100 MHz: 0.75 x TC - 4.0 2.25 x TC - 4.2 3.5 x TC - 4.5 3.75 x TC - 4.3 3.25 x TC - 4.3 0.5 x TC - 4.0 2.5 x TC - 4.0 1.25 x TC - 4.3 3.5 x TC - 4.0 100 MHz: 2.5 x TC - 7.0 100 MHz Min 11.0 6.0 21.0 36.0 8.5 3.5 18.3 30.5 33.2 28.2 1.0 21.0 8.2 31.0 -- 0.0 7.2 -- -- -- -- -- -- -- -- -- 18.0 -- -- 2.5 Max -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
139 CAS deassertion pulse width 140 Column address valid to CAS assertion 141 CAS assertion to column address not valid 142 Last column address valid to RAS deassertion
Freescale Semiconductor, Inc...
143 WR deassertion to CAS assertion 144 CAS deassertion to WR assertion 145 CAS assertion to WR deassertion 146 WR assertion pulse width 147 Last WR assertion to RAS deassertion 148 WR assertion to CAS deassertion 149 Data valid to CAS assertion (write) 150 CAS assertion to data not valid (write) 151 WR assertion to CAS assertion 152 Last RD assertion to RAS deassertion 153 RD assertion to data valid 154 RD deassertion to data not valid6 155 WR assertion to data active 156 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5. 6.
The number of wait states for Page mode access is specified in the DCR. The refresh period is specified in the DCR. The asynchronous delays specified in the expressions are valid for DSP56362. All the timings are calculated for the worst case. Some of the timings are better for specific cases (e.g., tPC equals 4 x TC for read-after-read or write-after-write sequences). BRW[1:0] (DRAM control register bits) defines the number of wait states that should be inserted in each DRAM out-of page-access. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.
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2-27
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-12 DRAM Page Mode Timings, Four Wait States 100 and 120MHz1, 2, 3
No. Characteristics Symbol Expression
100 MHz 120 MHz
Min Max Min Max 50.0 45.0 -- -- 0.0 -- -- 20.5 30.5 -- -- -- -- 41.7
Unit
Page mode cycle time for two consecutive accesses of the same 131 direction Page mode cycle time for mixed (read and write) accesses. 132 CAS assertion to data valid (read)
5 x TC tPC 4.5 x TC tCAC tAA tOFF tRSH tRHCP tCAS 3.5 x TC - 4.0 6 x TC - 4.0 2.5 x TC - 4.0 100 MHz: 2.75 x TC - 7.0 100 MHz: 3.75 x TC - 7.0
ns 37.5 -- -- 0.0 25.2 46.0 16.8 15.9 24.2 -- -- -- -- ns ns ns ns ns ns
Freescale Semiconductor, Inc...
133 Column address valid to data valid (read) 134 CAS deassertion to data not valid (read hold time) 135 Last CAS assertion to RAS deassertion 136 Previous CAS deassertion to RAS deassertion 137 CAS assertion pulse width Last CAS deassertion to RAS assertion5 138 * BRW[1:0] = 00 * BRW[1:0] = 01 * BRW[1:0] = 10 * BRW[1:0] = 11 139 CAS deassertion pulse width 140 Column address valid to CAS assertion 141 CAS assertion to column address not valid 142 Last column address valid to RAS deassertion 143 WR deassertion to CAS assertion 144 CAS deassertion to WR assertion 145 CAS assertion to WR deassertion 146 WR assertion pulse width
31.0 56.0 21.0
tCRP
2.75 x TC - 6.0 4.25 x TC - 6.0
-- --
-- -- -- -- -- -- -- -- -- -- -- --
-- -- 37.7 54.4 12.7 4.3 25.2 37.7 6.4 6.4 22.9 33.0
-- -- -- -- -- -- -- -- -- -- -- --
ns
5.25 x TC - 6.0 46.5 7.25 x TC - 6.0 66.5 tCP tASC tCAH tRAL tRCS tRCH tWCH tWP 2 x TC - 4.0 TC - 4.0 3.5 x TC - 4.0 5 x TC - 4.0 100 MHz: 1.25 x TC - 4.0 100 MHz: 1.25 x TC - 4.0 4.5 x TC - 4.5 16.0 6.0 31.0 46.0 8.5 8.5
ns ns ns ns ns ns ns ns
3.25 x TC - 4.2 28.3 40.5
2-28
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-12 DRAM Page Mode Timings, Four Wait States 100 and 120MHz1, 2, 3 (Continued)
No. Characteristics Symbol tRWL tCWL tDS tDH tWCS tROH tGA tGZ 0.75 x TC - 0.3 0.25 x TC Expression
100 MHz 120 MHz
Min Max Min Max -- -- -- -- -- -- 25.5 -- -- 2.5 35.3 26.9 0.2 25.2 6.1 33.5 -- 0.0 5.9 -- 2.1 -- -- -- -- -- -- 20.1 --
Unit ns ns ns ns ns ns ns ns ns ns
147 Last WR assertion to RAS deassertion 148 WR assertion to CAS deassertion 149 Data valid to CAS assertion (write) 150 CAS assertion to data not valid (write) 151 WR assertion to CAS assertion 152 Last RD assertion to RAS deassertion 153 RD assertion to data valid 154 RD deassertion to data not valid6 155 WR assertion to data active 156 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5. 6.
4.75 x TC - 4.3 43.2 3.75 x TC - 4.3 33.2 0.5 x TC - 4.0 3.5 x TC - 4.0 1.25 x TC - 4.3 4.5 x TC - 4.0 100 MHz: 3.25 x TC - 7.0 1.0 31.0 8.2 41.0 -- 0.0 7.2 --
Freescale Semiconductor, Inc...
The number of wait states for Page mode access is specified in the DCR. The refresh period is specified in the DCR. The asynchronous delays specified in the expressions are valid for DSP56362. All the timings are calculated for the worst case. Some of the timings are better for specific cases (e.g., tPC equals 3 x TC for read-after-read or write-after-write sequences). BRW[1:0] (DRAM control register bits) defines the number of wait states that should be inserted in each DRAM out-of-page access. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.
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2-29
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
RAS 136 131 CAS 137 140
Row Add Column Address
135
139 141
Column Address
138 142
Last Column Address
Freescale Semiconductor, Inc...
A0-A17
151 145 WR 146 RD 155
144
143 147
148
156 150
149 D0-D23
Data Out Data Out Data Out
Figure 2-14 DRAM Page Mode Write Accesses
AA0473
2-30
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
RAS 136 131 CAS 137 140 A0-A17
Row Add Column Address
135
139 141
Column Address
138 142
Last Column Address
Freescale Semiconductor, Inc...
143 WR 132 133 153 RD 134 154 D0-D23
Data In Data In Data In
152
AA0474
Figure 2-15 DRAM Page Mode Read Accesses
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2-31
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
DRAM Type (tRAC ns)
Note:
This figure should be use for primary selection. For exact and detailed timings see the following tables.
100
80
70
Freescale Semiconductor, Inc...
60
50 40 66 80 100 120 11 Wait States 15 Wait States
Chip Frequency (MHz)
4 Wait States 8 Wait States
AA0475
Figure 2-16 DRAM Out-of-Page Wait States Selection Guide Table 2-13 DRAM Out-of-Page and Refresh Timings, Four Wait States1, 2
No. Characteristics3 Symbol tRC tRAC tCAC tAA tOFF tRP 1.75 x TC - 4.0 Expression 5 x TC 2.75 x TC - 7.5 1.25 x TC - 7.5 1.5 x TC - 7.5 20 MHz4 Min 250.0 -- -- -- 0.0 83.5 Max -- 130.0 55.0 67.5 -- -- 30 MHz4 Min 166.7 -- -- -- 0.0 54.3 Max -- 84.2 34.2 42.5 -- -- ns ns ns ns ns ns Unit
157 Random read or write cycle time 158 RAS assertion to data valid (read) 159 CAS assertion to data valid (read) 160 Column address valid to data valid (read) 161 CAS deassertion to data not valid (read hold time) 162 RAS deassertion to RAS assertion
2-32
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-13 DRAM Out-of-Page and Refresh Timings, Four Wait States1, 2 (Continued)
No. Characteristics3 Symbol tRAS tRSH tCSH tCAS tRCD tRAD tCRP tCP tASR tRAH tASC tCAH tAR tRAL tRCS tRCH tRRH tWCH tWCR Expression 3.25 x TC - 4.0 1.75 x TC - 4.0 2.75 x TC - 4.0 1.25 x TC - 4.0 1.5 x TC 2 1.25 x TC 2 2.25 x TC - 4.0 1.75 x TC - 4.0 1.75 x TC - 4.0 1.25 x TC - 4.0 0.25 x TC - 4.0 1.75 x TC - 4.0 3.25 x TC - 4.0 2 x TC - 4.0 1.5 x TC - 3.8 0.75 x TC - 3.7 0.25 x TC - 3.7 1.5 x TC - 4.2 3 x TC - 4.2 20 MHz4 Min 158.5 83.5 133.5 58.5 73.0 60.5 108.5 83.5 83.5 58.5 8.5 83.5 158.5 96.0 71.2 33.8 8.8 70.8 145.8 Max -- -- -- -- 77.0 64.5 -- -- -- -- -- -- -- -- -- -- -- -- -- 30 MHz4 Min 104.3 54.3 87.7 37.7 48.0 39.7 71.0 54.3 54.3 37.7 4.3 54.3 104.3 62.7 46.2 21.3 4.6 45.8 95.8 Max -- -- -- -- 52.0 43.7 -- -- -- -- -- -- -- -- -- -- -- -- -- ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit
163 RAS assertion pulse width 164 CAS assertion to RAS deassertion 165 RAS assertion to CAS deassertion
Freescale Semiconductor, Inc...
166 CAS assertion pulse width 167 RAS assertion to CAS assertion 168 RAS assertion to column address valid 169 CAS deassertion to RAS assertion 170 CAS deassertion pulse width 171 Row address valid to RAS assertion 172 RAS assertion to row address not valid 173 Column address valid to CAS assertion 174 CAS assertion to column address not valid 175 RAS assertion to column address not valid 176 Column address valid to RAS deassertion 177 WR deassertion to CAS assertion 178 CAS deassertion to WR assertion 179 RAS deassertion to WR assertion 180 CAS assertion to WR deassertion 181 RAS assertion to WR deassertion
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-13 DRAM Out-of-Page and Refresh Timings, Four Wait States1, 2 (Continued)
No. Characteristics3 Symbol tWP tRWL tCWL tDS tDH tDHR tWCS tCSR tRPC tROH tGA tGZ 0.75 x TC - 0.3 0.25 x TC Expression 4.5 x TC - 4.5 4.75 x TC - 4.3 4.25 x TC - 4.3 2.25 x TC - 4.0 1.75 x TC - 4.0 3.25 x TC - 4.0 3 x TC - 4.3 0.5 x TC - 4.0 1.25 x TC - 4.0 4.5 x TC - 4.0 4 x TC - 7.5 20 MHz4 Min 220.5 233.2 208.2 108.5 83.5 158.5 145.7 21.0 58.5 221.0 -- 0.0 37.2 -- Max -- -- -- -- -- -- -- -- -- -- 192.5 -- -- 12.5 30 MHz4 Min 145.5 154.0 137.4 71.0 54.3 104.3 95.7 12.7 37.7 146.0 -- 0.0 24.7 -- Max -- -- -- -- -- -- -- -- -- -- 125.8 -- -- 8.3 ns ns ns ns ns ns ns ns ns ns ns ns ns ns Unit
182 WR assertion pulse width 183 WR assertion to RAS deassertion 184 WR assertion to CAS deassertion 185 Data valid to CAS assertion (write) 186 CAS assertion to data not valid (write) 187 RAS assertion to data not valid (write) 188 WR assertion to CAS assertion 189 CAS assertion to RAS assertion (refresh) 190 RAS deassertion to CAS assertion (refresh) 191 RD assertion to RAS deassertion 192 RD assertion to data valid 193 RD deassertion to data not valid3 194 WR assertion to data active 195 WR deassertion to data high impedance
Notes: 1. 2. 3. 4.
Freescale Semiconductor, Inc...
The number of wait states for out of page access is specified in the DCR. The refresh period is specified in the DCR. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. Reduced DSP clock speed allows use of DRAM out-of-page access with four Wait states. See
Figure 2-16.
2-34
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-14 DRAM Out-of-Page and Refresh Timings, Eight Wait States1, 2
No. Characteristics4 Symbol tRC tRAC tCAC tAA tOFF tRP tRAS tRSH tCSH tCAS tRCD tRAD tCRP tCP tASR tRAH tASC tCAH tAR tRAL tRCS tRCH tRRH tWCH tWCR tWP tRWL tCWL tDS 3.25 x TC - 4.0 5.75 x TC - 4.0 3.25 x TC - 4.0 4.75 x TC - 4.0 2.25 x TC - 4.0 2.5 x TC 2 1.75 x TC 2 4.25 x TC - 4.0 2.75 x TC - 4.0 3.25 x TC - 4.0 1.75 x TC - 4.0 0.75 x TC - 4.0 3.25 x TC - 4.0 5.75 x TC - 4.0 4 x TC - 4.0 2 x TC - 3.8 1.25 x TC - 3.7 0.25 x TC - 3.0 3 x TC - 4.2 5.5 x TC - 4.2 8.5 x TC - 4.5 8.75 x TC - 4.3 7.75 x TC - 4.3 4.75 x TC - 4.0 Expression3 9 x TC 4.75 x TC - 6.5 2.25 x TC - 6.5 3 x TC - 6.5 -- -- 0.0 36.6 67.9 36.6 55.4 24.1
80 MHz
Min Max 112. 5 -- 52.9 21.6 31.0 -- -- -- -- -- --
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
157 Random read or write cycle time 158 RAS assertion to data valid (read) 159 CAS assertion to data valid (read) 160 Column address valid to data valid (read) 161 CAS deassertion to data not valid (read hold time) 162 RAS deassertion to RAS assertion 163 RAS assertion pulse width 164 CAS assertion to RAS deassertion 165 RAS assertion to CAS deassertion 166 CAS assertion pulse width 167 RAS assertion to CAS assertion 168 RAS assertion to column address valid 169 CAS deassertion to RAS assertion 170 CAS deassertion pulse width 171 Row address valid to RAS assertion 172 RAS assertion to row address not valid 173 Column address valid to CAS assertion 174 CAS assertion to column address not valid 175 RAS assertion to column address not valid 176 Column address valid to RAS deassertion 177 WR deassertion to CAS assertion 178 CAS deassertion to WR5 assertion 179 RAS deassertion to WR5 assertion 180 CAS assertion to WR deassertion 181 RAS assertion to WR deassertion 182 WR assertion pulse width 183 WR assertion to RAS deassertion 184 WR assertion to CAS deassertion 185 Data valid to CAS assertion (write)
Freescale Semiconductor, Inc...
29.3 33.3 19.9 23.9 49.1 30.4 36.6 17.9 5.4 36.6 67.9 46.0 21.2 11.9 0.1 33.3 64.6 101. 8 105. 1 92.6 55.4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- --
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2-35
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-14 DRAM Out-of-Page and Refresh Timings, Eight Wait States1, 2 (Continued)
No. Characteristics4 Symbol tDH tDHR tWCS tCSR tRPC tROH tGA tGZ Expression3 3.25 x TC - 4.0 5.75 x TC - 4.0 5.5 x TC - 4.3 1.5 x TC - 4.0 1.75 x TC - 4.0 8.5 x TC - 4.0 7.5 x TC - 6.5 0.0 0.75 x TC - 0.3 0.25 x TC
80 MHz
Min Max 36.6 67.9 64.5 14.8 17.9 102. 3 -- 0.0 9.1 -- -- -- -- -- -- -- 87.3 -- -- 3.1
Unit ns ns ns ns ns ns ns ns ns ns
186 CAS assertion to data not valid (write) 187 RAS assertion to data not valid (write) 188 WR assertion to CAS assertion 189 CAS assertion to RAS assertion (refresh) 190 RAS deassertion to CAS assertion (refresh)
Freescale Semiconductor, Inc...
191 RD assertion to RAS deassertion 192 RD assertion to data valid 193 RD deassertion to data not valid4 194 WR assertion to data active 195 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5.
The number of wait states for out-of-page access is specified in the DCR. The refresh period is specified in the DCR. The asynchronous delays specified in the expressions are valid for DSP56362. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. Either tRCH or tRRH must be satisfied for read cycles.
Table 2-15 DRAM Out-of-Page and Refresh Timings, Eleven Wait States1, 2
No. Characteristics4 Symbol tRC tRAC tCAC tAA tOFF tRP tRAS tRSH tCSH 4.25 x TC - 4.0 7.75 x TC - 4.0 5.25 x TC - 4.0 6.25 x TC - 4.0 Expression3 12 x TC 6.25 x TC - 7.0 3.75 x TC - 7.0 4.5 x TC - 7.0
100 MHz
Min 120.0 -- -- -- 0.0 38.5 73.5 48.5 58.5
Max -- 55.5 30.5 38.0 -- -- -- -- --
Unit ns ns ns ns ns ns ns ns ns
157 Random read or write cycle time 158 RAS assertion to data valid (read) 159 CAS assertion to data valid (read) 160 Column address valid to data valid (read) 161 CAS deassertion to data not valid (read hold time) 162 RAS deassertion to RAS assertion 163 RAS assertion pulse width 164 CAS assertion to RAS deassertion 165 RAS assertion to CAS deassertion
2-36
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-15 DRAM Out-of-Page and Refresh Timings, Eleven Wait States1, 2 (Continued)
No. Characteristics4 Symbol tCAS tRCD tRAD tCRP tCP tASR tRAH tASC tCAH tAR tRAL tRCS tRCH tRRH tWCH tWCR tWP tRWL tCWL tDS tDH tDHR tWCS tCSR tRPC tROH tGA Expression3 3.75 x TC - 4.0 2.5 x TC 4.0 1.75 x TC 4.0 5.75 x TC - 4.0 4.25 x TC - 4.0 4.25 x TC - 4.0 1.75 x TC - 4.0 0.75 x TC - 4.0 5.25 x TC - 4.0 7.75 x TC - 4.0 6 x TC - 4.0 3.0 x TC - 4.0 1.75 x TC - 4.0 0.25 x TC - 3.0 0.25 x TC - 2.0 5 x TC - 4.2 7.5 x TC - 4.2 11.5 x TC - 4.5
100 MHz
Min 33.5 21.0 13.5 53.5 38.5 38.5 13.5 3.5 48.5 73.5 56.0 26.0 13.5 -- 0.5 45.8 70.8 110.5
Max -- 29.0 21.5 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 93.0
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
166 CAS assertion pulse width 167 RAS assertion to CAS assertion 168 RAS assertion to column address valid 169 CAS deassertion to RAS assertion 170 CAS deassertion pulse width
Freescale Semiconductor, Inc...
171 Row address valid to RAS assertion 172 RAS assertion to row address not valid 173 Column address valid to CAS assertion 174 CAS assertion to column address not valid 175 RAS assertion to column address not valid 176 Column address valid to RAS deassertion 177 WR deassertion to CAS assertion 178 CAS deassertion to WR5 assertion 179 RAS deassertion to WR5 assertion 180 CAS assertion to WR deassertion 181 RAS assertion to WR deassertion 182 WR assertion pulse width 183 WR assertion to RAS deassertion 184 WR assertion to CAS deassertion 185 Data valid to CAS assertion (write) 186 CAS assertion to data not valid (write) 187 RAS assertion to data not valid (write) 188 WR assertion to CAS assertion 189 CAS assertion to RAS assertion (refresh) 190 RAS deassertion to CAS assertion (refresh) 191 RD assertion to RAS deassertion 192 RD assertion to data valid
11.75 x TC - 4.3 113.2 10.25 x TC - 4.3 103.2 5.75 x TC - 4.0 5.25 x TC - 4.0 7.75 x TC - 4.0 6.5 x TC - 4.3 1.5 x TC - 4.0 2.75 x TC - 4.0 11.5 x TC - 4.0 10 x TC - 7.0 53.5 48.5 73.5 60.7 11.0 23.5 111.0
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2-37
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-15 DRAM Out-of-Page and Refresh Timings, Eleven Wait States1, 2 (Continued)
No. Characteristics4 Symbol tGZ 0.75 x TC - 0.3 0.25 x TC Expression3
100 MHz
Min 0.0 7.2 --
Max -- -- 2.5
Unit ns ns ns
193 RD deassertion to data not valid4 194 WR assertion to data active 195 WR deassertion to data high impedance
Notes: 1. 2. 3. 4. 5.
Freescale Semiconductor, Inc...
The number of wait states for out-of-page access is specified in the DCR. The refresh period is specified in the DCR. The asynchronous delays specified in the expressions are valid for DSP56362. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. Either tRCH or tRRH must be satisfied for read cycles.
Table 2-16 DRAM Out-of-Page and Refresh Timings, Fifteen Wait States 100 and 120MHz1, 2
No. Characteristics3 Symbol tRC tRAC tCAC tAA tOFF tRP tRAS tRSH tCSH tCAS tRCD tRAD tCRP tCP tASR Expression 16 x TC 8.25 x TC - 5.7 4.75 x TC - 5.7 5.5 x TC - 5.7 0.0 6.25 x TC - 4.0 9.75 x TC - 4.0 6.25 x TC - 4.0 8.25 x TC - 4.0 4.75 x TC - 4.0 3.5 x TC 2 2.75 x TC 2 7.75 x TC - 4.0 6.25 x TC - 4.0 6.25 x TC - 4.0
100 MHz 120 MHz
Min 160.0 -- -- -- 0.0 58.5 93.5 58.5 78.5 43.5 33.0 25.5 73.5 58.5 58.5
Max -- 76.8 41.8 49.3 -- -- -- -- -- -- 37.0 29.5 -- -- --
Min 133.3 -- --
Max -- 63.0 33.9 40.1
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
157 Random read or write cycle time 158 RAS assertion to data valid (read) 159 CAS assertion to data valid (read) 160 Column address valid to data valid (read) 161 CAS deassertion to data not valid (read hold time) 162 RAS deassertion to RAS assertion 163 RAS assertion pulse width 164 CAS assertion to RAS deassertion 165 RAS assertion to CAS deassertion 166 CAS assertion pulse width 167 RAS assertion to CAS assertion 168 RAS assertion to column address valid 169 CAS deassertion to RAS assertion 170 CAS deassertion pulse width 171 Row address valid to RAS assertion
0.0 48.1 77.2 48.1 64.7 35.6 27.2 20.9 60.6 48.1 48.1
-- -- -- -- -- -- 31.2 24.9 -- -- --
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-16 DRAM Out-of-Page and Refresh Timings, Fifteen Wait States 100 and 120MHz1, 2 (Continued)
No. Characteristics3 Symbol tRAH tASC tCAH tAR tRAL tRCS tRCH tRRH tWCH tWCR tWP tRWL tCWL tDS tDH tDHR tWCS tCSR tRPC tROH tGA tGZ 0.75 x TC - 0.3 0.25 x TC Expression 2.75 x TC - 4.0 0.75 x TC - 4.0 6.25 x TC - 4.0 9.75 x TC - 4.0 7 x TC - 4.0 5 x TC - 3.8 1.75 x TC - 3.7 0.25 x TC - 2.0 6 x TC - 4.2 9.5 x TC - 4.2 15.5 x TC - 4.5
100 MHz 120 MHz
Min 23.5 3.5 58.5 93.5 66.0 46.2 13.8 0.5 55.8 90.8 150.5
Max -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 134.3 -- -- 2.5
Min 18.9 2.2 48.1 77.2 54.3 37.9 10.9 0.1 45.8 75.0 124.7 126.9 114.4 68.9 48.1 77.2 74.9 8.5 35.6 125.2 -- 0.0 5.9 --
Max -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 111.0 -- -- 2.1
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
172 RAS assertion to row address not valid 173 Column address valid to CAS assertion 174 CAS assertion to column address not valid
Freescale Semiconductor, Inc...
175 RAS assertion to column address not valid 176 Column address valid to RAS deassertion 177 WR deassertion to CAS assertion 178 CAS deassertion to WR5 assertion 179 RAS deassertion to WR5 assertion 180 CAS assertion to WR deassertion 181 RAS assertion to WR deassertion 182 WR assertion pulse width 183 WR assertion to RAS deassertion 184 WR assertion to CAS deassertion 185 Data valid to CAS assertion (write) 186 CAS assertion to data not valid (write) 187 RAS assertion to data not valid (write) 188 WR assertion to CAS assertion 189 CAS assertion to RAS assertion (refresh) 190 RAS deassertion to CAS assertion (refresh) 191 RD assertion to RAS deassertion 192 RD assertion to data valid 193 RD deassertion to data not valid3 194 WR assertion to data active 195 WR deassertion to data high impedance
15.75 x TC - 4.3 153.2 14.25 x TC - 4.3 138.2 8.75 x TC - 4.0 6.25 x TC - 4.0 9.75 x TC - 4.0 9.5 x TC - 4.3 1.5 x TC - 4.0 4.75 x TC - 4.0 15.5 x TC - 4.0 14 x TC - 5.7 83.5 58.5 93.5 90.7 11.0 43.5 151.0 -- 0.0 7.2 --
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2-39
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A) Table 2-16 DRAM Out-of-Page and Refresh Timings, Fifteen Wait States 100 and 120MHz1, 2 (Continued)
No.
Notes: 1. 2. 3. 4.
Characteristics3
Symbol
Expression
100 MHz
120 MHz
Min
Max
Min
Max
Unit
The number of wait states for out-of-page access is specified in the DCR. The refresh period is specified in the DCR. RD deassertion will always occur after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ. Either tRCH or tRRH must be satisfied for read cycles. 157
Freescale Semiconductor, Inc...
162 RAS 167 169 170 CAS 171 173 168
163 165
162
164
166
174 175 A0-A17
Row Address Column Address
172 177 191 WR 160 159 RD 158 192
176 179
168
193 161
Data In
D0-D23
AA0476
Figure 2-17 DRAM Out-of-Page Read Access
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
157 162 RAS 167 169 168 170 CAS 166 163 165 162
164
Freescale Semiconductor, Inc...
171
173 172 176 174
A0-A17
Row Address 181
Column Address
175 188 WR 182 184 183 RD 180
187 186 185 194 195
D0-D23
Data Out
AA0477
Figure 2-18 DRAM Out-of-Page Write Access
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
157 162 RAS 190 170 CAS 165 163 162
Freescale Semiconductor, Inc...
189 177 WR
AA0478
Figure 2-19 DRAM Refresh Access
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
Synchronous Timings (SRAM)
Table 2-17 External Bus Synchronous Timings (SRAM Access)4
No. Characteristics Expression1, 2 0.25 x TC + 4.0 0.25 x TC
100 MHz
Min Max -- 2.5 4.0 0.0 6.5 -- -- -- -- 6.5 -- 2.5 -- -- 11.5 4.0 9.3
Unit ns ns ns ns ns ns ns ns ns ns ns ns
198 CLKOUT high to address, and AA valid5 199 CLKOUT high to address, and AA invalid5
Freescale Semiconductor, Inc...
200 TA valid to CLKOUT high (setup time) 201 CLKOUT high to TA invalid (hold time) 202 CLKOUT high to data out active 203 CLKOUT high to data out valid 204 CLKOUT high to data out invalid 205 CLKOUT high to data out high impedance 206 Data in valid to CLKOUT high (setup) 207 CLKOUT high to data in invalid (hold) 208 CLKOUT high to RD assertion 209 CLKOUT high to RD deassertion 0.5 x TC + 4.3 [WS = 1 or WS 4] All frequencies: [2 WS 3] 211 CLKOUT high to WR deassertion
Notes: 1. 2. 3. 4. 5.
0.25 x TC 0.25 x TC + 4.0 0.25 x TC 0.25 x TC
2.5 3.3 2.5 -- 4.0 0.0
0.75 x TC + 4.0
8.2 0.0 6.3 1.3 0.0
210 CLKOUT high to WR assertion3
ns 4.3 3.8 ns
WS is the number of wait states specified in the BCR. The asynchronous delays specified in the expressions are valid for DSP56362. If WS > 1, WR assertion refers to the next rising edge of CLKOUT. External bus synchronous timings should be used only for reference to the clock and not for relative timings. T198 and T199 are valid for Address Trace mode if the ATE bit in the OMR is set. Use the status of BR (See T212) to determine whether the access referenced by A0-A23 is internal or external, when this mode is enabled
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2-43
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
CLKOUT 198 A0-A17 AA0-AA3 201 200 TA 211 199
Freescale Semiconductor, Inc...
WR 210 203 D0-D23 202 208 RD 207 206 D0-D23 Data In
AA0479
205 204 Data Out
209
Figure 2-20 Synchronous Bus Timings SRAM 1 WS (BCR Controlled)
2-44
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
CLKOUT 198 A0-A17 AA0-AA3 201 200 TA 211 200 201 199
Freescale Semiconductor, Inc...
WR 210 203 D0-D23 202 208 RD 207 206 D0-D23 Data In
AA0480
205 204 Data Out
209
Figure 2-21 Synchronous Bus Timings SRAM 2 WS (TA Controlled)
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2-45
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
Arbitration Timings
Table 2-18 Arbitration Bus Timings1
No. Characteristics Expression 100 MHz Min Max 1.0 4.0 0.0 4.0 0.0 1.0 1.0 -- 0.25 x TC 0.25 x TC 0.25 x TC 2.5 -- 2.5 4.0 -- -- -- -- 4.0 4.0 4.5 -- 2.5 -- 6.5 7.5 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns
212 CLKOUT high to BR assertion/ deassertion2 213 BG asserted/deasserted to CLKOUT high (setup)
Freescale Semiconductor, Inc...
214 CLKOUT high to BG deasserted/ asserted (hold) 215 BB deassertion to CLKOUT high (input setup) 216 CLKOUT high to BB assertion (input hold) 217 CLKOUT high to BB assertion (output) 218 CLKOUT high to BB deassertion (output) 219 BB high to BB high impedance (output) 220 CLKOUT high to address and controls active 221 CLKOUT high to address and controls high impedance 222 CLKOUT high to AA active 223 CLKOUT high to AA deassertion 224 CLKOUT high to AA high impedance
Notes: 1. 2.
0.25 x TC + 4.0 3.2 0.75 x TC --
The asynchronous delays specified in the expressions are valid for DSP56362. T212 is valid for Address Trace mode when the ATE bit in the OMR is set. BR is deasserted for internal accesses and asserted for external accesses.
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
CLKOUT 212 BR 214 213 BG 216
Freescale Semiconductor, Inc...
215 BB 220 A0-A17 RD, WR
217
222 AA0-AA3
AA0481
Figure 2-22 Bus Acquisition Timings
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2-47
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
CLKOUT 212 BR 214 213 BG 219 218
Freescale Semiconductor, Inc...
BB 221 A0-A17 RD, WR 224 223 AA0-AA3
AA0482
Figure 2-23 Bus Release Timings Case 1 (BRT Bit in OMR Cleared)
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Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
CLKOUT 212 BR 214
213 BG
219
Freescale Semiconductor, Inc...
218 BB 221 A0-A17 RD, WR 224 223 AA0-AA3
Figure 2-24 Bus Release Timings Case 2 (BRT Bit in OMR Set)
AA0483
Table 2-19 Asynchronous Bus Arbitration timing
No. 250 251 Characteristics BB assertion window from BG input negation. Delay from BB assertion to BG assertion Expression 2 .5* Tc + 5 2 * Tc + 5 100 MHz Min -- 20 Max 20 -- Unit ns ns
Comments: 1. Bit 13 in the OMR register must be set to enter Asynchronous Arbitration mode 2. At 100 MHz it is recommended to use Asynchronous Arbitration mode. 3. If Asynchronous Arbitration mode is active, none of the timings in Table 2-19 is required. 4. In order to guarantee timings 250, and 251, it is recommended to assert BG inputs to different 56300 devices (on the same bus) in a non overlap manner as shown in Figure 2-25.
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2-49
Freescale Semiconductor, Inc.
Specifications External Memory Expansion Port (Port A)
BG1
BB 250
BG2
Freescale Semiconductor, Inc...
251
Figure 2-25 Asynchronous Bus Arbitration Timing
BG1
BG2
250+251
Figure 2-26 Asynchronous Bus Arbitration Timing
Background explanation for Asynchronous Bus Arbitration: The asynchronous bus arbitration is enabled by internal synchronization circuits on BG, and BB inputs. These synchronization circuits add delay from the external signal until it is exposed to internal logic. As a result of this delay, a 56300 part may assume mastership and assert BB, for some time after BG is negated. This is the reason for timing 250. Once BB is asserted, there is a synchronization delay from BB assertion to the time this assertion is exposed to other 56300 components which are potential masters on the same bus. If BG input is asserted before that time, a situation of BG asserted, and BB negated, may cause another 56300 component to assume mastership at the same time. Therefore some non-overlap period between one BG input active to another BG input active, is required. Timing 251 ensures that such a situation is avoided.
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Specifications Parallel Host Interface (HDI08) Timing
PARALLEL HOST INTERFACE (HDI08) TIMING
Table 2-20 Host Interface (HDI08) Timing1, 2
No. Characteristics3 Expression TC + 9.9 -- 100 MHz Min Max 19.9 9.9 -- -- Unit ns ns
4 317 Read data strobe assertion width HACK read assertion width 4 318 Read data strobe deassertion width HACK read deassertion width
Freescale Semiconductor, Inc...
Read data strobe deassertion width4 after "Last Data Register" reads5,6, or between two 319 consecutive CVR, ICR, or ISR reads7 HACK deassertion width after "Last Data Register" reads5,6
8 320 Write data strobe assertion width HACK write assertion width
2.5 x TC + 6.6 31.6
--
ns
--
13.2
--
ns
321
Write data strobe deassertion width8 HACK write deassertion width * after ICR, CVR and "Last Data Register" writes5 * after IVR writes, or * after TXH:TXM writes (with HBE=0), or after TXL:TXM writes (with HBE=1) * HAS deassertion to data strobe assertion9
31.6 2.5 x TC + 6.6 16.5 -- -- -- 9.9 0.0 9.9
--
ns
-- -- -- -- ns ns ns
322 HAS assertion width 323 Host data input setup time before write data 8 324 strobe deassertion Host data input setup time before HACK write deassertion Host data input hold time after write data strobe 8 325 deassertion Host data input hold time after HACK write deassertion Read data strobe assertion to output data active 4 326 from high impedance HACK read assertion to output data active from high impedance
4 327 Read data strobe assertion to output data valid HACK read assertion to output data valid
--
3.3
--
ns
--
3.3
--
ns
--
--
24.2
ns
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Specifications Parallel Host Interface (HDI08) Timing Table 2-20 Host Interface (HDI08) Timing1, 2 (Continued)
No. Characteristics3 Expression 100 MHz Min Max Unit
Read data strobe deassertion to output data 4 328 high impedance HACK read deassertion to output data high impedance Output data hold time after read data strobe 4 329 deassertion Output data hold time after HACK read deassertion
--
--
9.9
ns
-- TC +9.9 -- -- -- -- -- --
3.3 19.9 9.9 -- 0.0 4.7 3.3 0 4.7
-- -- -- 19.1 -- -- -- -- -- -- --
ns ns ns ns ns ns ns
Freescale Semiconductor, Inc...
330 HCS assertion to read data strobe deassertion4 331 HCS assertion to write data strobe deassertion8 332 HCS assertion to output data valid 333 HCS hold time after data strobe deassertion9 334 Address (AD7-AD0) setup time before HAS deassertion (HMUX=1) 335 Address (AD7-AD0) hold time after HAS deassertion (HMUX=1) A10-A8 (HMUX=1), A2-A0 (HMUX=0), HR/W setup time before data strobe assertion9 336 * Read * Write 337 A10-A8 (HMUX=1), A2-A0 (HMUX=0), HR/W hold time after data strobe deassertion9 Delay from read data strobe deassertion to host 338 request assertion for "Last Data Register" read4, TC
5, 10
ns
--
3.3 10
ns ns
Delay from write data strobe deassertion to host 339 request assertion for "Last Data Register" 2 x TC write5, 8, 10 Delay from data strobe assertion to host request 340 deassertion for "Last Data Register" read or write (HROD = 0)5, 9, 10 Delay from data strobe assertion to host request 341 deassertion for "Last Data Register" read or5, 9, write (HROD = 1, open drain Host Request)
10, 11
20
--
ns
--
--
19.1
ns
--
--
300. 0
ns
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Freescale Semiconductor, Inc.
Specifications Parallel Host Interface (HDI08) Timing Table 2-20 Host Interface (HDI08) Timing1, 2 (Continued)
No. Characteristics3 Delay from DMA HACK deassertion to HOREQ assertion * For "Last Data Register" read5 2 x TC + 19.1 * For "Last Data Register" write5 * For other cases Delay from DMA HACK assertion to HOREQ 343 deassertion * HROD = 05 Delay from DMA HACK assertion to HOREQ deassertion for "Last Data Register" read or 344 write * HROD = 1, open drain Host Request5, 11
Notes: 1. 2.
Expression
100 MHz Min Max
Unit
342
39.1 0.0
-- -- -- 20.2
ns
1.5 x TC + 19.1 34.1
Freescale Semiconductor, Inc...
--
--
ns
--
--
300. 0
ns
See Host Port Usage Considerations in the DSP56362 User Design Manual. In the timing diagrams below, the controls pins are drawn as active low. The pin polarity is programmable. 3. VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF 4. The read data strobe is HRD in the dual data strobe mode and HDS in the single data strobe mode. 5. The "last data register" is the register at address $7, which is the last location to be read or written in data transfers. This is RXL/TXL in the little endian mode (HBE = 0), or RXH/TXH in the big endian mode (HBE = 1). 6. This timing is applicable only if a read from the "last data register" is followed by a read from the RXL, RXM, or RXH registers without first polling RXDF or HREQ bits, or waiting for the assertion of the HOREQ signal. 7. This timing is applicable only if two consecutive reads from one of these registers are executed. 8. The write data strobe is HWR in the dual data strobe mode and HDS in the single data strobe mode. 9. The data strobe is host read (HRD) or host write (HWR) in the dual data strobe mode and host data strobe (HDS) in the single data strobe mode. 10. The host request is HOREQ in the single host request mode and HRRQ and HTRQ in the double host request mode. 11. In this calculation, the host request signal is pulled up by a 4.7 k resistor in the open-drain mode.
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Freescale Semiconductor, Inc.
Specifications Parallel Host Interface (HDI08) Timing
317 HACK 327 HD7-HD0 326 329 328
318
HOREQ
Freescale Semiconductor, Inc...
AA1105
Figure 2-27 Host Interrupt Vector Register (IVR) Read Timing Diagram
HA0-HA2 336 330 HCS 337 333
317 HRD, HDS 318 328 332 327 326 HD0-HD7 340 341 HOREQ, HRRQ, HTRQ 338 319 329
Figure 2-28 Read Timing Diagram, Non-Multiplexed Bus
AA0484
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications Parallel Host Interface (HDI08) Timing
HA0-HA2 336 337 331 333 HCS
320 HWR, HDS
Freescale Semiconductor, Inc...
321 324 325 HD0-HD7 340 341 HOREQ, HRRQ, HTRQ
AA0485
339
Figure 2-29 Write Timing Diagram, Non-Multiplexed Bus
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Freescale Semiconductor, Inc.
Specifications Parallel Host Interface (HDI08) Timing
HA8-HA10 322 HAS 336 337
323 317
HRD, HDS 334 335 327 328 329 HAD0-HAD7 Address 326 340 341 HOREQ, HRRQ, HTRQ
AA0486
318 319
Freescale Semiconductor, Inc...
Data
338
Figure 2-30 Read Timing Diagram, Multiplexed Bus
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Freescale Semiconductor, Inc.
Specifications Parallel Host Interface (HDI08) Timing
HA8-HA10 322 HAS 336
323 320
HWR, HDS
Freescale Semiconductor, Inc...
334 335 HAD0-HAD7 Address
324
321 325
Data 340 341 339
HOREQ, HRRQ, HTRQ
AA0487
Figure 2-31 Write Timing Diagram, Multiplexed Bus
HOREQ (Output)
343 344 320 342
321
HACK (Input)
TXH/M/L Write 324 325
H0-H7 (Input)
Data Valid
Figure 2-32 Host DMA Write Timing Diagram
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Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
HOREQ (Output)
343 342 342 317 RXH Read 327 328 329 Data Valid 318
HACK (Input)
Freescale Semiconductor, Inc...
H0-H7 (Output)
326
Figure 2-33 Host DMA Read Timing Diagram
SERIAL HOST INTERFACE SPI PROTOCOL TIMING
Table 2-21 Serial Host Interface SPI Protocol Timing
No. Characteristics Mode Filter Mode Bypassed -- Narrow Wide Bypassed Master Narrow Wide 6xTC+46 6xTC+152 6xTC+223 -- Expression 100MHz Min -- -- -- 106 212 283 Max 0 50 100 -- -- -- ns ns Unit
140 Tolerable spike width on clock or data in 141 Minimum serial clock cycle = tSPICC(min)
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Specifications Serial Host Interface SPI Protocol Timing Table 2-21 Serial Host Interface SPI Protocol Timing (Continued)
No. Characteristics Mode Filter Mode Bypassed Master 142 Serial clock high period Slave Narrow Wide Bypassed Narrow Wide Bypassed Expression 0.5xtSPICC -10 0.5xtSPICC -10 0.5xtSPICC -10 2.5xTC+12 2.5xTC+102 2.5xTC+189 0.5xtSPICC -10 0.5xtSPICC -10 0.5xtSPICC -10 2.5xTC+12 2.5xTC+102 2.5xTC+189 -- -- 3.5xTC+15 0 0 10 0 0 12 102 189 100MHz Min 43 96 131 37 127 214 43 96 131 37 127 214 -- -- 50 0 0 10 0 0 12 102 189 0 10 30 35 55 75 2 -- -- -- -- Max -- -- -- -- -- -- -- -- -- -- -- -- 10 2000 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 9 53 143 230 ns ns ns ns ns ns ns ns ns ns Unit
Freescale Semiconductor, Inc...
Master 143 Serial clock low period Slave Master Slave Slave
Narrow Wide Bypassed Narrow Wide -- -- Bypassed Narrow Wide Bypassed
144 Serial clock rise/fall time SS assertion to first SCK edge CPHA = 0 146 CPHA = 1
Slave
Narrow Wide Bypassed
147 Last SCK edge to SS not asserted
slave
Narrow Wide
0 Data input valid to SCK Master Bypassed 148 edge (data input set-up /Slave Narrow MAX{(20-TC), 0} time) Wide MAX{(40-TC), 0} SCK last sampling 149 edge to data input not valid 150 SS assertion to data out active 151 SS deassertion to data high impedance SCK edge to data out 152 valid (data out delay time) Master /Slave Slave Slave Master /Slave Bypassed Narrow Wide -- -- Bypassed Narrow Wide 2.5xTC+10 2.5xTC+30 2.5xTC+50 2 9 2xTC+33 2xTC+123 2xTC+210
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Specifications Serial Host Interface SPI Protocol Timing Table 2-21 Serial Host Interface SPI Protocol Timing (Continued)
No. Characteristics Mode Master /Slave Slave Filter Mode Bypassed Narrow Wide -- Bypassed Slave Narrow Wide Bypassed Slave Narrow Wide -- -- Bypassed 161 HREQ in assertion to first SCK edge Master Narrow Wide HREQ in deassertion to last SCK sampling 162 edge (HREQ in set-up time) (CPHA = 1) First SCK edge to 163 HREQ in not asserted (HREQ in hold time)
Note:
Expression TC+5 TC+55 TC+106 TC+33 2.5xTC+30 2.5xTC+120 2.5xTC+217 2.5xTC+30 2.5xTC+80 2.5xTC+136 2.5xTC+30 TC+6 0.5 x tSPICC + 2.5xTC+43 0.5 xtSPICC + 2.5xTC+43 0.5 xtSPICC + 2.5xTC+43 0
100MHz Min 15 65 116 -- -- -- -- 55 105 161 55 16 121 174 209 Max -- -- -- 43 55 145 242 -- -- -- -- -- -- -- --
Unit
SCK edge to data out 153 not valid (data out hold time) 154 SS assertion to data out valid (CPHA = 0) First SCK sampling 157 edge to HREQ output deassertion Last SCK sampling 158 edge to HREQ output not deasserted (CPHA = 1)
ns
ns
ns
Freescale Semiconductor, Inc...
ns
SS deassertion to Slave 159 HREQ output not deasserted (CPHA = 0) 160 SS deassertion pulse width (CPHA = 0) Slave
ns ns
ns
Master
--
0
--
ns
Master
--
0
0
--
ns
Periodically sampled, not 100% tested
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
SS (Input) 143 142 144 141 144
SCK (CPOL=0 (Output)
142
SCK (CPOL = 1 (Output)
148
143
144
141 144
Freescale Semiconductor, Inc...
149 MISO (Input)
MSB Valid
148
LSB Valid
149
152 MOSI (Output) 161 HREQ (Input) MSB
153 LSB
163
Figure 2-34 SPI Master Timing (CPHA = 0)
AA0271
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Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
SS (Input) 143 142 144 141 144
SCK (CPOL = 0 (Output) SCK (CPOL = 1 (Output)
143
142 144
141 144
Freescale Semiconductor, Inc...
148 149 MISO (Input)
MSB Valid LSB Valid
148 149
152 MOSI (Output) 161 163 HREQ (Input) MSB 162
153 LSB
AA0272
Figure 2-35 SPI Slave Timing (CPHA = 0)
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
SS (Input) 143 142 144 141 144
SCK (CPOL = 0 (Output) SCK (CPOL = 1 (Output)
143
142 144
141 144
Freescale Semiconductor, Inc...
148 149 MISO (Input)
MSB Valid LSB Valid
148 149
152 MOSI (Output) 161 163 HREQ (Input) MSB 162
153 LSB
AA0272
Figure 2-36 SPI Master Timing (CPHA = 1)
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Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
SS (Input) 143 142 144 141 144 160 147
SCK (CPOL = 0) (Input)
146 142 143
SCK (CPOL = 1) (Input)
144
141 144
Freescale Semiconductor, Inc...
154 150 MISO (Output) 148 149 MOSI (Input)
MSB Valid
153 MSB
152
153
151 LSB 148 149
LSB Valid
157 HREQ (Output)
159
AA0273
Figure 2-37 SPI Slave Timing (CPHA = 0)
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MOTOROLA
Freescale Semiconductor, Inc.
Specifications Serial Host Interface SPI Protocol Timing
SS (Input) 143 142 144 141 144 147
SCK (CPOL = 0) (Input) SCK (CPOL = 1) (Input)
146
142 143
144
144
Freescale Semiconductor, Inc...
152 150 MISO (Output) 148
152
153
151 LSB 148
MSB
149 MOSI (Input) HREQ (Output)
MSB Valid LSB Valid
149
157
158
Figure 2-38 SPI Slave Timing (CPHA = 1)
AA0274
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Specifications Serial Host Interface (SHI) I2C Protocol Timing
SERIAL HOST INTERFACE (SHI) I2C PROTOCOL TIMING
Table 2-22 SHI I2C Protocol Timing
Standard I2C* No. Characteristics Tolerable spike width on SCL or SDA Filters bypassed Narrow filters enabled -- -- -- -- FSCL TBUF TSU;STA THD;STA TLOW THIGH TR TF TSU;DAT THD;DAT TSU;STO Cb FDSP Filters bypassed Narrow filters enabled Wide filters enabled 184 HREQ in deassertion to last SCL edge (HREQ in set-up time) First SCL sampling edge to HREQ output deassertion2 186 tSU;RQI TNG;RQO -- -- -- 50 140 228 -- -- -- 50 140 228 ns ns ns 10.6 11.8 13.1 0.0 -- -- -- -- 28.5 39.7 61.0 0.0 -- -- -- -- MHz MHz MHz ns -- 4.7 4.7 4.0 4.7 4.0 -- -- 250 0.0 4.0 -- 0 50 100 100 -- -- -- -- -- 300 -- -- -- 400 -- -- -- -- 1.3 0.6 0.6 1.3 1.3 20 + 0.1 x Cb 100 0.0 0.6 -- 0 50 100 400 -- -- -- -- -- 300 300 -- 0.9 -- 400 ns ns ns kHz s s s s s ns ns ns s s pF Symbol/ Expression Standard Min Max Fast-Mode Min Max Unit
Freescale Semiconductor, Inc...
Wide filters enabled 171 SCL clock frequency 172 Bus free time 173 Start condition set-up time 174 Start condition hold time 175 SCL low period 176 SCL high period 177 SCL and SDA rise time 178 SCL and SDA fall time 179 Data set-up time 180 Data hold time 181 Stop condition set-up time 182 Capacitive load for each line DSP clock frequency 183
1000 20 + 0.1 x Cb
Filters bypassed 2 x TC + 30 Narrow filters enabled 2 x TC + 120 Wide filters enabled 2 x TC + 208 Last SCL edge to HREQ output not deasserted2 TAS;RQO
187
Filters bypassed 2 x TC + 30 Narrow filters enabled 2 x TC + 80 Wide filters enabled 2 x TC + 135
50 100 155
-- -- --
50 100 155
-- -- --
ns ns ns
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Freescale Semiconductor, Inc.
Specifications Serial Host Interface (SHI) I2C Protocol Timing Table 2-22 SHI I2C Protocol Timing (Continued)
Standard I2C* No. Characteristics HREQ in assertion to first SCL edge 188 Symbol/ Expression Standard Min Max -- -- -- Fast-Mode Min 927 882 838 Max -- -- -- ns ns ns Unit
TAS;RQI Filters bypassed 0.5 x TI2CCP 4327 Narrow filters enabled 4282 0.5 x TC - 21 Wide filters enabled 4238
Note:
RP (min) = 1.5 k3/4
Freescale Semiconductor, Inc...
Programming the Serial Clock
The programmed serial clock cycle, T I2CCP , is specified by the value of the HDM[5:0] and HRS bits of the HCKR (SHI clock control register). The expression for T I2CCP is
T I2CCP = [TC x 2 x (HDM[7:0] + 1) x (7 x (1 - HRS) + 1)]
where
- - -
HRS is the prescaler rate select bit. When HRS is cleared, the fixed divide-by-eight prescaler is operational. When HRS is set, the prescaler is bypassed. HDM[7:0] are the divider modulus select bits. A divide ratio from 1 to 64 (HDM[5:0] = 0 to $3F) may be selected.
In I2C mode, the user may select a value for the programmed serial clock cycle from
6 x TC
to
(if HDM[5:0] = $02 and HRS = 1)
4096 x TC
(if HDM[7:0] = $FF and HRS = 0)
The programmed serial clock cycle (TI2CCP ), SCL rise time (TR), and the filters selected should be chosen in order to achieve the desired SCL frequency, as shown in Table 2-23
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Specifications Serial Host Interface (SHI) I2C Protocol Timing Table 2-23 SCL Serial Clock Cycle generated as Master
Filters bypassed Wide filters enabled EXAMPLE: For DSP clock frequency of 100 MHz (i.e. TC = 10ns), operating in a standard-mode I2C environment (FSCL = 100 KHz (i.e. TSCL = 10s), TR = 1000ns), with filters bypassed
.
TI2CCP + 2.5 x TC + 45ns + TR TI2CCP + 2.5 x TC + 223ns + TR
Narrow filters enabled TI2CCP + 2.5 x TC + 135ns + TR
Freescale Semiconductor, Inc...
TI2CCP = 10s - 2.5x10ns - 45ns - 1000ns = 8930ns
Choosing HRS = 0 gives
HDM[7:0] = 8930ns / (2x 10nsx 8) - 1 = 55.8
Thus the HDM[7:0] value should be programmed to $38 (=56).
171 173 SCL 177 172 SDA 179
Start MSB LSB ACK Stop
176
175
178
180
Stop
174 188 HREQ 189
186 184
182
183 187
AA0275
Figure 2-39 I2C Timing
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Specifications Enhanced Serial Audio Interface Timing
ENHANCED SERIAL AUDIO INTERFACE TIMING
Table 2-24 Enhanced Serial Audio Interface Timing
No. Characteristics1, 2, 3 Symbol Expression 4 x TC 430 Clock cycle5 tSSICC RXC:3 xTC TXC:MAX [3xTC;t454] 100 MHz Min Max 40.0 30 40 -- -- -- -- 37.0 22.0 37.0 22.0 39.0 24.0 39.0 -- -- -- -- -- 0.0 -- -- -- -- --
--
Cond-ition4 i ck x ck x ck
Unit
-- --
ns
Freescale Semiconductor, Inc...
Clock high period 431 * For internal clock * For external clock Clock low period 432 * For internal clock * For external clock 433 RXC rising edge to FSR out (bl) high 434 RXC rising edge to FSR out (bl) low 435 RXC rising edge to FSR out (wr) high6 436 RXC rising edge to FSR out (wr) low6 437 RXC rising edge to FSR out (wl) high 438 RXC rising edge to FSR out (wl) low Data in setup time before RXC 439 (TXC in synchronous mode) falling edge 440 Data in hold time after RXC falling edge high before 441 FSR input (bl, wr)6 RXC falling edge 442 FSR input (wl) high before RXC falling edge 443 FSR input hold time after RXC falling edge 444 Flags input setup before RXC falling edge
--
2 x TC - 10.0 10.0 1.5 x TC 15.0
ns
--
2 x TC - 10.0 10.0 1.5 x TC 15.0 -- -- -- -- -- --
ns x ck i ck a x ck i ck a x ck i ck a x ck i ck a x ck i ck a x ck i ck a x ck i ck x ck i ck x ck i ck a x ck i ck a x ck i ck a x ck i ck s ns ns ns ns ns ns
-- -- -- -- -- --
-- -- -- -- -- -- -- -- -- -- -- --
ns ns ns ns ns ns
24.0 36.0 21.0 37.0 22.0 -- -- -- -- -- -- -- -- -- -- -- --
19.0 5.0 3.0 23.0 1.0 1.0 23.0 3.0 0.0 0.0 19.0
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Specifications Enhanced Serial Audio Interface Timing Table 2-24 Enhanced Serial Audio Interface Timing (Continued)
No. Characteristics1, 2, 3 Symbol Expression -- -- -- -- -- -- -- -- -- -- -- -- --
--
100 MHz Min Max 6.0 0.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0 21.0 -- -- 2.0 21.0 0.0 -- -- 40.0 -- -- 29.0 15.0 31.0 17.0 31.0 17.0 33.0 19.0 30.0 16.0 31.0 17.0 31.0 17.0 34.0 20.0 28.0 21.0 31.0 16.0 34.0 20.0 -- -- 27.0 31.0 -- -- -- 32.0 18.0 --
Cond-ition4 x ck i ck s x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck x ck i ck -- -- x ck i ck x ck i ck x ck i ck
Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
445 Flags input hold time after RXC falling edge 446 TXC rising edge to FST out (bl) high 447 TXC rising edge to FST out (bl) low 448 TXC6rising edge to FST out (wr) high 449 TXC rising edge to FST out (wr) low6 450 TXC rising edge to FST out (wl) high 451 TXC rising edge to FST out (wl) low 452 TXC rising edge to data out enable from high impedance 453 TXC rising edge to transmitter drive enable assertion 454 TXC rising edge to data out valid edge to data out high 455 TXC rising 7 impedance 456 TXC rising edge to transmitter drive enable deassertion7 457 FST input (bl, wr) setup time before TXC falling edge6 458 FST input (wl) to data out enable from high impedance 459 FST input (wl) to transmitter drive enable assertion 460 FST input (wl) setup time before TXC falling edge 461 FST input hold time after TXC falling edge 462 Flag output valid after TXC rising edge 463 HCKR/HCKT clock cycle
-- -- -- -- -- -- -- -- -- 23 + 0.5 x TC 21.0 -- -- -- -- -- -- -- -- --
Freescale Semiconductor, Inc...
-- -- -- -- --
4.0 ----
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Specifications Enhanced Serial Audio Interface Timing Table 2-24 Enhanced Serial Audio Interface Timing (Continued)
No. Characteristics1, 2, 3 Symbol Expression -- -- -- -- 100 MHz Min Max -- -- 27.5 27.5 Cond-ition4 Unit ns ns
464 HCKT input rising edge to TXC output 465 HCKR input rising edge to RXC output
Notes: 1. 2.
Freescale Semiconductor, Inc...
3.
4.
5. 6.
7.
VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF i ck = internal clock x ck = external clock i ck a = internal clock, asynchronous mode (asynchronous implies that TXC and RXC are two different clocks) i ck s = internal clock, synchronous mode (synchronous implies that TXC and RXC are the same clock) bl = bit length wl = word length wr = word length relative TXC(SCKT pin) = transmit clock RXC(SCKR pin) = receive clock FST(FST pin) = transmit frame sync FSR(FSR pin) = receive frame sync HCKT(HCKT pin) = transmit high frequency clock HCKR(HCKR pin) = receive high frequency clock For the internal clock, the clock cycle at the pin is defined by Icyc and the ESAI control registers. The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync signal waveform, but spreads from one serial clock before first bit clock (same as bit length frame sync signal), until the one before last bit clock of the first word in frame. Periodically sampled and not 100% tested
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Freescale Semiconductor, Inc.
Specifications Enhanced Serial Audio Interface Timing
430 TXC (Input/Output) 431 432
446 FST (Bit) Out
447
Freescale Semiconductor, Inc...
FST (Word) Out
450
451
454 452 Data Out 459
454 455 First Bit Last Bit
Transmitter Drive Enable
FST (Bit) In
457 461
453
456
FST (Word) In
458 460 461
Flags Out
462
See Note
Note:
In network mode, output flag transitions can occur at the start of each time slot within the frame. In normal mode, the output flag state is asserted for the entire frame period. AA0490
Figure 2-40 ESAI Transmitter Timing
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Specifications Enhanced Serial Audio Interface Timing
430 431 RXC (Input/Output) 433 FSR (Bit) Out 437 438 432
434
Freescale Semiconductor, Inc...
FSR (Word) Out
Data In
439 First Bit
440 Last Bit
FSR (Bit) In
441
443
FSR (Word) In
442
443
Flags In
444
445
AA0491
Figure 2-41 ESAI Receiver Timing
HCKT 463
SCKT(output)
464
Figure 2-42 ESAI HCKT Timing
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Freescale Semiconductor, Inc.
Specifications Digital Audio Transmitter Timing
HCKR 463
SCKR (output)
465
Figure 2-43 ESAI HCKR Timing
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DIGITAL AUDIO TRANSMITTER TIMING
Table 2-25 Digital Audio Transmitter Timing
100 MHz No. Characteristic Expression Min ACI frequency (see note) 220 221 222 223
Note:
Unit Max 50 -- -- -- 15 MHz ns ns ns ns
-- 2 x TC 0.5 x TC 0.5 x TC 1.5 x TC
-- 20 5 5 --
ACI period ACI high duration ACI low duration ACI rising edge to ADO valid
In order to assure proper operation of the DAX, the ACI frequency should be less than 1/2 of the DSP56362 internal clock frequency. For example, if the DSP56362 is running at 100 MHz internally, the ACI frequency should be less than 50 MHz.
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Specifications Timer Timing
ACI 220 223 ADO
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221
222
Figure 2-44 Digital Audio Transmitter Timing
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TIMER TIMING
Table 2-26 Timer Timing
No. 480 TIO Low 481 TIO High 482 Timer setup time from TIO (Input) assertion to CLKOUT rising edge Synchronous timer delay time from CLKOUT rising edge to the external 483 memory access address out valid caused by first interrupt instruction execution CLKOUT rising edge to TIO (Output) 484 assertion * Minimum * Maximum CLKOUT rising edge to TIO (Output) deassertion * Minimum * Maximum
Note:
Characteristics
Expression 2 x TC + 2.0 2 x TC + 2.0
100 MHz Min 22.0 22.0 9.0 Max -- -- 10.0
Unit ns ns ns
10.25 x TC + 1.0
103. 5
--
ns
0.5 x TC + 3.5 0.5 x TC + 19.8
8.5 --
-- 24.8
ns
485
60.5 x TC + 3.5 0.5 x TC + 19.0
8.5 --
-- 24.8
ns
VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF
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Specifications GPIO Timing
TIO 480 481
AA0492
Figure 2-45 TIO Timer Event Input Restrictions
CLKOUT
TIO (Input)
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482 Address 483 First Interrupt Instruction Execution
AA0493
Figure 2-46 Timer Interrupt Generation
CLKOUT
TIO (Output) 484 485
AA0494
Figure 2-47 External Pulse Generation
GPIO TIMING
Table 2-27 GPIO Timing
No. Characteristics Expression 100 MHz Min -- 3.0 Max 31.0 -- Unit ns ns
490 CLKOUT edge to GPIO out valid (GPIO out delay time) 491 CLKOUT edge to GPIO out not valid (GPIO out hold time)
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Specifications GPIO Timing Table 2-27 GPIO Timing (Continued)
No. Characteristics Expression 100 MHz Min 12.0 0.0 6.75 x TC -- -- 67.5 -- -- Max -- -- -- 13 13 Unit ns ns ns ns ns
492 GPIO In valid to CLKOUT edge (GPIO in set-up time) 493 CLKOUT edge to GPIO in not valid (GPIO in hold time) 494 Fetch to CLKOUT edge before GPIO change 495 GPIO out rise time
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496 GPIO out fall time
Note:
VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF
CLKOUT (Output) 490 491 GPIO (Output) 492 GPIO (Input) Valid 493
A0-A17 494 Fetch the instruction MOVE X0,X:(R0); X0 contains the new value of GPIO and R0 contains the address of GPIO data register. GPIO (Output) 495 496
AA0495
Figure 2-48 GPIO Timing
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Specifications JTAG Timing
JTAG TIMING
Table 2-28 JTAG Timing
No. Characteristics All frequencies Min 0.0 45.0 20.0 0.0 5.0 24.0 0.0 0.0 5.0 25.0 0.0 0.0 100.0 40.0 Max 22.0 -- -- 3.0 -- -- 40.0 40.0 -- -- 44.0 44.0 -- -- Unit MHz ns ns ns ns ns ns ns ns ns ns ns ns ns
500 TCK frequency of operation (1/(T x 3); maximum 22 MHz) C 501 TCK cycle time in Crystal mode 502 TCK clock pulse width measured at 1.5 V 503 TCK rise and fall times
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504 Boundary scan input data setup time 505 Boundary scan input data hold time 506 TCK low to output data valid 507 TCK low to output high impedance 508 TMS, TDI data setup time 509 TMS, TDI data hold time 510 TCK low to TDO data valid 511 TCK low to TDO high impedance 512 TRST assert time 513 TRST setup time to TCK low
Notes: 1. 2.
VCC = 3.3 V 0.16V; TJ = 0C to +100C, CL = 50 pF All timings apply to OnCE module data transfers because it uses the JTAG port as an interface.
501 502 TCK (Input)
VIH VM VIL
502
VM
503
503
AA0496
Figure 2-49 Test Clock Input Timing Diagram
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Specifications JTAG Timing
TCK (Input)
VIL 504
VIH 505
Data Inputs 506 Data Outputs 507
Input Data Valid
Output Data Valid
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Data Outputs 506 Data Outputs Output Data Valid
AA0497
Figure 2-50 Boundary Scan (JTAG) Timing Diagram
TCK (Input) TDI TMS (Input)
VIH VIL 508 Input Data Valid 510 509
TDO (Output) 511 TDO (Output) 510 TDO (Output)
Output Data Valid
Output Data Valid
AA0498
Figure 2-51 Test Access Port Timing Diagram
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Specifications OnCE Module TimIng
TCK (Input) 513 TRST (Input) 512
AA0499
Figure 2-52 TRST Timing Diagram
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OnCE MODULE TIMING
OnCE Module Timing No. Characteristics Expression 1/(TC x 3), max 22.0 MHz 1.5 x TC + 10.0 5.5 x TC + 30.0 3 x TC + 10.0 100 MHz Min Max 0.0 25.0 -- 40.0 Unit
500 TCK frequency of operation 514 DE assertion time in order to enter Debug mode Response time when DSP56362 is 515 executing NOP instructions from internal memory 516 Debug acknowledge assertion time
Note:
22.0 MHz -- 85.0 -- ns ns ns
VCC = 3.3 V 0.16 V; TJ = 0C to +100C, CL = 50 pF
DE 514 515 516
AA0500
Figure 2-53 OnCE--Debug Request
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SECTION 3 PACKAGING
PIN-OUT AND PACKAGE INFORMATION
This section provides information about the available package for this product, including diagrams of the package pinouts and tables describing how the signals described in Section 1 are allocated for the package. The DSP56362 is available in a 144-pin LQFP package.
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Packaging Pin-out and Package Information
LQFP Package Description
Top view of the LQFP package is shown in Figure 3-1 with its pin-outs. The LQFP package mechanical drawing is shown in Figure 3-2.
A14 A13 A12 VCCQL VCCQH D6 D5 D4 D3 GNDD D2 D1 D0 A17 A16 A15 GNDA GNDQ A11 A10 GNDA A9 A8 A7 A6 GNDA A5 A4 A3 A2 GNDA VCCD VCCA VCCA VCCA A1 73
D7 D8 VCCD GNDD D9 D10 D11 D12 D13 D14 VCCD GNDD D15 D16 D17 D18 D19
109
(Top View)
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A0 BG AA0 AA1 RD WR GNDC VCCC BB BR TA PINIT nc CLKOUT GNDC VCCC VCCQL EXTAL GNDQ
VCCQL
GNDQ D20 VCCD GNDD D21 D22 D23 MODD MODC MODB MODA
DSP56362
DE
TRST
TDO TDI TCK TMS MOSI MISO
Orientation Mark
1
37
CAS AA2 AA3 VCCQH GNDP1 GNDP PCAP VCCP RESET HAD0 HAD1 HAD2 HAD3 GNDH VCCH HAD4
SDO2 SDO3 VCCS GNDS SDO4 SDO5 FST FSR SCKT SCKR HCKT HCKR VCCQL GNDQ VCCQH
HRW
VCCS GNDS ADO ACI TIO0
SDO0
HACK HOREQ
SS HREQ
Note:
Because of size constraints in this figure, only one name is shown for multiplexed pins. Refer to Table 3-1 and Table 3-2 for detailed information about pin functions and signal names.
AA0301
Figure 3-1 DSP56362 Thin Quad Flat Pack (LQFP), Top View 3-2 DSP56362 Advance Information
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SDO1
HA9 HA8 HAS HAD7 HAD6 HAD5
SCK
HDS
HCS
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Packaging Pin-out and Package Information Table 3-1 DSP56362 LQFP Signal Identification by Pin Number
Pin No.
1 2 3 4 5 6
Signal Name
SCK/SCL SS/HA2 HREQ SDO0 or PC11 SDO1 or PC10 SDO2/SDI3 or PC9 SDO3/SDI2 or PC8 VCCS GNDS SDO4/SDI1 or PC7 SDO5/SDI0 or PC6 FST or PC4 FSR or PC1 SCKT or PC3 SCKR or PC0 HCKT or PC5 HCKR or PC2 VCCQL GNDQ VCCQH HDS/HDS, HWR/HWR, or PB12 HRW, HRD/HRD, or PB11 HACK/HACK, HRRQ/HRRQ, or PB15 HOREQ/HOREQ, HTRQ/HTRQ, or PB14 VCCS
Pin No.
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 GNDS
Signal Name
Pin No.
51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75
Signal Name
AA2/RAS2 CAS DE GNDQ EXTAL VCCQL VCCC GNDC CLKOUT NC (not connected) PINIT/NMI TA BR BB VCCC GNDC WR RD AA1/RAS1 AA0/RAS0 BG A0 A1 VCCA GNDA
ADO or PD1 ACI or PD0 TIO0 HCS/HCS, HA10, or PB13 HA2, HA9, or PB10 HA1, HA8, or PB9 HA0, HAS/HAS, or PB8 H7, HAD7, or PB7 H6, HAD6, or PB6 H5, HAD5, or PB5 H4, HAD4, or PB4 VCCH GNDH H3, HAD3, or PB3 H2, HAD2, or PB2 H1, HAD1, or PB1 H0, HAD0, or PB0 RESET VCCP PCAP GNDP GNDP1 VCCQH AA3/RAS3
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7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
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Packaging Pin-out and Package Information Table 3-1 DSP56362 LQFP Signal Identification by Pin Number (Continued)
Pin No.
76 77 78 79 80 81 A2 A3 A4 A5 VCCA GNDA A6 A7 A8 A9 VCCA GNDA A10 A11 GNDQ VCCQL A12 A13 A14 VCCQH GNDA A15 A16
Signal Name
Pin No.
99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 A17 D0 D1 D2 VCCD GNDD D3 D4 D5 D6 D7 D8 VCCD GNDD D9 D10 D11 D12 D13 D14 VCCD GNDD D15
Signal Name
Pin No.
122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 D16 D17 D18 D19 VCCQL GNDQ D20 VCCD GNDD D21 D22 D23
Signal Name
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82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 Note:
MODD/IRQD MODC/IRQC MODB/IRQB MODA/IRQA TRST TDO TDI TCK TMS MOSI/HA0 MISO/SDA
Signal names are based on configured functionality. Most pins supply a single signal. Some pins provide a signal with dual functionality, such as the MODx/IRQx pins that select an operating mode after RESET is deasserted, but act as interrupt lines during operation. Some signals have configurable polarity; these names are shown with and without overbars, such as HAS/HAS. Some pins have two or more configurable functions; names assigned to these pins indicate the function for a specific configuration. For example, pin 34 is data line H7 in nonmultiplexed bus mode, data/address line HAD7 in multiplexed bus mode, or GPIO line PB7 when the GPIO function is enabled for this pin.
Table 3-2 DSP56362 LQFP Signal Identification by Name
Signal Name not connected A0 A1 Pin No. 60 72 73 Signal Name D13 D14 D15 Pin No. 117 118 121 Signal Name GNDP1 GNDQ GNDQ Pin No. 48 19 54
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Packaging Pin-out and Package Information Table 3-2 DSP56362 LQFP Signal Identification by Name (Continued)
Signal Name A10 A11 A12 A13 A14 A15 A16 A17 Pin No. 88 89 92 93 94 97 98 99 76 77 78 79 82 83 84 85 70 69 51 50 28 27 64 71 63 52 59 100 101 114 115 116 Signal Name D16 D17 D18 D19 D2 D20 D21 D22 D23 D3 D4 D5 D6 D7 D8 D9 DE EXTAL FSR FST GNDA GNDA GNDA GNDA GNDC GNDC GNDD GNDD GNDD GNDD GNDH GNDP Pin No. 122 123 124 125 102 128 131 132 133 105 106 107 108 109 110 113 53 55 13 12 75 81 87 96 58 66 104 112 120 130 39 47 Signal Name GNDQ GNDQ GNDS GNDS H0 H1 H2 H3 H4 H5 H6 H7 HA0 HA0 HA1 HA10 HA2 HA2 HA8 HA9 HACK/HACK HAD0 HAD1 HAD2 HAD3 HAD4 HAD5 HAD6 HAD7 HAS/HAS HCS/HCS HDS/HDS Pin No. 90 127 9 26 43 42 41 40 37 36 35 34 33 143 32 30 2 31 32 31 23 43 42 41 40 37 36 35 34 33 30 21
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A2 A3 A4 A5 A6 A7 A8 A9 AA0 AA1 AA2 AA3 ACI ADO BB BG BR CAS CLKOUT D0 D1 D10 D11 D12
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Packaging Pin-out and Package Information Table 3-2 DSP56362 LQFP Signal Identification by Name (Continued)
Signal Name HOREQ/HOREQ HRD/HRD HREQ HRRQ/HRRQ HRW HCKR HCKT HTRQ/HTRQ Pin No. 24 22 3 23 22 17 16 24 21 137 136 135 134 144 137 136 135 134 143 61 43 42 31 22 21 30 24 23 41 40 37 36 35 34 33 Signal Name PB9 PC0 PC1 PC10 PC11 PC2 PC3 PC4 PC5 PC6 PC7 PC8 PC9 PCAP PD0 PD1 PINIT RAS0 RAS1 RAS2 RAS3 RD RESET SCK SCKR SCKT SCL SDA SDI0 SDI1 SDI2 SDI3 SDO0 SDO1 SDO2 Pin No. 32 15 13 5 4 17 14 12 16 11 10 7 6 46 28 27 61 70 69 52 51 68 44 1 15 14 1 144 11 10 7 6 4 5 6 Signal Name SDO3 SDO4 SDO5 SS TA TCK TDI TDO TIO0 TMS TRST VCCA VCCA VCCA VCCC VCCC VCCD VCCD VCCD VCCD VCCH VCCP VCCQH VCCQH VCCQH VCCQL VCCQL VCCQL VCCQL VCCS VCCS WR Pin No. 7 10 11 2 62 141 140 139 29 142 138 74 80 86 57 65 103 111 119 129 38 45 20 49 95 18 56 91 126 8 25 67
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HWR/HWR IRQA IRQB IRQC IRQD MISO MODA MODB MODC MODD MOSI NMI PB0 PB1 PB10 PB11 PB12 PB13 PB14 PB15 PB2 PB3 PB4 PB5 PB6 PB7 PB8
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Packaging Pin-out and Package Information
LQFP PACKAGE MECHANICAL DRAWING
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Figure 3-2 DSP56362 144-pin LQFP Package
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Packaging Ordering Drawings
ORDERING DRAWINGS
The detailed package drawing is available on the Motorola web page at: http://mot.sps.com/cgi-bin/cases Use package 918-03 for the search.
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SECTION 4 DESIGN CONSIDERATIONS
THERMAL DESIGN CONSIDERATIONS
An estimation of the chip junction temperature, TJ, in C can be obtained from the following equation:
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T J = T A + ( P D x R JA )
Where:
TA = ambient temperature C RqJA = package junction-to-ambient thermal resistance C/W PD = power dissipation in package W
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance.
RJA = R JC + R CA
Where:
RJA = package junction-to-ambient thermal resistance C/W RJC = package junction-to-case thermal resistance C/W RCA = package case-to-ambient thermal resistance C/W
RJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RCA. For example, the user can change the air flow around the device, add a heat sink, change the mounting arrangement on the printed circuit board (PCB), or otherwise change the thermal dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case and an alternate path through the PCB, analysis of the device thermal performance may need the additional modeling capability of a system level thermal simulation tool. The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the package is mounted. Again, if the estimations obtained from RJA do not satisfactorily answer whether the thermal performance is adequate, a system level model may be appropriate. A complicating factor is the existence of three common ways for determining the junction-to-case thermal resistance in plastic packages. * To minimize temperature variation across the surface, the thermal resistance is measured from the junction to the outside surface of the package (case) closest to the chip mounting area when that surface has a proper heat sink. To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance is measured from the junction to where the leads are attached to the case.
*
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Design Considerations Electrical Design Considerations
* If the temperature of the package case (TT) is determined by a thermocouple, the thermal resistance is computed using the value obtained by the equation (TJ - TT)/PD.
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As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the first definition. From a practical standpoint, that value is also suitable for determining the junction temperature from a case thermocouple reading in forced convection environments. In natural convection, using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple reading on the case of the package will estimate a junction temperature slightly hotter than actual temperature. Hence, the new thermal metric, thermal characterization parameter or JT, has been defined to be (TJ - TT)/PD. This value gives a better estimate of the junction temperature in natural convection when using the surface temperature of the package. Remember that surface temperature readings of packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
ELECTRICAL DESIGN CONSIDERATIONS
CAUTION
This device contains circuitry protecting against damage due to high static voltage or electrical fields. However, normal precautions should be taken to avoid exceeding maximum voltage ratings. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either GND or VCC). The suggested value for a pullup or pulldown resistor is 10 k ohm.
Use the following list of recommendations to assure correct DSP operation: * * * * * Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the board ground to each GND pin. Use at least six 0.01-0.1 F bypass capacitors positioned as close as possible to the four sides of the package to connect the VCC power source to GND. Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and GND pins are less than 1.2 cm (0.5 inch) per capacitor lead. Use at least a four-layer PCB with two inner layers for VCC and GND. Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal. This recommendation particularly applies to the address and data buses as well as the IRQA, IRQB, IRQC, IRQD, TA, and BG pins. Maximum PCB trace lengths on the order of 15 cm (6 inches) are recommended.
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Design Considerations Power Consumption Considerations
* Consider all device loads as well as parasitic capacitance due to PCB traces when calculating capacitance. This is especially critical in systems with higher capacitive loads that could create higher transient currents in the VCC and GND circuits. All inputs must be terminated (i.e., not allowed to float) using CMOS levels, except for the pins with internal pull-up resistors (TRST, TMS, DE, TCK, and TDI). Take special care to minimize noise levels on the VCCP, GNDP, and GNDP1 pins. If multiple DSP56362 devices are on the same board, check for cross-talk or excessive spikes on the supplies due to synchronous operation of the devices. RESET must be asserted when the chip is powered up. A stable EXTAL signal should be supplied before deassertion of RESET. At power-up, ensure that the voltage difference between the 5 V tolerant pins and the chip VCC never exceeds 3.95 V.
* * * * *
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POWER CONSUMPTION CONSIDERATIONS
Power dissipation is a key issue in portable DSP applications. Some of the factors which affect current consumption are described in this section. Most of the current consumed by CMOS devices is alternating current (ac), which is charging and discharging the capacitances of the pins and internal nodes. Current consumption is described by the following formula: I = CxVxf where C = node/pin capacitance V = voltage swing f = frequency of node/pin toggle
Example 1 Current Consumption
For a Port A address pin loaded with 50 pF capacitance, operating at 3.3 V, and with a 100 MHz clock, toggling at its maximum possible rate (50 MHz), the current consumption is I = 50 x 10 - 12 x 3.3 x 50 x 10 6 = 8.25mA
The maximum internal current (ICCImax) value reflects the typical possible switching of the internal buses on best-case operation conditions, which is not necessarily a real application case. The typical internal current (ICCItyp) value reflects the average switching of the internal buses on typical operating conditions. For applications that require very low current consumption, do the following: * * Set the EBD bit when not accessing external memory. Minimize external memory accesses and use internal memory accesses.
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Design Considerations PLL Performance Issues
* * * * * Minimize the number of pins that are switching. Minimize the capacitive load on the pins. Connect the unused inputs to pull-up or pull-down resistors. Disable unused peripherals. Disable unused pin activity (e.g., CLKOUT, XTAL).
One way to evaluate power consumption is to use a current per MIPS measurement methodology to minimize specific board effects (i.e., to compensate for measured board current not caused by the DSP). A benchmark power consumption test algorithm is listed in Appendix A. Use the test algorithm, specific test current measurements, and the following equation to derive the current per MIPS value.
I MIPS = I MHz = ( ItypF2 - ItypF1 ) ( F2 - F1 )
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where :
ItypF2 ItypF1 F2 F1
= = = =
current at F2 current at F1 high frequency (any specified operating frequency) low frequency (any specified operating frequency lower than F2)
Note:
F1 should be significantly less than F2. For example, F2 could be 66 MHz and F1 could be 33 MHz. The degree of difference between F1 and F2 determines the amount of precision with which the current rating can be determined for an application.
PLL PERFORMANCE ISSUES
The following explanations should be considered as general observations on expected PLL behavior. There is no testing that verifies these exact numbers. These observations were measured on a limited number of parts and were not verified over the entire temperature and voltage ranges.
Phase Skew Performance
The phase skew of the PLL is defined as the time difference between the falling edges of EXTAL and CLKOUT for a given capacitive load on CLKOUT, over the entire process, temperature, and voltage ranges. As defined in Figure 2-1, for input frequencies greater than 15 MHz and the MF 4, this skew is greater than or equal to 0.0 ns and less than 1.8 ns; otherwise, this skew is not guaranteed. However, for MF < 10 and input frequencies greater than 10 MHz, this skew is between -1.4 ns and +3.2 ns.
Phase Jitter Performance
The phase jitter of the PLL is defined as the variations in the skew between the falling edges of EXTAL and CLKOUT for a given device in specific temperature, voltage, input frequency, MF, and capacitive load on CLKOUT. These variations are a result of the PLL locking mechanism. For input frequencies greater than 15 MHz and MF 4, this jitter is less than 0.6 ns; otherwise, this jitter is not guaranteed. However, for MF < 10 and input frequencies greater than 10 MHz, this jitter is less than 2 ns.
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Design Considerations Host Port Considerations
Frequency Jitter Performance
The frequency jitter of the PLL is defined as the variation of the frequency of CLKOUT. For small MF (MF < 10) this jitter is smaller than 0.5%. For mid-range MF (10 < MF < 500) this jitter is between 0.5% and approximately 2%. For large MF (MF > 500), the frequency jitter is 2-3%.
Input (EXTAL) Jitter Requirements
The allowed jitter on the frequency of EXTAL is 0.5%. If the rate of change of the frequency of EXTAL is slow (i.e., it does not jump between the minimum and maximum values in one cycle) or the frequency of the jitter is fast (i.e., it does not stay at an extreme value for a long time), then the allowed jitter can be 2%. The phase and frequency jitter performance results are only valid if the input jitter is less than the prescribed values.
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HOST PORT CONSIDERATIONS
Careful synchronization is required when reading multi-bit registers that are written by another asynchronous system. This synchronization is a common problem when two asynchronous systems are connected, as they are in the host interface. The following paragraphs present considerations for proper operation.
Host Programming Considerations
* Unsynchronized Reading of Receive Byte Registers--When reading the receive byte registers, receive register high (RXH), receive register middle (RXM), or receive register low (RXL), the host interface programmer should use interrupts or poll the receive register data full (RXDF) flag that indicates whether data is available. This ensures that the data in the receive byte registers will be valid. Overwriting Transmit Byte Registers--The host interface programmer should not write to the transmit byte registers, transmit register high (TXH), transmit register middle (TXM), or transmit register low (TXL), unless the transmit register data empty (TXDE) bit is set, indicating that the transmit byte registers are empty. This ensures that the transmit byte registers will transfer valid data to the host receive (HRX) register. Synchronization of Status Bits from DSP to Host--HC, HOREQ, DMA, HF3, HF2, TRDY, TXDE, and RXDF status bits are set or cleared from inside the DSP and read by the host processor (refer to the user's manual for descriptions of these status bits). The host can read these status bits very quickly without regard to the clock rate used by the DSP, but the state of the bit could be changing during the read operation. This is not generally a system problem, because the bit will be read correctly in the next pass of any host polling routine. However, if the host asserts HEN for more than timing number 31, with a minimum cycle time of timing number 31 + 32, then these status bits are guaranteed to be
*
*
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Design Considerations Host Port Considerations
stable. Exercise care when reading status bits HF3 and HF2 as an encoded pair. If the DSP changes HF3 and HF2 from 00 to 11, there is a small probability that the host could read the bits during the transition and receive 01 or 10 instead of 11. If the combination of HF3 and HF2 has significance, the host could read the wrong combination. Therefore, read the bits twice and check for consensus. * Overwriting the Host Vector--The host interface programmer should change the host vector (HV) register only when the host command (HC) bit is clear. This ensures that the DSP interrupt control logic will receive a stable vector. Cancelling a Pending Host Command Exception--The host processor may elect to clear the HC bit to cancel the host command exception request at any time before it is recognized by the DSP. Because the host does not know exactly when the exception will be recognized (due to exception processing synchronization and pipeline delays), the DSP may execute the host command exception after the HC bit is cleared. For these reasons, the HV bits must not be changed at the same time that the HC bit is cleared. Variance in the Host Interface Timing--The host interface (HDI) may vary (e.g. due to the PLL lock time at reset). Therefore, a host which attempts to load (bootstrap) the DSP should first make sure that the part has completed its HI port programming (e.g., by setting the INIT bit in ICR then polling it and waiting it to be cleared, then reading the ISR or by writing the TREQ/RREQ together with the INIT and then polling INIT, ISR, and the HOREQ pin).
*
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*
DSP Programming Considerations
* Synchronization of Status Bits from Host to DSP--DMA, HF1, HF0, HCP, HTDE, and HRDF status bits are set or cleared by the host processor side of the interface. These bits are individually synchronized to the DSP clock. (Refer to the user's manual for descriptions of these status bits.) Reading HF0 and HF1 as an Encoded Pair--Care must be exercised when reading status bits HF0 and HF1 as an encoded pair, (i.e., the four combinations 00, 01, 10, and 11 each have significance). A very small probability exists that the DSP will read the status bits synchronized during transition. Therefore, HF0 and HF1 should be read twice and checked for consensus.
*
4-6
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SECTION 5 ORDERING INFORMATION
Consult a Motorola Semiconductor sales office or authorized distributor to determine product availability and to place an order. For information on ordering this and all DSP Audio products, review the SG1004 selector guide at http://ewww.motorola.com/files/shared/doc/selector_guide/SG1004.pdf.
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5-1
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NOTES
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Freescale Semiconductor, Inc.
APPENDIX A POWER CONSUMPTION BENCHMARK
The following benchmark program permits evaluation of DSP power usage in a test situation. It enables the PLL, disables the external clock, and uses repeated multiply-accumulate instructions with a set of synthetic DSP application data to emulate intensive sustained DSP operation.
;********************************************************************;** ******************************************************************
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;* ;* CHECKS
Typical Power Consumption
;******************************************************************** page 200,55,0,0,0 nolist I_VEC EQU START EQU INT_PROG INT_XDAT INT_YDAT $000000 $8000 EQU $100 EQU $0 EQU $0 ; ; ; ; ; Interrupt vectors for program debug only MAIN (external) program starting address INTERNAL program memory starting address INTERNAL X-data memory starting address INTERNAL Y-data memory starting address
INCLUDE "ioequ.asm" INCLUDE "intequ.asm" list org ; movep #$0123FF,x:M_BCR; BCR: Area 3 : 1 w.s (SRAM) ; Default: 1 w.s (SRAM) ; movep #$0d0000,x:M_PCTL ; XTAL disable ; PLL enable ; CLKOUT disable ; ; Load the program ; move #INT_PROG,r0 move #PROG_START,r1 do #(PROG_END-PROG_START),PLOAD_LOOP move p:(r1)+,x0 move x0,p:(r0)+ nop PLOAD_LOOP ; ; Load the X-data ; move #INT_XDAT,r0 move #XDAT_START,r1 P:START
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Appendix A-1
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Power Consumption Benchmark
do move move XLOAD_LOOP ; ; Load the Y-data ; move move do move move YLOAD_LOOP ;
#(XDAT_END-XDAT_START),XLOAD_LOOP p:(r1)+,x0 x0,x:(r0)+
#INT_YDAT,r0 #YDAT_START,r1 #(YDAT_END-YDAT_START),YLOAD_LOOP p:(r1)+,x0 x0,y:(r0)+
Freescale Semiconductor, Inc...
jmp PROG_START move move move move ; clr clr move move move move bset ; sbr dor mac mac add mac mac move _end bra nop nop nop nop PROG_END nop nop
INT_PROG
#$0,r0 #$0,r4 #$3f,m0 #$3f,m4 a b #$0,x0 #$0,x1 #$0,y0 #$0,y1 #4,omr
; ebd
#60,_end x0,y0,a x:(r0)+,x1 x1,y1,a x:(r0)+,x0 a,b x0,y0,a x:(r0)+,x1 x1,y1,a b1,x:$ff sbr
y:(r4)+,y1 y:(r4)+,y0
y:(r4)+,y0
XDAT_START ; org dc dc dc
x:0 $262EB9 $86F2FE $E56A5F
Appendix A-2
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Power Consumption Benchmark
dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc
$616CAC $8FFD75 $9210A $A06D7B $CEA798 $8DFBF1 $A063D6 $6C6657 $C2A544 $A3662D $A4E762 $84F0F3 $E6F1B0 $B3829 $8BF7AE $63A94F $EF78DC $242DE5 $A3E0BA $EBAB6B $8726C8 $CA361 $2F6E86 $A57347 $4BE774 $8F349D $A1ED12 $4BFCE3 $EA26E0 $CD7D99 $4BA85E $27A43F $A8B10C $D3A55 $25EC6A $2A255B $A5F1F8 $2426D1 $AE6536 $CBBC37 $6235A4 $37F0D $63BEC2 $A5E4D3 $8CE810 $3FF09 $60E50E $CFFB2F $40753C $8262C5 $CA641A $EB3B4B $2DA928 $AB6641
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Appendix A-3
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Power Consumption Benchmark
dc dc dc dc dc dc dc XDAT_END YDAT_START ; org dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc
$28A7E6 $4E2127 $482FD4 $7257D $E53C72 $1A8C3 $E27540
y:0 $5B6DA $C3F70B $6A39E8 $81E801 $C666A6 $46F8E7 $AAEC94 $24233D $802732 $2E3C83 $A43E00 $C2B639 $85A47E $ABFDDF $F3A2C $2D7CF5 $E16A8A $ECB8FB $4BED18 $43F371 $83A556 $E1E9D7 $ACA2C4 $8135AD $2CE0E2 $8F2C73 $432730 $A87FA9 $4A292E $A63CCF $6BA65C $E06D65 $1AA3A $A1B6EB $48AC48 $EF7AE1 $6E3006 $62F6C7 $6064F4 $87E41D $CB2692 $2C3863 $C6BC60
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Appendix A-4
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MOTOROLA
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Power Consumption Benchmark
Freescale Semiconductor, Inc...
dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc dc YDAT_END
$43A519 $6139DE $ADF7BF $4B3E8C $6079D5 $E0F5EA $8230DB $A3B778 $2BFE51 $E0A6B6 $68FFB7 $28F324 $8F2E8D $667842 $83E053 $A1FD90 $6B2689 $85B68E $622EAF $6162BC $E4A245
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Appendix A-5
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NOTES
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APPENDIX B IBIS MODEL
[IBIS ver] 2.1 [File name] 56362.ibs [File Rev] 0.0 [Date] 29/6/2000 [Component] 56362 [Manufacturer] Motorola [Package] |variable typ R_pkg 45m L_pkg 2.5nH C_pkg 1.3pF
Freescale Semiconductor, Inc...
min 22m 1.1nH 1.2pF
max 75m 4.3nH 1.4pF
[Pin]signal_name model_name 1 sck ip5b_io 2 ss_ ip5b_io 3 hreq_ ip5b_io 4 sdo0 ip5b_io 5 sdo1 ip5b_io 6 sdoi23 ip5b_io 7 sdoi32 ip5b_io 8 svcc power 9 sgnd gnd 10 sdoi41 ip5b_io 11 sdoi50 ip5b_io 12 fst ip5b_io 13 fsr ip5b_io 14 sckt ip5b_io 15 sckr ip5b_io 16 hsckt ip5b_io 17 hsckr ip5b_io 18 qvccl power 19 gnd gnd 20 qvcch power 21 hp12 ip5b_io 22 hp11 ip5b_io 23 hp15 ip5b_io 24 hp14 ip5b_io 25 svcc power 26 sgnd gnd 27 ado ip5b_io 28 aci ip5b_io 29 tio ip5b_io 30 hp13 ip5b_io 31 hp10 ip5b_io 32 hp9 ip5b_io 33 hp8 ip5b_io
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Appendix B-1
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IBIS Model
34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88
hp7 hp6 hp5 hp4 svcc sgnd hp3 hp2 hp1 hp0 ires_ pvcc pcap pgnd pgnd1 qvcch aa3 aa2 cas_ de_ qgnd cxtldis_ qvccl cvcc cgnd clkout nmi_ ta_ br_ bb_ cvcc cgnd wr_ rd_ aa1 aa0 bg_ eab0 eab1 avcc agnd eab2 eab3 eab4 eab5 avcc agnd eab6 eab7 eab8 eab9 avcc agnd eab10
ip5b_io ip5b_io ip5b_io ip5b_io power gnd ip5b_io ip5b_io ip5b_io ip5b_io ip5b_i power power gnd gnd power icbc_o icbc_o icbc_o ipbw_io gnd iexlh_i power power gnd icba_o ipbw_i icbc_o icbc_o icbc_o power gnd icbc_o icbc_o icbc_o icbc_o icbc_o icba_o icba_o power gnd icba_o icba_o icba_o icba_o power gnd icba_o icba_o icba_o icba_o power gnd icba_o
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Appendix B-2
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IBIS Model
89 eab11 90 qgnd 91 qvcc 92 eab12 93 eab13 94 eab14 95 qvcch 96 agnd 97 eab15 98 eab16 99 eab17 100 edb0 101 edb1 102 edb2 103 dvcc 104 dgnd 105 edb3 106 edb4 107 edb5 108 edb6 109 edb7 110 edb8 111 dvcc 112 dgnd 113 edb9 114 edb10 115 edb11 116 edb12 117 edb13 118 edb14 119 dvcc 120 dgnd 121 edb15 122 edb16 123 edb17 124 edb18 125 edb19 126 qvccl 127 qgnd 128 edb20 129 dvcc 130 dgnd 131 edb21 132 edb22 133 edb23 134 irqd_ 135 irqc_ 136 irqb_ 137 irqa_ 138 trst_ 139 tdo 140 tdi 141 tck 142 tms
icba_o gnd power icba_o icba_o icba_o power gnd icba_o icba_o icba_o icba_io icba_io icba_io power gnd icba_io icba_io icba_io icba_io icba_io icba_io power gnd icba_io icba_io icba_io icba_io icba_io icba_io power gnd icba_io icba_io icba_io icba_io icba_io power gnd icba_io power gnd icba_io icba_io icba_io ip5b_i ip5b_i ip5b_i ip5b_i ip5b_i ip5b_o ip5b_i ip5b_i ip5b_i
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Appendix B-3
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IBIS Model
143 mosi ip5b_io 144 sda ip5b_io | [Model] ip5b_i Model_type Input Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [GND_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.21e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.61e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.43e+01 -4.52e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.67e+00 -9.00e-01 -9.69e-03 -1.18e+00 -7.81e-03 -7.00e-01 -2.83e-04 -5.70e-03 -8.42e-04 -5.00e-01 -1.35e-06 -4.53e-05 -1.00e-05 -3.00e-01 -1.31e-09 -3.74e-07 -8.58e-09 -1.00e-01 -2.92e-11 -3.00e-09 -3.64e-11 0.000e+00 -2.44e-11 -5.14e-10 -2.79e-11 | | [Model] ip5b_io Model_type I/O Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [Pulldown] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.21e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02
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Appendix B-4
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IBIS Model
-1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00
-1.63e+02 -1.13e+02 -7.83e+01 -4.43e+01 -1.02e+01 -5.10e-02 -3.65e-02 -2.65e-02 -1.62e-02 -5.49e-03 5.377e-03 1.516e-02 2.370e-02 3.098e-02 3.700e-02 4.175e-02 4.531e-02 4.779e-02 4.935e-02 5.013e-02 5.046e-02 5.063e-02 5.075e-02 5.085e-02 5.090e-02 4.771e-02 4.525e-02 4.657e-02 4.904e-02 5.221e-02 5.524e-02 5.634e-02 5.751e-02 5.634e-02 5.648e-02 5.664e-02 5.679e-02 5.693e-02 5.707e-02 5.722e-02 5.741e-02 5.766e-02 5.801e-02 5.824e-02
-1.17e+02 -9.25e+01 -6.88e+01 -4.52e+01 -2.15e+01 -1.18e+00 -2.25e-02 -1.38e-02 -8.35e-03 -2.80e-03 2.744e-03 7.871e-03 1.252e-02 1.667e-02 2.026e-02 2.324e-02 2.553e-02 2.709e-02 2.803e-02 2.851e-02 2.876e-02 2.892e-02 2.904e-02 2.912e-02 2.876e-02 2.994e-02 3.321e-02 3.570e-02 3.801e-02 4.029e-02 4.253e-02 4.463e-02 4.645e-02 4.786e-02 4.881e-02 4.912e-02 4.795e-02 4.679e-02 4.688e-02 4.700e-02 4.712e-02 4.723e-02 4.733e-02 4.737e-02
-1.61e+02 -1.10e+02 -7.58e+01 -4.17e+01 -7.69e+00 -5.63e-02 -4.28e-02 -3.12e-02 -1.91e-02 -6.52e-03 6.427e-03 1.823e-02 2.869e-02 3.776e-02 4.544e-02 5.171e-02 5.660e-02 6.023e-02 6.271e-02 6.419e-02 6.494e-02 6.525e-02 6.540e-02 6.549e-02 6.555e-02 6.561e-02 6.182e-02 6.049e-02 6.178e-02 6.450e-02 6.659e-02 6.867e-02 6.970e-02 6.938e-02 6.960e-02 6.983e-02 7.005e-02 7.026e-02 7.049e-02 7.074e-02 7.105e-02 7.147e-02 7.205e-02 7.242e-02
Freescale Semiconductor, Inc...
I(typ) 2.922e-04 2.881e-04 2.853e-04 2.836e-04 2.825e-04 2.819e-04
I(min) 2.177e-04 2.175e-04 2.173e-04 2.172e-04 2.171e-04 2.170e-04
I(max)
4.123e-04 4.021e-04 3.946e-04 3.893e-04 3.857e-04 3.834e-04
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Appendix B-5
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IBIS Model
-2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [GND_clamp] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00
2.815e-04 2.813e-04 2.812e-04 2.811e-04 2.810e-04 2.809e-04 2.808e-04 2.997e-04 1.750e-02 1.048e-02 3.487e-03 -3.40e-03 -9.69e-03 -1.52e-02 -2.02e-02 -2.46e-02 -2.84e-02 -3.14e-02 -3.37e-02 -3.55e-02 -3.68e-02 -3.78e-02 -3.85e-02 -3.91e-02 -3.96e-02 -4.01e-02 -4.04e-02 -4.08e-02 -4.11e-02 -4.14e-02 -4.17e-02 -4.32e-02 -4.08e-01 -2.73e+01 -6.13e+01 -9.54e+01 -1.38e+02 -1.89e+02 -2.40e+02 -2.91e+02 -3.42e+02 -3.93e+02 -4.44e+02 -4.95e+02 -5.21e+02
2.169e-04 2.167e-04 2.520e-04 3.078e-02 2.684e-02 2.277e-02 1.864e-02 1.447e-02 1.031e-02 6.181e-03 2.084e-03 -2.03e-03 -5.71e-03 -8.99e-03 -1.19e-02 -1.43e-02 -1.62e-02 -1.77e-02 -1.88e-02 -1.95e-02 -2.00e-02 -2.04e-02 -2.07e-02 -2.10e-02 -2.12e-02 -2.15e-02 -2.17e-02 -2.18e-02 -2.20e-02 -2.78e-02 -1.20e+00 -2.15e+01 -4.52e+01 -6.89e+01 -9.25e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.59e+02 -2.94e+02 -3.30e+02 -3.65e+02 -4.01e+02 -4.18e+02
3.820e-04 3.812e-04 3.808e-04 3.806e-04 3.804e-04 3.802e-04 3.801e-04 3.799e-04 3.797e-04 3.776e-04 4.568e-03 -4.22e-03 -1.24e-02 -1.95e-02 -2.61e-02 -3.21e-02 -3.73e-02 -4.18e-02 -4.55e-02 -4.85e-02 -5.09e-02 -5.27e-02 -5.41e-02 -5.51e-02 -5.60e-02 -5.67e-02 -5.74e-02 -5.79e-02 -5.84e-02 -5.89e-02 -5.94e-02 -5.98e-02 -6.10e-02 -6.84e-02 -7.73e+00 -4.18e+01 -7.59e+01 -1.11e+02 -1.61e+02 -2.12e+02 -2.63e+02 -3.14e+02 -3.65e+02 -4.16e+02 -4.41e+02
Freescale Semiconductor, Inc...
I(typ) -5.21e+02 -4.69e+02 -4.18e+02 -3.67e+02 -3.16e+02
I(min) -3.65e+02 -3.30e+02 -2.94e+02 -2.59e+02 -2.23e+02
I(max) -5.18e+02 -4.67e+02 -4.16e+02 -3.65e+02 -3.14e+02
Appendix B-6
DSP56362 Advance Information
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MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
-2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.61e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.43e+01 -4.52e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.67e+00 -9.00e-01 -9.69e-03 -1.18e+00 -7.81e-03 -7.00e-01 -2.83e-04 -5.70e-03 -8.42e-04 -5.00e-01 -1.35e-06 -4.53e-05 -1.00e-05 -3.00e-01 -1.31e-09 -3.74e-07 -8.58e-09 -1.00e-01 -2.92e-11 -3.00e-09 -3.64e-11 0.000e+00 -2.44e-11 -5.14e-10 -2.79e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.030/0.465 0.605/0.676 1.320/0.366 | | dV/dt_f 1.290/0.671 0.829/0.122 1.520/0.431 | | [Model] ip5b_o Model_type 3-state Polarity Non-Inverting C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [Pulldown] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.21e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.61e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.43e+01 -4.52e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.69e+00 -9.00e-01 -5.10e-02 -1.18e+00 -5.63e-02 -7.00e-01 -3.65e-02 -2.25e-02 -4.28e-02 -5.00e-01 -2.65e-02 -1.38e-02 -3.12e-02 -3.00e-01 -1.62e-02 -8.35e-03 -1.91e-02 -1.00e-01 -5.49e-03 -2.80e-03 -6.52e-03 1.000e-01 5.377e-03 2.744e-03 6.427e-03 3.000e-01 1.516e-02 7.871e-03 1.823e-02
Freescale Semiconductor, Inc...
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-7
Freescale Semiconductor, Inc.
IBIS Model
5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01
Freescale Semiconductor, Inc...
2.370e-02 3.098e-02 3.700e-02 4.175e-02 4.531e-02 4.779e-02 4.935e-02 5.013e-02 5.046e-02 5.063e-02 5.075e-02 5.085e-02 5.090e-02 4.771e-02 4.525e-02 4.657e-02 4.904e-02 5.221e-02 5.524e-02 5.634e-02 5.751e-02 5.634e-02 5.648e-02 5.664e-02 5.679e-02 5.693e-02 5.707e-02 5.722e-02 5.741e-02 5.766e-02 5.801e-02 5.824e-02
1.252e-02 1.667e-02 2.026e-02 2.324e-02 2.553e-02 2.709e-02 2.803e-02 2.851e-02 2.876e-02 2.892e-02 2.904e-02 2.912e-02 2.876e-02 2.994e-02 3.321e-02 3.570e-02 3.801e-02 4.029e-02 4.253e-02 4.463e-02 4.645e-02 4.786e-02 4.881e-02 4.912e-02 4.795e-02 4.679e-02 4.688e-02 4.700e-02 4.712e-02 4.723e-02 4.733e-02 4.737e-02
2.869e-02 3.776e-02 4.544e-02 5.171e-02 5.660e-02 6.023e-02 6.271e-02 6.419e-02 6.494e-02 6.525e-02 6.540e-02 6.549e-02 6.555e-02 6.561e-02 6.182e-02 6.049e-02 6.178e-02 6.450e-02 6.659e-02 6.867e-02 6.970e-02 6.938e-02 6.960e-02 6.983e-02 7.005e-02 7.026e-02 7.049e-02 7.074e-02 7.105e-02 7.147e-02 7.205e-02 7.242e-02
I(typ) 2.922e-04 2.881e-04 2.853e-04 2.836e-04 2.825e-04 2.819e-04 2.815e-04 2.813e-04 2.812e-04 2.811e-04 2.810e-04 2.809e-04 2.808e-04 2.997e-04 1.750e-02 1.048e-02 3.487e-03 -3.40e-03
I(min) 2.177e-04 2.175e-04 2.173e-04 2.172e-04 2.171e-04 2.170e-04 2.169e-04 2.167e-04 2.520e-04 3.078e-02 2.684e-02 2.277e-02 1.864e-02 1.447e-02 1.031e-02 6.181e-03 2.084e-03 -2.03e-03
I(max) 4.123e-04 4.021e-04 3.946e-04 3.893e-04 3.857e-04 3.834e-04 3.820e-04 3.812e-04 3.808e-04 3.806e-04 3.804e-04 3.802e-04 3.801e-04 3.799e-04 3.797e-04 3.776e-04 4.568e-03 -4.22e-03
Appendix B-8
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [GND_clamp] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01
Freescale Semiconductor, Inc...
-9.69e-03 -1.52e-02 -2.02e-02 -2.46e-02 -2.84e-02 -3.14e-02 -3.37e-02 -3.55e-02 -3.68e-02 -3.78e-02 -3.85e-02 -3.91e-02 -3.96e-02 -4.01e-02 -4.04e-02 -4.08e-02 -4.11e-02 -4.14e-02 -4.17e-02 -4.32e-02 -4.08e-01 -2.73e+01 -6.13e+01 -9.54e+01 -1.38e+02 -1.89e+02 -2.40e+02 -2.91e+02 -3.42e+02 -3.93e+02 -4.44e+02 -4.95e+02 -5.21e+02
-5.71e-03 -8.99e-03 -1.19e-02 -1.43e-02 -1.62e-02 -1.77e-02 -1.88e-02 -1.95e-02 -2.00e-02 -2.04e-02 -2.07e-02 -2.10e-02 -2.12e-02 -2.15e-02 -2.17e-02 -2.18e-02 -2.20e-02 -2.78e-02 -1.20e+00 -2.15e+01 -4.52e+01 -6.89e+01 -9.25e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.59e+02 -2.94e+02 -3.30e+02 -3.65e+02 -4.01e+02 -4.18e+02
-1.24e-02 -1.95e-02 -2.61e-02 -3.21e-02 -3.73e-02 -4.18e-02 -4.55e-02 -4.85e-02 -5.09e-02 -5.27e-02 -5.41e-02 -5.51e-02 -5.60e-02 -5.67e-02 -5.74e-02 -5.79e-02 -5.84e-02 -5.89e-02 -5.94e-02 -5.98e-02 -6.10e-02 -6.84e-02 -7.73e+00 -4.18e+01 -7.59e+01 -1.11e+02 -1.61e+02 -2.12e+02 -2.63e+02 -3.14e+02 -3.65e+02 -4.16e+02 -4.41e+02
I(typ) -5.21e+02 -4.69e+02 -4.18e+02 -3.67e+02 -3.16e+02 -2.65e+02 -2.14e+02 -1.63e+02 -1.13e+02 -7.83e+01 -4.43e+01 -1.02e+01 -9.69e-03 -2.83e-04 -1.35e-06 -1.31e-09 -2.92e-11
I(min) -3.65e+02 -3.30e+02 -2.94e+02 -2.59e+02 -2.23e+02 -1.88e+02 -1.52e+02 -1.17e+02 -9.25e+01 -6.88e+01 -4.52e+01 -2.15e+01 -1.18e+00 -5.70e-03 -4.53e-05 -3.74e-07 -3.00e-09
I(max)
-5.18e+02 -4.67e+02 -4.16e+02 -3.65e+02 -3.14e+02 -2.63e+02 -2.12e+02 -1.61e+02 -1.10e+02 -7.58e+01 -4.17e+01 -7.67e+00 -7.81e-03 -8.42e-04 -1.00e-05 -8.58e-09 -3.64e-11
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-9
Freescale Semiconductor, Inc.
IBIS Model
0.000e+00 -2.44e-11 -5.14e-10 -2.79e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.030/0.465 0.605/0.676 1.320/0.366 | | dV/dt_f 1.290/0.671 0.829/0.122 1.520/0.431 | | [Model] icba_io Model_type I/O Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [Pulldown] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.20e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.43e+01 -4.52e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.68e+00 -9.00e-01 -2.70e-02 -1.19e+00 -2.90e-02 -7.00e-01 -1.32e-02 -1.25e-02 -1.63e-02 -5.00e-01 -9.33e-03 -4.69e-03 -1.10e-02 -3.00e-01 -5.75e-03 -2.81e-03 -6.76e-03 -1.00e-01 -1.97e-03 -9.48e-04 -2.32e-03 1.000e-01 1.945e-03 9.285e-04 2.307e-03 3.000e-01 5.507e-03 2.640e-03 6.599e-03 5.000e-01 8.649e-03 4.168e-03 1.048e-02 7.000e-01 1.136e-02 5.504e-03 1.393e-02 9.000e-01 1.364e-02 6.636e-03 1.693e-02 1.100e+00 1.547e-02 7.551e-03 1.950e-02 1.300e+00 1.688e-02 8.240e-03 2.162e-02 1.500e+00 1.299e-01 6.458e-02 2.331e-02 1.700e+00 1.366e-01 6.746e-02 1.755e-01 1.900e+00 1.404e-01 6.916e-02 1.847e-01 2.100e+00 1.423e-01 7.006e-02 1.907e-01 2.300e+00 1.433e-01 7.059e-02 1.940e-01
Freescale Semiconductor, Inc...
Appendix B-10
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00
Freescale Semiconductor, Inc...
1.440e-01 1.445e-01 1.450e-01 1.454e-01 1.458e-01 1.461e-01 1.464e-01 1.469e-01 1.490e-01 1.501e+00 1.813e+01 3.540e+01 5.269e+01 7.541e+01 1.012e+02 1.270e+02 1.527e+02 1.785e+02 2.043e+02 2.301e+02 2.559e+02 2.688e+02
7.098e-02 7.128e-02 7.154e-02 7.176e-02 7.196e-02 7.223e-02 8.810e-02 2.589e+00 1.451e+01 2.658e+01 3.866e+01 5.076e+01 6.461e+01 8.261e+01 1.006e+02 1.186e+02 1.366e+02 1.546e+02 1.726e+02 1.906e+02 2.086e+02 2.176e+02
1.958e-01 1.970e-01 1.979e-01 1.986e-01 1.993e-01 1.999e-01 2.004e-01 2.009e-01 2.015e-01 2.030e-01 2.385e-01 9.563e+00 2.682e+01 4.409e+01 6.258e+01 8.836e+01 1.141e+02 1.399e+02 1.657e+02 1.915e+02 2.173e+02 2.302e+02
I(typ) 2.686e+02 2.428e+02 2.170e+02 1.912e+02 1.655e+02 1.397e+02 1.139e+02 8.814e+01 6.237e+01 4.389e+01 2.662e+01 9.360e+00 4.275e-02 8.208e-03 5.635e-03 3.370e-03 1.118e-03 -1.09e-03 -3.12e-03 -4.96e-03 -6.60e-03 -8.04e-03 -9.26e-03 -1.03e-02 -1.25e-01 -1.31e-01 -1.36e-01 -1.40e-01
I(min) 1.905e+02 1.725e+02 1.545e+02 1.365e+02 1.185e+02 1.005e+02 8.253e+01 6.454e+01 5.068e+01 3.859e+01 2.651e+01 1.444e+01 2.518e+00 2.012e-02 3.518e-03 2.053e-03 6.789e-04 -6.56e-04 -1.86e-03 -2.93e-03 -3.87e-03 -4.66e-03 -5.30e-03 -6.55e-02 -6.93e-02 -7.19e-02 -7.38e-02 -7.53e-02
I(max)
2.686e+02 2.428e+02 2.170e+02 1.912e+02 1.655e+02 1.397e+02 1.139e+02 8.814e+01 6.237e+01 4.389e+01 2.662e+01 9.362e+00 4.663e-02 1.070e-02 7.068e-03 4.233e-03 1.410e-03 -1.38e-03 -3.99e-03 -6.39e-03 -8.59e-03 -1.06e-02 -1.23e-02 -1.38e-02 -1.70e-01 -1.82e-01 -1.91e-01 -1.97e-01
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-11
Freescale Semiconductor, Inc.
IBIS Model
2.300e+00 -1.42e-01 2.500e+00 -1.44e-01 2.700e+00 -1.46e-01 2.900e+00 -1.48e-01 3.100e+00 -1.49e-01 3.300e+00 -1.50e-01 3.500e+00 -1.52e-01 3.700e+00 -1.53e-01 3.900e+00 -1.54e-01 4.100e+00 -1.57e-01 4.300e+00 -5.25e-01 4.500e+00 -2.74e+01 4.700e+00 -6.14e+01 4.900e+00 -9.55e+01 5.100e+00 -1.38e+02 5.300e+00 -1.89e+02 5.500e+00 -2.40e+02 5.700e+00 -2.91e+02 5.900e+00 -3.42e+02 6.100e+00 -3.93e+02 6.300e+00 -4.44e+02 6.500e+00 -4.95e+02 6.600e+00 -5.21e+02 | [GND_clamp] |voltage I(typ) | -3.30e+00 -5.20e+02 -3.10e+00 -4.69e+02 -2.90e+00 -4.18e+02 -2.70e+00 -3.67e+02 -2.50e+00 -3.16e+02 -2.30e+00 -2.65e+02 -2.10e+00 -2.14e+02 -1.90e+00 -1.63e+02 -1.70e+00 -1.13e+02 -1.50e+00 -7.83e+01 -1.30e+00 -4.43e+01 -1.10e+00 -1.02e+01 -9.00e-01 -1.22e-02 -7.00e-01 -5.18e-04 -5.00e-01 -2.43e-06 -3.00e-01 -2.33e-09 -1.00e-01 -2.10e-11 0.000e+00 -1.70e-11 | [POWER_clamp] |voltage I(typ) | -3.30e+00 2.686e+02 -3.10e+00 2.428e+02 -2.90e+00 2.170e+02 -2.70e+00 1.912e+02 -2.50e+00 1.655e+02
Freescale Semiconductor, Inc...
-7.65e-02 -7.76e-02 -7.85e-02 -7.93e-02 -8.00e-02 -8.06e-02 -8.13e-02 -8.84e-02 -1.26e+00 -2.16e+01 -4.53e+01 -6.89e+01 -9.26e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.59e+02 -2.94e+02 -3.30e+02 -3.65e+02 -4.01e+02 -4.19e+02
-2.03e-01 -2.07e-01 -2.10e-01 -2.13e-01 -2.15e-01 -2.17e-01 -2.19e-01 -2.21e-01 -2.22e-01 -2.24e-01 -2.27e-01 -2.38e-01 -7.90e+00 -4.20e+01 -7.60e+01 -1.11e+02 -1.61e+02 -2.12e+02 -2.63e+02 -3.14e+02 -3.65e+02 -4.16e+02 -4.42e+02
I(min) -3.65e+02 -3.30e+02 -2.94e+02 -2.59e+02 -2.23e+02 -1.88e+02 -1.52e+02 -1.17e+02 -9.25e+01 -6.88e+01 -4.52e+01 -2.15e+01 -1.18e+00 -6.62e-03 -6.64e-05 -6.35e-07 -6.31e-09 -1.95e-09
I(max) -5.18e+02 -4.67e+02 -4.16e+02 -3.65e+02 -3.14e+02 -2.63e+02 -2.12e+02 -1.60e+02 -1.10e+02 -7.58e+01 -4.17e+01 -7.67e+00 -1.17e-02 -1.56e-03 -1.80e-05 -1.54e-08 -2.99e-11 -1.91e-11
I(min) 1.905e+02 1.725e+02 1.545e+02 1.365e+02 1.185e+02
I(max) 2.686e+02 2.428e+02 2.170e+02 1.912e+02 1.655e+02
Appendix B-12
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
-2.30e+00 1.397e+02 1.005e+02 1.397e+02 -2.10e+00 1.139e+02 8.253e+01 1.139e+02 -1.90e+00 8.814e+01 6.454e+01 8.814e+01 -1.70e+00 6.236e+01 5.068e+01 6.237e+01 -1.50e+00 4.389e+01 3.859e+01 4.389e+01 -1.30e+00 2.662e+01 2.651e+01 2.662e+01 -1.10e+00 9.358e+00 1.444e+01 9.359e+00 -9.00e-01 3.399e-02 2.517e+00 3.554e-02 -7.00e-01 3.426e-04 1.577e-02 9.211e-04 -5.00e-01 2.840e-06 7.857e-05 1.655e-05 -3.00e-01 3.401e-09 6.836e-07 1.946e-08 -1.00e-01 6.162e-11 7.379e-09 7.622e-11 0.000e+00 5.758e-11 2.438e-09 6.240e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.680/0.164 1.360/0.329 1.900/0.124 | | dV/dt_f 1.690/0.219 1.310/0.442 1.880/0.155 | | [Model] icba_o Model_type 3-state Polarity Non-Inverting C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [Pulldown] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.20e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.12e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.43e+01 -4.52e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.68e+00 -9.00e-01 -2.70e-02 -1.19e+00 -2.90e-02 -7.00e-01 -1.32e-02 -1.25e-02 -1.63e-02 -5.00e-01 -9.33e-03 -4.69e-03 -1.10e-02 -3.00e-01 -5.75e-03 -2.81e-03 -6.76e-03 -1.00e-01 -1.97e-03 -9.48e-04 -2.32e-03 1.000e-01 1.945e-03 9.285e-04 2.307e-03 3.000e-01 5.507e-03 2.640e-03 6.599e-03
Freescale Semiconductor, Inc...
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-13
Freescale Semiconductor, Inc.
IBIS Model
5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01
Freescale Semiconductor, Inc...
8.649e-03 1.136e-02 1.364e-02 1.547e-02 1.688e-02 1.299e-01 1.366e-01 1.404e-01 1.423e-01 1.433e-01 1.440e-01 1.445e-01 1.450e-01 1.454e-01 1.458e-01 1.461e-01 1.464e-01 1.469e-01 1.490e-01 1.501e+00 1.813e+01 3.540e+01 5.269e+01 7.541e+01 1.012e+02 1.270e+02 1.527e+02 1.785e+02 2.043e+02 2.301e+02 2.559e+02 2.688e+02
4.168e-03 5.504e-03 6.636e-03 7.551e-03 8.240e-03 6.458e-02 6.746e-02 6.916e-02 7.006e-02 7.059e-02 7.098e-02 7.128e-02 7.154e-02 7.176e-02 7.196e-02 7.223e-02 8.810e-02 2.589e+00 1.451e+01 2.658e+01 3.866e+01 5.076e+01 6.461e+01 8.261e+01 1.006e+02 1.186e+02 1.366e+02 1.546e+02 1.726e+02 1.906e+02 2.086e+02 2.176e+02
1.048e-02 1.393e-02 1.693e-02 1.950e-02 2.162e-02 2.331e-02 1.755e-01 1.847e-01 1.907e-01 1.940e-01 1.958e-01 1.970e-01 1.979e-01 1.986e-01 1.993e-01 1.999e-01 2.004e-01 2.009e-01 2.015e-01 2.030e-01 2.385e-01 9.563e+00 2.682e+01 4.409e+01 6.258e+01 8.836e+01 1.141e+02 1.399e+02 1.657e+02 1.915e+02 2.173e+02 2.302e+02
I(typ) 2.686e+02 2.428e+02 2.170e+02 1.912e+02 1.655e+02 1.397e+02 1.139e+02 8.814e+01 6.237e+01 4.389e+01 2.662e+01 9.360e+00 4.275e-02 8.208e-03 5.635e-03 3.370e-03 1.118e-03 -1.09e-03
I(min) 1.905e+02 1.725e+02 1.545e+02 1.365e+02 1.185e+02 1.005e+02 8.253e+01 6.454e+01 5.068e+01 3.859e+01 2.651e+01 1.444e+01 2.518e+00 2.012e-02 3.518e-03 2.053e-03 6.789e-04 -6.56e-04
I(max) 2.686e+02 2.428e+02 2.170e+02 1.912e+02 1.655e+02 1.397e+02 1.139e+02 8.814e+01 6.237e+01 4.389e+01 2.662e+01 9.362e+00 4.663e-02 1.070e-02 7.068e-03 4.233e-03 1.410e-03 -1.38e-03
Appendix B-14
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [GND_clamp] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01
Freescale Semiconductor, Inc...
-3.12e-03 -4.96e-03 -6.60e-03 -8.04e-03 -9.26e-03 -1.03e-02 -1.25e-01 -1.31e-01 -1.36e-01 -1.40e-01 -1.42e-01 -1.44e-01 -1.46e-01 -1.48e-01 -1.49e-01 -1.50e-01 -1.52e-01 -1.53e-01 -1.54e-01 -1.57e-01 -5.25e-01 -2.74e+01 -6.14e+01 -9.55e+01 -1.38e+02 -1.89e+02 -2.40e+02 -2.91e+02 -3.42e+02 -3.93e+02 -4.44e+02 -4.95e+02 -5.21e+02
-1.86e-03 -2.93e-03 -3.87e-03 -4.66e-03 -5.30e-03 -6.55e-02 -6.93e-02 -7.19e-02 -7.38e-02 -7.53e-02 -7.65e-02 -7.76e-02 -7.85e-02 -7.93e-02 -8.00e-02 -8.06e-02 -8.13e-02 -8.84e-02 -1.26e+00 -2.16e+01 -4.53e+01 -6.89e+01 -9.26e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.59e+02 -2.94e+02 -3.30e+02 -3.65e+02 -4.01e+02 -4.19e+02
-3.99e-03 -6.39e-03 -8.59e-03 -1.06e-02 -1.23e-02 -1.38e-02 -1.70e-01 -1.82e-01 -1.91e-01 -1.97e-01 -2.03e-01 -2.07e-01 -2.10e-01 -2.13e-01 -2.15e-01 -2.17e-01 -2.19e-01 -2.21e-01 -2.22e-01 -2.24e-01 -2.27e-01 -2.38e-01 -7.90e+00 -4.20e+01 -7.60e+01 -1.11e+02 -1.61e+02 -2.12e+02 -2.63e+02 -3.14e+02 -3.65e+02 -4.16e+02 -4.42e+02
I(typ) -5.20e+02 -4.69e+02 -4.18e+02 -3.67e+02 -3.16e+02 -2.65e+02 -2.14e+02 -1.63e+02 -1.13e+02 -7.83e+01 -4.43e+01 -1.02e+01 -1.22e-02 -5.18e-04 -2.43e-06 -2.33e-09 -2.10e-11
I(min) -3.65e+02 -3.30e+02 -2.94e+02 -2.59e+02 -2.23e+02 -1.88e+02 -1.52e+02 -1.17e+02 -9.25e+01 -6.88e+01 -4.52e+01 -2.15e+01 -1.18e+00 -6.62e-03 -6.64e-05 -6.35e-07 -6.31e-09
I(max)
-5.18e+02 -4.67e+02 -4.16e+02 -3.65e+02 -3.14e+02 -2.63e+02 -2.12e+02 -1.60e+02 -1.10e+02 -7.58e+01 -4.17e+01 -7.67e+00 -1.17e-02 -1.56e-03 -1.80e-05 -1.54e-08 -2.99e-11
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-15
Freescale Semiconductor, Inc.
IBIS Model
0.000e+00 -1.70e-11 -1.95e-09 -1.91e-11 | [POWER_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 2.686e+02 1.905e+02 2.686e+02 -3.10e+00 2.428e+02 1.725e+02 2.428e+02 -2.90e+00 2.170e+02 1.545e+02 2.170e+02 -2.70e+00 1.912e+02 1.365e+02 1.912e+02 -2.50e+00 1.655e+02 1.185e+02 1.655e+02 -2.30e+00 1.397e+02 1.005e+02 1.397e+02 -2.10e+00 1.139e+02 8.253e+01 1.139e+02 -1.90e+00 8.814e+01 6.454e+01 8.814e+01 -1.70e+00 6.236e+01 5.068e+01 6.237e+01 -1.50e+00 4.389e+01 3.859e+01 4.389e+01 -1.30e+00 2.662e+01 2.651e+01 2.662e+01 -1.10e+00 9.358e+00 1.444e+01 9.359e+00 -9.00e-01 3.399e-02 2.517e+00 3.554e-02 -7.00e-01 3.426e-04 1.577e-02 9.211e-04 -5.00e-01 2.840e-06 7.857e-05 1.655e-05 -3.00e-01 3.401e-09 6.836e-07 1.946e-08 -1.00e-01 6.162e-11 7.379e-09 7.622e-11 0.000e+00 5.758e-11 2.438e-09 6.240e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.680/0.164 1.360/0.329 1.900/0.124 | | dV/dt_f 1.690/0.219 1.310/0.442 1.880/0.155 | | [Model] icbc_o Model_type 3-state Polarity Non-Inverting C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [Pulldown] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.20e+02 -3.65e+02 -5.18e+02 -3.10e+00 -4.69e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.16e+02 -2.70e+00 -3.67e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.14e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.63e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.11e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02
Freescale Semiconductor, Inc...
Appendix B-16
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
-1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00
-7.83e+01 -4.42e+01 -1.02e+01 -2.51e-02 -1.30e-02 -9.33e-03 -5.75e-03 -1.97e-03 1.945e-03 5.507e-03 8.649e-03 1.136e-02 1.364e-02 1.547e-02 1.688e-02 9.632e-02 1.012e-01 1.039e-01 1.053e-01 1.060e-01 1.065e-01 1.069e-01 1.073e-01 1.076e-01 1.078e-01 1.081e-01 1.083e-01 1.086e-01 1.103e-01 1.437e+00 1.800e+01 3.519e+01 5.241e+01 7.505e+01 1.007e+02 1.264e+02 1.522e+02 1.779e+02 2.036e+02 2.293e+02 2.550e+02 2.678e+02
-6.88e+01 -4.51e+01 -2.15e+01 -1.18e+00 -1.16e-02 -4.67e-03 -2.81e-03 -9.48e-04 9.285e-04 2.640e-03 4.168e-03 5.504e-03 6.636e-03 7.551e-03 8.240e-03 4.783e-02 4.994e-02 5.118e-02 5.184e-02 5.223e-02 5.251e-02 5.274e-02 5.293e-02 5.309e-02 5.324e-02 5.344e-02 6.705e-02 2.529e+00 1.438e+01 2.638e+01 3.839e+01 5.041e+01 6.419e+01 8.210e+01 1.000e+02 1.179e+02 1.359e+02 1.538e+02 1.717e+02 1.896e+02 2.075e+02 2.165e+02
-7.58e+01 -4.17e+01 -7.67e+00 -2.65e-02 -1.58e-02 -1.10e-02 -6.76e-03 -2.32e-03 2.307e-03 6.599e-03 1.048e-02 1.393e-02 1.693e-02 1.950e-02 2.162e-02 2.331e-02 1.302e-01 1.369e-01 1.412e-01 1.436e-01 1.449e-01 1.458e-01 1.464e-01 1.470e-01 1.475e-01 1.479e-01 1.483e-01 1.487e-01 1.491e-01 1.503e-01 1.810e-01 9.452e+00 2.664e+01 4.384e+01 6.224e+01 8.794e+01 1.136e+02 1.394e+02 1.651e+02 1.908e+02 2.165e+02 2.293e+02
Freescale Semiconductor, Inc...
I(typ) 2.677e+02 2.420e+02 2.163e+02 1.906e+02 1.649e+02 1.392e+02 1.135e+02 8.778e+01
I(min) 1.896e+02 1.716e+02 1.537e+02 1.358e+02 1.179e+02 9.996e+01 8.205e+01 6.413e+01
I(max)
2.677e+02 2.420e+02 2.163e+02 1.906e+02 1.649e+02 1.392e+02 1.135e+02 8.778e+01
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-17
Freescale Semiconductor, Inc.
IBIS Model
-1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 | [GND_clamp] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00
6.208e+01 4.368e+01 2.649e+01 9.302e+00 3.838e-02 8.115e-03 5.634e-03 3.370e-03 1.118e-03 -1.09e-03 -3.12e-03 -4.96e-03 -6.60e-03 -8.04e-03 -9.26e-03 -1.03e-02 -9.03e-02 -9.49e-02 -9.84e-02 -1.01e-01 -1.03e-01 -1.05e-01 -1.06e-01 -1.07e-01 -1.08e-01 -1.09e-01 -1.10e-01 -1.11e-01 -1.11e-01 -1.14e-01 -4.76e-01 -2.73e+01 -6.14e+01 -9.54e+01 -1.38e+02 -1.89e+02 -2.40e+02 -2.91e+02 -3.42e+02 -3.93e+02 -4.44e+02 -4.95e+02 -5.20e+02
5.035e+01 3.834e+01 2.633e+01 1.433e+01 2.477e+00 1.789e-02 3.503e-03 2.053e-03 6.789e-04 -6.56e-04 -1.86e-03 -2.93e-03 -3.87e-03 -4.66e-03 -5.30e-03 -4.75e-02 -5.02e-02 -5.21e-02 -5.34e-02 -5.45e-02 -5.54e-02 -5.62e-02 -5.68e-02 -5.74e-02 -5.79e-02 -5.84e-02 -5.89e-02 -6.49e-02 -1.23e+00 -2.16e+01 -4.52e+01 -6.89e+01 -9.25e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.59e+02 -2.94e+02 -3.30e+02 -3.65e+02 -4.01e+02 -4.18e+02
6.208e+01 4.368e+01 2.649e+01 9.303e+00 4.183e-02 1.045e-02 7.064e-03 4.233e-03 1.410e-03 -1.38e-03 -3.99e-03 -6.39e-03 -8.59e-03 -1.06e-02 -1.23e-02 -1.41e-02 -1.23e-01 -1.31e-01 -1.38e-01 -1.43e-01 -1.47e-01 -1.50e-01 -1.52e-01 -1.54e-01 -1.56e-01 -1.57e-01 -1.59e-01 -1.60e-01 -1.61e-01 -1.62e-01 -1.64e-01 -1.73e-01 -7.82e+00 -4.19e+01 -7.59e+01 -1.11e+02 -1.61e+02 -2.12e+02 -2.63e+02 -3.14e+02 -3.65e+02 -4.16e+02 -4.41e+02
Freescale Semiconductor, Inc...
I(typ) -5.20e+02 -4.69e+02 -4.18e+02 -3.67e+02 -3.16e+02 -2.65e+02 -2.14e+02
I(min) -3.65e+02 -3.30e+02 -2.94e+02 -2.59e+02 -2.23e+02 -1.88e+02 -1.52e+02
I(max) -5.18e+02 -4.67e+02 -4.16e+02 -3.65e+02 -3.14e+02 -2.63e+02 -2.11e+02
Appendix B-18
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
-1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.25e+01 -1.10e+02 -1.50e+00 -7.83e+01 -6.88e+01 -7.58e+01 -1.30e+00 -4.42e+01 -4.51e+01 -4.17e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.66e+00 -9.00e-01 -1.03e-02 -1.17e+00 -9.27e-03 -7.00e-01 -3.74e-04 -5.73e-03 -1.14e-03 -5.00e-01 -1.72e-06 -5.06e-05 -1.28e-05 -3.00e-01 -1.67e-09 -4.65e-07 -1.10e-08 -1.00e-01 -2.03e-11 -4.80e-09 -2.71e-11 0.000e+00 -1.69e-11 -1.61e-09 -1.89e-11 | [POWER_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 2.677e+02 1.896e+02 2.677e+02 -3.10e+00 2.420e+02 1.716e+02 2.420e+02 -2.90e+00 2.163e+02 1.537e+02 2.163e+02 -2.70e+00 1.906e+02 1.358e+02 1.906e+02 -2.50e+00 1.649e+02 1.179e+02 1.649e+02 -2.30e+00 1.392e+02 9.996e+01 1.392e+02 -2.10e+00 1.135e+02 8.205e+01 1.135e+02 -1.90e+00 8.778e+01 6.413e+01 8.778e+01 -1.70e+00 6.208e+01 5.035e+01 6.208e+01 -1.50e+00 4.368e+01 3.834e+01 4.368e+01 -1.30e+00 2.649e+01 2.633e+01 2.649e+01 -1.10e+00 9.300e+00 1.433e+01 9.301e+00 -9.00e-01 2.962e-02 2.475e+00 3.075e-02 -7.00e-01 2.501e-04 1.354e-02 6.708e-04 -5.00e-01 2.066e-06 6.280e-05 1.204e-05 -3.00e-01 2.487e-09 5.128e-07 1.417e-08 -1.00e-01 5.672e-11 5.639e-09 6.832e-11 0.000e+00 5.334e-11 1.992e-09 5.783e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.570/0.200 1.210/0.411 1.810/0.149 | | dV/dt_f 1.590/0.304 1.170/0.673 1.800/0.205 | | [Model] ipbw_i Model_type Input Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v
Freescale Semiconductor, Inc...
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-19
Freescale Semiconductor, Inc.
IBIS Model
[GND_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.20e+02 -3.65e+02 -5.17e+02 -3.10e+00 -4.69e+02 -3.29e+02 -4.66e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.15e+02 -2.70e+00 -3.67e+02 -2.58e+02 -3.64e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.13e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.62e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.11e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.24e+01 -1.10e+02 -1.50e+00 -7.82e+01 -6.87e+01 -7.57e+01 -1.30e+00 -4.42e+01 -4.51e+01 -4.16e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.64e+00 -9.00e-01 -7.17e-03 -1.16e+00 -4.87e-03 -7.00e-01 -1.14e-04 -4.39e-03 -3.03e-04 -5.00e-01 -4.86e-07 -2.55e-05 -2.73e-06 -3.00e-01 -5.19e-10 -1.91e-07 -2.57e-09 -1.00e-01 -1.91e-11 -2.47e-09 -2.19e-11 0.000e+00 -1.68e-11 -1.17e-09 -1.84e-11 | [POWER_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 2.667e+02 1.885e+02 2.667e+02 -3.10e+00 2.411e+02 1.707e+02 2.411e+02 -2.90e+00 2.155e+02 1.528e+02 2.155e+02 -2.70e+00 1.898e+02 1.350e+02 1.898e+02 -2.50e+00 1.642e+02 1.172e+02 1.642e+02 -2.30e+00 1.386e+02 9.935e+01 1.386e+02 -2.10e+00 1.130e+02 8.152e+01 1.130e+02 -1.90e+00 8.739e+01 6.369e+01 8.739e+01 -1.70e+00 6.178e+01 4.999e+01 6.178e+01 -1.50e+00 4.346e+01 3.806e+01 4.346e+01 -1.30e+00 2.634e+01 2.613e+01 2.634e+01 -1.10e+00 9.237e+00 1.421e+01 9.237e+00 -9.00e-01 2.454e-02 2.430e+00 2.488e-02 -7.00e-01 8.741e-05 1.104e-02 2.050e-04 -5.00e-01 6.316e-07 4.079e-05 2.961e-06 -3.00e-01 8.479e-10 2.484e-07 3.721e-09 -1.00e-01 4.420e-11 3.001e-09 4.943e-11 0.000e+00 4.215e-11 1.346e-09 4.543e-11 | | [Model] ipbw_io Model_type I/O Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v
Freescale Semiconductor, Inc...
Appendix B-20
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
[Pulldown] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00 |
I(typ) -5.20e+02 -4.69e+02 -4.18e+02 -3.67e+02 -3.16e+02 -2.65e+02 -2.14e+02 -1.63e+02 -1.13e+02 -7.82e+01 -4.42e+01 -1.02e+01 -3.69e-02 -2.52e-02 -1.83e-02 -1.11e-02 -3.77e-03 3.729e-03 1.076e-02 1.723e-02 2.311e-02 2.836e-02 3.292e-02 3.675e-02 3.979e-02 4.205e-02 4.347e-02 4.413e-02 4.445e-02 4.465e-02 4.479e-02 4.492e-02 4.502e-02 4.511e-02 4.519e-02 4.526e-02 4.536e-02 4.614e-02 1.344e+00 1.783e+01 3.495e+01 5.208e+01 7.463e+01 1.002e+02 1.259e+02 1.515e+02 1.771e+02 2.027e+02 2.283e+02 2.539e+02 2.667e+02
I(min) -3.65e+02 -3.29e+02 -2.94e+02 -2.58e+02 -2.23e+02 -1.88e+02 -1.52e+02 -1.17e+02 -9.24e+01 -6.87e+01 -4.51e+01 -2.15e+01 -1.17e+00 -1.67e-02 -9.77e-03 -5.89e-03 -1.98e-03 1.940e-03 5.578e-03 8.907e-03 1.191e-02 1.455e-02 1.680e-02 1.862e-02 1.997e-02 2.085e-02 2.136e-02 2.162e-02 2.176e-02 2.186e-02 2.194e-02 2.200e-02 2.206e-02 2.211e-02 2.219e-02 3.324e-02 2.452e+00 1.423e+01 2.615e+01 3.808e+01 5.001e+01 6.371e+01 8.154e+01 9.937e+01 1.172e+02 1.350e+02 1.529e+02 1.707e+02 1.885e+02 2.064e+02 2.153e+02
I(max)
-5.17e+02 -4.66e+02 -4.15e+02 -3.64e+02 -3.13e+02 -2.62e+02 -2.11e+02 -1.60e+02 -1.10e+02 -7.57e+01 -4.17e+01 -7.66e+00 -3.79e-02 -2.81e-02 -2.04e-02 -1.24e-02 -4.20e-03 4.177e-03 1.216e-02 1.965e-02 2.663e-02 3.305e-02 3.887e-02 4.404e-02 4.850e-02 5.223e-02 5.518e-02 5.728e-02 5.843e-02 5.899e-02 5.931e-02 5.953e-02 5.971e-02 5.986e-02 5.999e-02 6.010e-02 6.021e-02 6.032e-02 6.065e-02 8.548e-02 9.298e+00 2.640e+01 4.352e+01 6.184e+01 8.745e+01 1.131e+02 1.387e+02 1.643e+02 1.899e+02 2.155e+02 2.283e+02
Freescale Semiconductor, Inc...
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-21
Freescale Semiconductor, Inc.
IBIS Model
[Pullup] |voltage | -3.30e+00 -3.10e+00 -2.90e+00 -2.70e+00 -2.50e+00 -2.30e+00 -2.10e+00 -1.90e+00 -1.70e+00 -1.50e+00 -1.30e+00 -1.10e+00 -9.00e-01 -7.00e-01 -5.00e-01 -3.00e-01 -1.00e-01 1.000e-01 3.000e-01 5.000e-01 7.000e-01 9.000e-01 1.100e+00 1.300e+00 1.500e+00 1.700e+00 1.900e+00 2.100e+00 2.300e+00 2.500e+00 2.700e+00 2.900e+00 3.100e+00 3.300e+00 3.500e+00 3.700e+00 3.900e+00 4.100e+00 4.300e+00 4.500e+00 4.700e+00 4.900e+00 5.100e+00 5.300e+00 5.500e+00 5.700e+00 5.900e+00 6.100e+00 6.300e+00 6.500e+00 6.600e+00
I(typ) 2.667e+02 2.411e+02 2.155e+02 1.898e+02 1.642e+02 1.386e+02 1.130e+02 8.739e+01 6.178e+01 4.346e+01 2.635e+01 9.243e+00 5.536e-02 2.847e-02 2.025e-02 1.208e-02 3.994e-03 -3.88e-03 -1.11e-02 -1.76e-02 -2.35e-02 -2.86e-02 -3.30e-02 -3.65e-02 -3.92e-02 -4.12e-02 -4.26e-02 -4.36e-02 -4.43e-02 -4.49e-02 -4.54e-02 -4.58e-02 -4.61e-02 -4.65e-02 -4.68e-02 -4.70e-02 -4.73e-02 -4.81e-02 -4.00e-01 -2.72e+01 -6.12e+01 -9.52e+01 -1.37e+02 -1.88e+02 -2.39e+02 -2.90e+02 -3.41e+02 -3.92e+02 -4.43e+02 -4.94e+02 -5.20e+02
I(min) 1.885e+02 1.707e+02 1.528e+02 1.350e+02 1.172e+02 9.935e+01 8.152e+01 6.369e+01 4.999e+01 3.806e+01 2.613e+01 1.421e+01 2.435e+00 2.689e-02 1.265e-02 7.503e-03 2.474e-03 -2.38e-03 -6.76e-03 -1.06e-02 -1.40e-02 -1.69e-02 -1.93e-02 -2.10e-02 -2.22e-02 -2.29e-02 -2.35e-02 -2.38e-02 -2.42e-02 -2.44e-02 -2.47e-02 -2.49e-02 -2.50e-02 -2.52e-02 -2.54e-02 -2.99e-02 -1.19e+00 -2.15e+01 -4.51e+01 -6.87e+01 -9.24e+01 -1.17e+02 -1.52e+02 -1.88e+02 -2.23e+02 -2.58e+02 -2.94e+02 -3.29e+02 -3.65e+02 -4.00e+02 -4.18e+02
I(max) 2.667e+02 2.411e+02 2.155e+02 1.898e+02 1.642e+02 1.386e+02 1.130e+02 8.739e+01 6.178e+01 4.346e+01 2.635e+01 9.245e+00 6.260e-02 3.437e-02 2.451e-02 1.467e-02 4.868e-03 -4.76e-03 -1.37e-02 -2.20e-02 -2.95e-02 -3.63e-02 -4.23e-02 -4.75e-02 -5.17e-02 -5.51e-02 -5.77e-02 -5.97e-02 -6.11e-02 -6.22e-02 -6.31e-02 -6.38e-02 -6.44e-02 -6.49e-02 -6.54e-02 -6.58e-02 -6.62e-02 -6.66e-02 -6.72e-02 -7.21e-02 -7.70e+00 -4.17e+01 -7.57e+01 -1.10e+02 -1.60e+02 -2.11e+02 -2.62e+02 -3.13e+02 -3.64e+02 -4.15e+02 -4.41e+02
Freescale Semiconductor, Inc...
Appendix B-22
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
IBIS Model
| [GND_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.20e+02 -3.65e+02 -5.17e+02 -3.10e+00 -4.69e+02 -3.29e+02 -4.66e+02 -2.90e+00 -4.18e+02 -2.94e+02 -4.15e+02 -2.70e+00 -3.67e+02 -2.58e+02 -3.64e+02 -2.50e+00 -3.16e+02 -2.23e+02 -3.13e+02 -2.30e+00 -2.65e+02 -1.88e+02 -2.62e+02 -2.10e+00 -2.14e+02 -1.52e+02 -2.11e+02 -1.90e+00 -1.63e+02 -1.17e+02 -1.60e+02 -1.70e+00 -1.13e+02 -9.24e+01 -1.10e+02 -1.50e+00 -7.82e+01 -6.87e+01 -7.57e+01 -1.30e+00 -4.42e+01 -4.51e+01 -4.16e+01 -1.10e+00 -1.02e+01 -2.15e+01 -7.64e+00 -9.00e-01 -7.17e-03 -1.16e+00 -4.87e-03 -7.00e-01 -1.14e-04 -4.39e-03 -3.03e-04 -5.00e-01 -4.86e-07 -2.55e-05 -2.73e-06 -3.00e-01 -5.19e-10 -1.91e-07 -2.57e-09 -1.00e-01 -1.91e-11 -2.47e-09 -2.19e-11 0.000e+00 -1.68e-11 -1.17e-09 -1.84e-11 | [POWER_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 2.667e+02 1.885e+02 2.667e+02 -3.10e+00 2.411e+02 1.707e+02 2.411e+02 -2.90e+00 2.155e+02 1.528e+02 2.155e+02 -2.70e+00 1.898e+02 1.350e+02 1.898e+02 -2.50e+00 1.642e+02 1.172e+02 1.642e+02 -2.30e+00 1.386e+02 9.935e+01 1.386e+02 -2.10e+00 1.130e+02 8.152e+01 1.130e+02 -1.90e+00 8.739e+01 6.369e+01 8.739e+01 -1.70e+00 6.178e+01 4.999e+01 6.178e+01 -1.50e+00 4.346e+01 3.806e+01 4.346e+01 -1.30e+00 2.634e+01 2.613e+01 2.634e+01 -1.10e+00 9.237e+00 1.421e+01 9.237e+00 -9.00e-01 2.454e-02 2.430e+00 2.488e-02 -7.00e-01 8.741e-05 1.104e-02 2.050e-04 -5.00e-01 6.316e-07 4.079e-05 2.961e-06 -3.00e-01 8.479e-10 2.484e-07 3.721e-09 -1.00e-01 4.420e-11 3.001e-09 4.943e-11 0.000e+00 4.215e-11 1.346e-09 4.543e-11 | [Ramp] R_load = 50.00 |voltage I(typ) I(min) I(max) | | dV/dt_r 1.140/0.494 0.699/0.978 1.400/0.354 | | dV/dt_f 1.150/0.505 0.642/0.956 1.350/0.350 | |
Freescale Semiconductor, Inc...
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
Appendix B-23
Freescale Semiconductor, Inc.
IBIS Model
[Model] iexlh_i Model_type Input Polarity Non-Inverting Vinl= 0.8000v Vinh= 2.000v C_comp 5.00pF 5.00pF 5.00pF | | [Voltage Range] 3.3v 3v 3.6v [GND_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 -5.21e+02 -3.66e+02 -5.18e+02 -3.10e+00 -4.70e+02 -3.30e+02 -4.67e+02 -2.90e+00 -4.19e+02 -2.95e+02 -4.16e+02 -2.70e+00 -3.68e+02 -2.59e+02 -3.65e+02 -2.50e+00 -3.17e+02 -2.24e+02 -3.14e+02 -2.30e+00 -2.66e+02 -1.89e+02 -2.63e+02 -2.10e+00 -2.15e+02 -1.53e+02 -2.12e+02 -1.90e+00 -1.64e+02 -1.18e+02 -1.61e+02 -1.70e+00 -1.14e+02 -9.34e+01 -1.11e+02 -1.50e+00 -7.93e+01 -6.98e+01 -7.68e+01 -1.30e+00 -4.53e+01 -4.62e+01 -4.28e+01 -1.10e+00 -1.13e+01 -2.26e+01 -8.78e+00 -9.00e-01 -7.94e-03 -1.87e+00 -3.77e-03 -7.00e-01 -1.62e-06 -5.11e-03 -7.69e-07 -5.00e-01 -3.45e-10 -1.40e-05 -1.72e-10 -3.00e-01 -1.29e-11 -3.90e-08 -1.38e-11 -1.00e-01 -1.10e-11 -8.67e-10 -1.19e-11 0.000e+00 -1.01e-11 -7.13e-10 -1.10e-11 | [POWER_clamp] |voltage I(typ) I(min) I(max) | -3.30e+00 2.653e+02 1.870e+02 2.653e+02 -3.10e+00 2.398e+02 1.693e+02 2.398e+02 -2.90e+00 2.143e+02 1.516e+02 2.143e+02 -2.70e+00 1.888e+02 1.339e+02 1.888e+02 -2.50e+00 1.633e+02 1.162e+02 1.633e+02 -2.30e+00 1.378e+02 9.847e+01 1.378e+02 -2.10e+00 1.123e+02 8.076e+01 1.123e+02 -1.90e+00 8.682e+01 6.305e+01 8.682e+01 -1.70e+00 6.133e+01 4.947e+01 6.133e+01 -1.50e+00 4.313e+01 3.766e+01 4.313e+01 -1.30e+00 2.614e+01 2.585e+01 2.614e+01 -1.10e+00 9.145e+00 1.404e+01 9.145e+00 -9.00e-01 1.797e-02 2.364e+00 1.797e-02 -7.00e-01 3.667e-06 7.589e-03 3.667e-06 -5.00e-01 7.730e-10 2.072e-05 7.748e-10 -3.00e-01 2.293e-11 5.767e-08 2.476e-11 -1.00e-01 2.096e-11 1.163e-09 2.278e-11 0.000e+00 2.004e-11 9.618e-10 2.186e-11 | [End]
Freescale Semiconductor, Inc...
Appendix B-24
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
INDEX
A
ac electrical characteristics 2-4 Address Trace mode iv, 2-44, 2-47 ALU iii applications v arbitration bus timings 2-47 Arithmetic Logic Unit iii
Freescale Semiconductor, Inc...
B
benchmark test algorithm A-1, B-1 bootstrap ROM iv Boundary Scan (JTAG Port) timing diagram
83
2-
bus
address 1-2 data 1-2 multiplexed 1-2 non-multiplexed 1-2 bus acquisition timings 2-48 bus release timings 2-49, 2-50
C
case outline drawing clock external 2-5 operation 2-6 clocks internal 2-5
3-8
DMA iii DRAM out of page read access 2-41 wait states selection guide 2-33 write access 2-42 out of page and refresh timings 11 wait states 2-37 15 wait states 2-39 4 wait states 2-33 8 wait states 2-36 Page mode read accesses 2-32 wait states selection guide 2-22 write accesses 2-31 Page mode timings 1 wait state 2-23 2 wait states 2-24 3 wait states 2-27 4 wait states 2-29 refresh access 2-43 DRAM controller iv DSP programming 4-8 DSP56300 core features iii DSP56362 features iii specifications 2-1
E
electrical design considerations 4-3 Enhanced Serial Audio Interface iv ESAI iv, 1-2 ESSI receiver timing 2-75, 2-76 timings 2-71 transmitter timing 2-74 EXTAL jitter 4-6 external bus control 1-7, 1-8 external bus synchronous timings (SRAM access) 2-44 external clock operation 2-5 external interrupt timing (negative edgetriggered) 2-15
D
Data Arithmetic Logic Unit iii data memory expansion iv DAX iv, 1-2, 1-19 dc electrical characteristics 2-3 Debug support iv description, general i design considerations electrical 4-3 PLL 4-5, 4-6 power consumption 4-4 thermal 4-1 Digital Audio Transmitter iv, 1-19 Direct Memory Access iii
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
1
Freescale Semiconductor, Inc.
Index
external level-sensitive fast interrupt timing 2-15 external memory access (DMA Source) timing 2-
M
maximum ratings 2-1, 2-2 mechanical drawings 3-8 Memory Expansion Port iv Mfax system 3-8 mode control 1-9 Mode select timing 2-9 multiplexed bus 1-2 multiplexed bus timings read 2-57 write 2-58
17
External Memory Expansion Port
2-18
F
functional groups 1-2 functional signal groups
1-1
G
general description i General Purpose Input/Output GPIO iv, 1-2, 1-25 GPIO timing 2-80 Ground 1-4 PLL 1-4
iv
N
non-multiplexed bus 1-2 non-multiplexed bus timings read 2-55 write 2-56
Freescale Semiconductor, Inc...
H
HDI08 iv, 1-2, 1-11, 1-12, 1-14, 1-15 DSP programming 4-8 DSP synchronization 4-8 Host synchronization 4-6 HDI08 timing 2-52 Host Interface iv, 1-2, 1-11, 1-12, 1-14, Host Interface timing 2-52 host port configuration 1-11 Host Port considerations 4-6 Host programming 4-6 Host Request Double 1-2 Single 1-2
O
off-chip memory iv OnCE module timing 2-85 OnCE module iv, 1-25 Debug request 2-85 on-chip DRAM controller iv On-Chip Emulation module iv on-chip memory iv operating mode select timing 2-16 ordering drawings 3-8 ordering information 5-1
1-15
P
package 144-pin TQFP 3-1 TQFP description 3-2, 3-3 PCU iii Phase Lock Loop iii, 2-8 PLL iii, 2-8 Characteristics 2-8 performance issues 4-5 PLL design considerations 4-5, 4-6 PLL performance issues 4-6 Port A 1-2 Port B 1-2, 1-12, 1-13, 1-14, 1-15 Port C 1-2, 1-19 Port D 1-2, 1-19 power consumption benchmark test A-1, B-1 power consumption design considerations 4-4 power management v Program Control Unit iii
I
instruction cache iv internal clocks 2-5 interrupt and mode control 1-9 interrupt control 1-9 interrupt timing 2-9 external level-sensitive fast 2-15 external negative edge-triggered 2-15 synchronous from Wait state 2-16
J
Jitter 4-6 JTAG 1-25 JTAG Port iv reset timing diagram timing 2-82, 2-83
2-84
2
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Index
program memory expansion program RAM iv
iv
Digital Audio Transmitter (DAX) 2-77 Enhanced Serial Audio Interface (ESAI)
R
recovery from Stop state using IRQA 2-16, 2-17 RESET 1-10 Reset timing 2-9, 2-14 synchronous 2-14 ROM, bootstrap iv
S
Freescale Semiconductor, Inc...
Serial Host Interface iv, 1-16 SHI iv, 1-2, 1-16 signal groupings 1-1 signals 1-1 functional grouping 1-2 SRAM 2-45 Access 2-44 read access 2-21 read and write accesses 2-18 support iv write access 2-21 Stop mode v Stop state recovery from 2-16, 2-17 Stop timing 2-9 supply voltage 2-2 Switch mode iv Synchronization 4-6 synchronous bus timings SRAM 2 wait states 2-46 SRAM 1 wait state (BCR controlled) 2-45 synchronous interrupt from Wait state timing
General Purpose I/O (GPIO) Timing 2-71 OnCETM (On Chip Emulator) Timing 2-71 Serial Host Interface (SHI) SPI Protocol Timing 2-60 Serial Host Interface (SHI) Timing 2-60 timing interrupt 2-9 mode select 2-9 Reset 2-9 Stop 2-9 TQFP 3-1 pin list by number 3-3 pin-out drawing (top) 3-2 TQFP package drawing 3-8
73
2-
W
Wait mode
v iv iv
X
X data RAM
Y
Y data RAM
16
2-
synchronous Reset timing
2-14
T
TAP iv target applications v Test Access Port iv Test Access Port timing diagram 2-84 Test Clock (TCLK) input timing diagram thermal characteristics 2-2 thermal design considerations 4-1 Timer iv, 1-2, 1-25 event input restrictions 2-78 interrupt generation 2-79 timing 2-78 Timing
2-83
MOTOROLA
DSP56362 Advance Information
For More Information On This Product, Go to: www.freescale.com
3
Freescale Semiconductor, Inc.
HOW TO REACH US:
USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405 Denver, Colorado 80217 1-800-521-6274 or 480-768-2130 JAPAN: Motorola Japan Ltd. SPS, Technical Information Center 3-20-1, Minami-Azabu, Minato-ku Tokyo 106-8573, Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd. Silicon Harbour Centre 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors
Freescale Semiconductor, Inc...
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
(c) Motorola Inc. 2004
DSP56362/D Rev. 3 02/2004
For More Information On This Product, Go to: www.freescale.com


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